Power management integrated circuits (PMICs) are integrated circuits for power management. Driven by the strong demand in consumer electronics, IoT, and the automobile industry, the design for PMIC is getting more challenging in terms of integration, reliability and efficiency. The design methodology needs to be updated… Read More
Tag: dfm
Symmetry Requirements Becoming More Important and Challenging
Humans certainly have always had an aesthetic preference for symmetry. We also see symmetry showing up frequently in nature. The importance of symmetry in electronic designs has been apparent for decades. There are a host of analog structures that require balanced layout. For instance, these include differential pairs and … Read More
EDA in the Cloud – Now More Than Ever
A decade ago, many of us heard commentaries on how entrepreneurs were turned down by venture capitalists for not including a cloud strategy in their business plan, no matter what the core business was. Humorous punchlines such as, “It’s cloudy without any clouds” and “Add some cloud to your strategy and your future will be bright… Read More
Calibre DFM Adds Bidirectional DEF Integration
GDS and LEF/DEF each came about to support data exchange in different types of design flows, custom layout and place & route respectively. GDS (or stream format) was first created in the late 1970s to support the first generation of custom IC layout tools, such as Calma’s GDSII system. Of course, the GDS format has been updated… Read More
Electronics Design for Manufacturability (DfM): Avoiding Failure After Reflow
June 18, 2020
11:00 AM (EDT)
Venue:
Online
In the electronics industry, the capability of manufacturing suppliers greatly impacts the quality and reliability of any product. Manufacturing issues are one of the top reasons that companies fail to meet warranty expectations. Both process and design can play critical roles during
Saving Time in Physical Verification by Reusing Metadata
Physical verification is an important and necessary step in the process to tapeout an IC design, and the foundries define sign-off qualification steps for:
- Physical validation
- Circuit validation
- Reliability verification
This sounds quite reasonable until you actually go through the steps only to discover that some of the … Read More
Tools for Advanced Packaging Design Follow Moore’s Law, Too!
There is an emerging set of advanced packaging technologies that enables unique product designs, with the capability to integrate multiple die, from potentially heterogeneous technologies. These “system-in-package” (SiP) offerings provide architects with the opportunity to optimize product performance, power, cost,… Read More
Noise, The Need for Speed, and Machine Learning
Technology trends make the concerns with electronic noise a primary constraint that impacts many mainstream products, driving the need for “Design-for-Noise” practices. That is, scaling, and the associated reduction in the device operating voltage and current, in effect magnifies the relative importance of non-scalable… Read More
SPIE 2017 ASML and Cadence EUV impact on place and route
As feature sizes have shrunk, the semiconductor industry has moved from simple, single-exposure lithography solutions to increasingly complex resolution-enhancement techniques and multi-patterning. Where the design on a mask once matched the image that would be produced on the wafer, today the mask and resulting image … Read More
Mentor’s Battle of the Photonic Bulge
A few weeks back I wrote an article mentioning that Mentor Graphics has been quietly working on solutions for photonic integrated circuits (PICs) for some time now, while one of their competitors has recently established a photonics beachhead. One of the most common challenges for PIC designs is their curvilinear nature, thus… Read More