Rigid-flex PCB Design Challenges

Rigid-flex PCB Design Challenges
by Daniel Payne on 05-07-2024 at 10:00 am

PADS Professional Design

From Zion Research I learned that the flexible electronics market was about $13.2B in 2021 and growing at a CAGR of 21%, so that was impressive. There are several factors that make rigid-flex circuit so attractive, like: space efficiency, reduced weight, enhanced reliability, improved signal integrity, streamlined assembly,… Read More


ECO Demo Update from Easy-Logic

ECO Demo Update from Easy-Logic
by Daniel Payne on 04-18-2024 at 10:00 am

EasylogicECO Design Flow

I first met Jimmy Chen from Easy-Logic at #60DAC and wrote about their Engineering Change Order (ECO) tool in August 2023. Recently we had a Zoom call so that I could see a live demo of their EDA tool in action. Allen Guo, the AE Manager for Easy-Logic gave me an overview presentation of the company and some history to provide a bit of context.… Read More


Empyrean Technology‘s Complete Design Solution for PMIC

Empyrean Technology‘s Complete Design Solution for PMIC
by Daniel Nenni on 11-28-2021 at 6:00 am

PMIC Design SemiWIki

Power management integrated circuits (PMICs) are integrated circuits for power management. Driven by the strong demand in consumer electronics, IoT, and the automobile industry, the design for PMIC is getting more challenging in terms of integration, reliability and efficiency. The design methodology needs to be updated… Read More


Symmetry Requirements Becoming More Important and Challenging

Symmetry Requirements Becoming More Important and Challenging
by Tom Simon on 08-24-2021 at 10:00 am

Symmetry across the design flow

Humans certainly have always had an aesthetic preference for symmetry. We also see symmetry showing up frequently in nature. The importance of symmetry in electronic designs has been apparent for decades. There are a host of analog structures that require balanced layout. For instance, these include differential pairs and … Read More


EDA in the Cloud – Now More Than Ever

EDA in the Cloud – Now More Than Ever
by Kalar Rajendiran on 07-27-2021 at 10:00 am

Screen Shot 2021 07 14 at 4.32.16 PM

A decade ago, many of us heard commentaries on how entrepreneurs were turned down by venture capitalists for not including a cloud strategy in their business plan, no matter what the core business was. Humorous punchlines such as, “It’s cloudy without any clouds” and “Add some cloud to your strategy and your future will be bright… Read More


Calibre DFM Adds Bidirectional DEF Integration

Calibre DFM Adds Bidirectional DEF Integration
by Tom Simon on 01-26-2021 at 6:00 am

Siemens EDA DFM flow

GDS and LEF/DEF each came about to support data exchange in different types of design flows, custom layout and place & route respectively. GDS (or stream format) was first created in the late 1970s to support the first generation of custom IC layout tools, such as Calma’s GDSII system. Of course, the GDS format has been updated… Read More


Electronics Design for Manufacturability (DfM): Avoiding Failure After Reflow

Electronics Design for Manufacturability (DfM): Avoiding Failure After Reflow
by Admin on 06-15-2020 at 5:16 am

June 18, 2020

11:00 AM (EDT)

Venue:
Online

In the electronics industry, the capability of manufacturing suppliers greatly impacts the quality and reliability of any product. Manufacturing issues are one of the top reasons that companies fail to meet warranty expectations. Both process and design can play critical roles during

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Saving Time in Physical Verification by Reusing Metadata

Saving Time in Physical Verification by Reusing Metadata
by Daniel Payne on 01-08-2020 at 10:00 am

voltage propagation cross reference data min

Physical verification is an important and necessary step in the process to tapeout an IC design, and the foundries define sign-off qualification steps for:

  • Physical validation
  • Circuit validation
  • Reliability verification

This sounds quite reasonable until you actually go through the steps only to discover that some of the … Read More


Tools for Advanced Packaging Design Follow Moore’s Law, Too!

Tools for Advanced Packaging Design Follow Moore’s Law, Too!
by Tom Dillinger on 06-05-2017 at 9:00 am

There is an emerging set of advanced packaging technologies that enables unique product designs, with the capability to integrate multiple die, from potentially heterogeneous technologies. These “system-in-package” (SiP) offerings provide architects with the opportunity to optimize product performance, power, cost,… Read More


Noise, The Need for Speed, and Machine Learning

Noise, The Need for Speed, and Machine Learning
by Riko Radojcic on 05-08-2017 at 7:00 am

Technology trends make the concerns with electronic noise a primary constraint that impacts many mainstream products, driving the need for “Design-for-Noise” practices. That is, scaling, and the associated reduction in the device operating voltage and current, in effect magnifies the relative importance of non-scalableRead More