TSMC and Xilinx on the FinFAST Track!

TSMC and Xilinx on the FinFAST Track!
by Daniel Nenni on 06-23-2013 at 2:00 am

The power of the fabless semiconductor ecosystem never ceases to amaze me. On one hand you have the Intel backed press crowing about Intel stealing Altera from TSMC. On the other hand you have Xilinx and TSMC crowing about a new ‘one-team’ approach. If you are interested in the real story you’ve come to the right place.

“Altera’sRead More


Pat Pistilli: the first cell library, the first computer-printed label and more

Pat Pistilli: the first cell library, the first computer-printed label and more
by Paul McLellan on 06-22-2013 at 1:45 pm

At the DAC 50th anniversary banquet, Pat Pistilli won the award for most tenacious attendee, having been to all 50 DACs. Well, and for creating DAC and sustaining it. He was general chair for the first DAC (not yet called DAC) and, of course, would eventually form MP Associates with his wife Marie, which still runs DAC today. In 2010… Read More


Agilent ADS Users, Find Out About Design Data Management

Agilent ADS Users, Find Out About Design Data Management
by Paul McLellan on 06-20-2013 at 1:47 pm

In May, ClioSoft and Agilent announced that Agilent’s Advanced Design System (ADS) was now integrated with ClioSoft’s SOS Design Data Management. I interviewed Greg Peterschmidt of Agilent at that time. The information page for the combined product, known as SOS viaADS is here.

 

Next week ClioSoft is presenting… Read More


DAC by the Numbers

DAC by the Numbers
by Paul McLellan on 06-20-2013 at 12:03 pm

The attendance numbers for DAC are out. Unless you have been living under a stone you know that DAC was in Austin Texas a couple of weeks ago. Attendance was:

  • full conference passes: 1589
  • exhibits-only passes: 2364
  • booth staff: 1998

The registration is slightly lower than last year when DAC was in San Francisco (as it will be again … Read More


What does 3D IC, FinFETs, and EUV have in common?

What does 3D IC, FinFETs, and EUV have in common?
by Daniel Nenni on 06-19-2013 at 6:00 pm


They are three of the top trending terms on SemiWiki and three of the hot topics at this year’s Semicon West:

In its 43rd year, SEMICON West is the flagship annual event for the global microelectronics industry. It is the premier event for the display of new products and technologies for microelectronics design and manufacturing,Read More


Is Your Synchronizer Doing its Job (Part 1)?

Is Your Synchronizer Doing its Job (Part 1)?
by Jerry Cox on 06-18-2013 at 8:30 pm

Recently, I discussed the increasing risk of metastability hazards at nanoscale geometries. These risks are significantly aggravated at low supply voltages and low temperatures and must be addressed during the design cycle of any mission critical application. This time I discuss what it takes to estimate a synchronizer’s … Read More


Derivative Designs Need Tools Too

Derivative Designs Need Tools Too
by Paul McLellan on 06-18-2013 at 11:58 am

Increasingly, SoC designs consist of assembling blocks of pre-designed IP. One special case is the derivative design where not just the IP blocks get re-used but a lot of the assembly itself. For example, in the design below some blocks are added, some blocks are updated, some hierarchy is changed. But the bulk of the design remains… Read More


Increasing Automotive Semiconductor Test Quality

Increasing Automotive Semiconductor Test Quality
by glforte on 06-17-2013 at 4:45 pm

The growing amount of electronics within today’s automobiles is driving very high quality and reliability requirements to a widening range of semiconductor devices. At the same time, traditional fault models are becoming less effective at achieving desired silicon quality levels. Improvements in test solutions are needed… Read More


Formality Ultra, Streamline Your ECOs

Formality Ultra, Streamline Your ECOs
by Paul McLellan on 06-17-2013 at 8:00 am

One of the most challenging stages in an SoC design is achieving timing closure. Actually design closure is perhaps a better term since everything needs to come together such as clock tree, power nets, power budget and so on. Changes made to the design are known as ECOs (which stands for engineering change orders, a term that comes… Read More


Should You Buy All Aspects of Your IP From a Single Supplier?

Should You Buy All Aspects of Your IP From a Single Supplier?
by Paul McLellan on 06-16-2013 at 9:18 am

Interface IP typically consists of multiple layers, most importantly a PHY (level 1) analog (or mixed signal) block that handles the interface to the outside world and a number of levels of digital controllers. The interfaces between all these levels, especially between the PHY and the controller, is often defined by the interface… Read More