Convergence Between EDA and MCAD and Industrial Software

Convergence Between EDA and MCAD and Industrial Software
by Bernard Murphy on 07-25-2023 at 6:00 am

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Cadence hosted a panel at DAC on how EDA, MCAD and industrial software have come together, a topic I always find interesting. Many years ago, I worked on a NAVAIR contract bid team, an eye-opener for a young engineer who thought that innovation started and ended with electronic design. I remember CATIA (3D modeling) being a component… Read More


The Increasing Gaps in PLM Systems with Handling Electronics

The Increasing Gaps in PLM Systems with Handling Electronics
by Rahul Razdan on 10-10-2022 at 6:00 am

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Product LifeCycle Management (PLM) systems have shown incredible value for integrating the enterprise with a single view of the product design, deployment, maintenance, and end-of-life processes.  PLM systems have traditionally grown from the mechanical design space, and this still forms their strength.

Meanwhile, due… Read More


Executable Specifications Shorten Embedded System Development

Executable Specifications Shorten Embedded System Development
by Tom Simon on 08-09-2021 at 10:00 am

CATIA STIMULUS for Specifications

Even though AI is being used to replace procedural coding for many embedded applications, there is still, and will be for a long time, code that is written manually to deal with complicated inputs to control connected systems. Even in AI based systems there are programmer coded steps for responses to AI identified inputs. All of … Read More


Fully Modeling the Semiconductor Manufacturing Process

Fully Modeling the Semiconductor Manufacturing Process
by Tom Simon on 07-14-2021 at 10:00 am

Modeling the Semiconductor Manufacturing Process

A lot of folks in the semiconductor business are familiar with Dassault Systèmes because of their product life cycle management (PLM) products for IC design. They are, of course well known in other industries as well for their 3D modeling and simulation software. Over the years they have added capabilities and intelligence to … Read More


Chapter Ten – Design Automation for Systems

Chapter Ten – Design Automation for Systems
by Wally Rhines on 09-13-2019 at 6:00 am

Electronic design automation has evolved to an extent that the complex chips with tens of billions of transistors frequently produce first pass functional prototypes from the manufacturer.  What makes this so incredible is that such a small portion of the possible states of electronic operation are actually tested in the simulation… Read More


Delivering Innovation for Regulated Markets

Delivering Innovation for Regulated Markets
by Daniel Nenni on 02-25-2019 at 7:00 am

When delivering devices to markets that require heavily audited compliance it is necessary to document and demonstrate development processes that follow the various standard(s) such as IEC65108, IATF16949, ISO26262.

For complex multi-disciplinary designs this can be difficult as they are often developed by multiple teams… Read More


Enabling a New Semiconductor Revolution!

Enabling a New Semiconductor Revolution!
by Daniel Nenni on 10-09-2017 at 7:00 am

According to semiconductor trade statistics, 2017 will be the strongest market since 2010 easily recording double digit gains causing the SOX Semiconductor Index to outpace NASDAQ and the other indexes. The question Wall Street people have now is: How much longer will semiconductors be an attractive investment? That question… Read More


LETI Day 2016 : Security in Lyon, Sensor at Semicon West on July 12th

LETI Day 2016 : Security in Lyon, Sensor at Semicon West on July 12th
by Eric Esteve on 07-03-2016 at 8:00 pm

It was the very first time I attended the LETI days, even if I know the research center for many years. LETI was created in the 60’s, as the subsidiary of the CEA (France agency in charge of Atomic Energy) in charge of Microelectronic. Now, for more than 50 years, 2000 research engineers are working to develop technologies, systems … Read More


How to Deal With Seven Design Closure Issues

How to Deal With Seven Design Closure Issues
by Tom Simon on 05-02-2016 at 12:00 pm

The challenge of tracking design progress is a shared problem for individual designers, team leaders, and project managers. At each level the ability to step back from just reviewing error log files and seeing the arc of the whole design as it moves forward is valuable. The difficulty of seeing the whole picture is exacerbated when… Read More


The Mechanical Reliability of IC Packages

The Mechanical Reliability of IC Packages
by Daniel Payne on 01-31-2016 at 12:00 pm

At Intel back in the late 1970’s we were designing DRAM chips and mounting them in ceramic and plastic packages, however there were problems when some of the die would crack inside of the package because of thermal mismatch issues with how the die was attached to the heat spreader inside the package. Back then we really didn’t… Read More