DFM at SPIE Advance Litho show

DFM at SPIE Advance Litho show
by Beth Martin on 02-09-2012 at 6:40 pm

This year’s SPIE Advanced Lithography is loaded with interesting keynotes and sessions. To help me narrow down what to see, I spoke with John Sturtevant. John is co-chair of the Design for Manufacturability through Design-Process Integration conference, and the director for technical marketing for RET products at Mentor Graphics.… Read More


Manufacturing Analysis and Scoring (MAS): GLOBALFOUNDRIES and Mentor Graphics

Manufacturing Analysis and Scoring (MAS): GLOBALFOUNDRIES and Mentor Graphics
by Daniel Payne on 09-05-2011 at 3:37 pm

Last week GLOBALFOUNDRIES and Mentor Graphics presented at the Tech Design Forum on how they collaborated on a third generation DFM flow. When I reviewed the slides of the presentation it really struck me on how the old thinking in DRC (Design Rule Checking) of Pass/Fail for layout rules had been replaced with a score represented… Read More


Third Generation DFM Flow: GLOBALFOUNDRIES and Mentor Graphics

Third Generation DFM Flow: GLOBALFOUNDRIES and Mentor Graphics
by Daniel Payne on 08-26-2011 at 11:17 am

calibre yield analyzer

Introduction
Mentor Graphics and GLOBALFOUNDRIES have been working together for several generations since the 65nm node on making IC designs yield higher. Michael Buehler-Garcia, director of Calibre Design SolutionsMarketing at Mentor Graphics spoke with me by phone today to explain how they are working with GLOBALFOUNDRIESRead More


Aug 25th in Fremont, CA – Hands on Calibre workshop: DRC, LVS, xRC, ERC, DFM

Aug 25th in Fremont, CA – Hands on Calibre workshop: DRC, LVS, xRC, ERC, DFM
by Daniel Payne on 08-18-2011 at 10:30 am

I’ve blogged about the Calibre family of IC design tools before:

Smart Fill replaced Dummy Fill Approach in a DFM Flow
DRC Wiki
Graphical DRC vs Text-based DRC
Getting Real time Calibre DRC Results with Custom IC Editing
Transistor-level Electrical Rule Checking
Who Needs a 3D Field Solver for IC Design?
Prevention is BetterRead More


Smart Fill Replaces Dummy Fill Approach in a DFM Flow

Smart Fill Replaces Dummy Fill Approach in a DFM Flow
by Daniel Payne on 07-30-2011 at 7:11 pm

I met with Jeff Wilson, Product Marketing Manager at Mentor in the Calibre product group to learn more about Smart Fill versus Dummy Fill for DFM flows. Jeff works in the Wilsonville, Oregon office and we first meet at Silicon Compilers back in the 1990’s.

Dummy Fill

This diagram shows an IC layout layer on the left as originallyRead More


Can Your Router Handle 28 nm?

Can Your Router Handle 28 nm?
by Beth Martin on 06-20-2011 at 7:11 pm

attachment

With the adoption of the 32/28 nm process node, some significant new challenges in digital routing arise—including complex design rule checking (DRC) and design for manufacturing (DFM) rules, increasing rule counts, very large (1 billion transistor) designs. To meet quality, time-to-market, and cost targets, design teams… Read More


DRC/DFM inside of Place and Route

DRC/DFM inside of Place and Route
by Daniel Payne on 03-31-2011 at 10:19 am

Intro
Earlier this month I drove to Mentor Graphics in Wilsonville, Oregon and spoke with Michael Buehler-Garcia, Director of Marketing and Nancy Nguyen, TME, both part of the Calibre Design to Silicon Division. I’m a big fan of correct-by-construction thinking in EDA tools and what they had to say immediately caught my… Read More


What Do You Mean by Mandatory?

What Do You Mean by Mandatory?
by glforte on 10-14-2010 at 6:00 pm

When TSMC and Mentor Graphics held a joint seminar for mutual customers to go over new DFM requirements at 45/40 nm, two customers basically asked the same question, “What do you mean by mandatory?” Of course, TSMC wasn’t going to stand over them and say, “Mandatory means mandatory, what part of mandatory don’t you understand?” … Read More


What Do You Mean by Mandatory?

What Do You Mean by Mandatory?
by glforte on 10-14-2010 at 6:00 pm

When TSMC and Mentor Graphics held a joint seminar for mutual customers to go over new DFM requirements at 45/40 nm, two customers basically asked the same question, “What do you mean by mandatory?” Of course, TSMC wasn’t going to stand over them and say, “Mandatory means mandatory, what part of mandatory don’t you understand?” … Read More


So, Why Not Just Write Better Rules?

So, Why Not Just Write Better Rules?
by glforte on 10-14-2010 at 4:00 pm

In my submission about TSMC making some DFM analysis steps mandatory at 45nm (see “TSMC’s DFM Announcement”), I ended with a question about why the foundries can’t just write better design rules (and rule decks) to make sure all designs yield well. Here’s my take on this complicated question.… Read More