Tools for Advanced Packaging Design Follow Moore’s Law, Too!

Tools for Advanced Packaging Design Follow Moore’s Law, Too!
by Tom Dillinger on 06-05-2017 at 9:00 am

There is an emerging set of advanced packaging technologies that enables unique product designs, with the capability to integrate multiple die, from potentially heterogeneous technologies. These “system-in-package” (SiP) offerings provide architects with the opportunity to optimize product performance, power, cost,… Read More


Noise, The Need for Speed, and Machine Learning

Noise, The Need for Speed, and Machine Learning
by Riko Radojcic on 05-08-2017 at 7:00 am

Technology trends make the concerns with electronic noise a primary constraint that impacts many mainstream products, driving the need for “Design-for-Noise” practices. That is, scaling, and the associated reduction in the device operating voltage and current, in effect magnifies the relative importance of non-scalableRead More


SPIE 2017 ASML and Cadence EUV impact on place and route

SPIE 2017 ASML and Cadence EUV impact on place and route
by Scotten Jones on 04-13-2017 at 7:00 am

As feature sizes have shrunk, the semiconductor industry has moved from simple, single-exposure lithography solutions to increasingly complex resolution-enhancement techniques and multi-patterning. Where the design on a mask once matched the image that would be produced on the wafer, today the mask and resulting image … Read More


Mentor’s Battle of the Photonic Bulge

Mentor’s Battle of the Photonic Bulge
by Mitch Heins on 12-07-2016 at 4:00 pm

Image RemovedA few weeks back I wrote an article mentioning that Mentor Graphics has been quietly working on solutions for photonic integrated circuits (PICs) for some time now, while one of their competitors has recently established a photonics beachhead. One of the most common challenges for PIC designs is their curvilinear… Read More


Layout Pattern Matching for DRC, DFM, and Yield Improvement

Layout Pattern Matching for DRC, DFM, and Yield Improvement
by Tom Dillinger on 06-01-2016 at 12:00 pm

It is truly amazing to consider the advances in microelectronic process development, using 193i photolithography. The figure below is a stark reminder of the difference between the illuminating wavelength and the final imaged geometries. This technology evolution has been enabled by continued investment in mask data generation… Read More


Bridging Design Environments for Advanced Multi-Die Package Verification

Bridging Design Environments for Advanced Multi-Die Package Verification
by Tom Dillinger on 03-28-2016 at 12:00 pm

This year is shaping up to be an inflection point, when multi-die packaging technology will experience tremendous market growth. Advanced 2.5D/3D package offerings have been available for several years, utilizing a variety of technologies to serve as the package substrate, interposer material for embedding die micro-bump… Read More


Samsung: the Journey to 14nm and 10nm

Samsung: the Journey to 14nm and 10nm
by Paul McLellan on 06-24-2015 at 7:00 pm

Image RemovedAt the Samsung theatre (cutely named the Samsung Open Collaboration (SoC) theater) I watched a presentation by KK Lin on using DFM to bring up their 14nm and 10nm processes. And yes, they are real. Here is a picture I took of a 14nm wafer and a 10nm wafer. Samsung announced that they would ramp 10n to volume production by… Read More


Accelerate Modern PCB Design and Manufacturing

Accelerate Modern PCB Design and Manufacturing
by Pawan Fangaria on 05-24-2015 at 12:00 pm

In modern electronic industry PCBs are required to accommodate highly dense circuits with large number of components and complex routing spaces. While the complexity is increasing, the time-to-market is decreasing. In such a scenario, there is no other option than to reduce the design time by employing innovative editing options… Read More


Experts Talk at Mentor Booth

Experts Talk at Mentor Booth
by Pawan Fangaria on 05-11-2015 at 7:00 pm

It’s less than four weeks to go at DAC 2015 and the program is final now. So I started investigating new technologies, trends, methodologies, and tools that will be unveiled and discussed in this DAC. In the hindsight of the semiconductor industry over the last year, I see 14nm technologies in the realization stage and 10nm beckoning… Read More


Growing Innovation in Modern PCB Design Tools

Growing Innovation in Modern PCB Design Tools
by Pawan Fangaria on 04-26-2015 at 7:00 am

In last 30+ years, the electronic design industry has seen rapid changes more than any other industry. The change has taken place in the whole electronic ecosystem including semiconductor technology, transistor design, IC / SoC design, PCB, and system design. Today, a PCB can be very complex connecting several heterogeneous… Read More