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Dan is joined by Philippe Luc, director of verification at Codasip. Philippe has spent over 20 years in verification which includes an extensive and successful career at Arm. Philippe gained engineering experience with a list of significant achievements during his time there, including:
– Design and verification… Read More
With Intel’s exit from smartphone processor market, the competitive zones are redefined with its rivalry with ARM. Is ARM’s domination the only reason for Intel’s exit? With no competing architecture, is ARM a monopoly in smartphone processor IP market? What are the new areas of competition between ARM and Intel? I will attempt… Read More
GLOBALFOUNDRIES has been evangelizing their 22FDX FD-SOI process for a few months; readers may have seen Tom Simon’s write-up of their preview at ARM TechCon. Dr. Joerg Winkler recently gave an updated webinar presentation of their approach in an implementation of ARM Cortex-A17 core.
By now, you’ve probably heard that 22FDX… Read More
4K UHD TVs were all dressed up at CES 2014 with no content to show. The good news for the 2014 holiday season is the industry has converged on one set of standards for display, interfacing, and encoding, so consumers should not be left marooned in an instant replay of the 3DTV hype-crash cycle. It may be a bit longer before everyone can… Read More
In today’s environment of semiconductor design, SoCs are crammed with various IPs with multiple functionalities and processors integrated together. In such an event it has become necessary to model the system and verify on Virtual Platform before getting into actual design and fabrication. And that requires modelling of each… Read More
Interconnect plays a significant role in the semiconductor design of a SoC; if not architected and handled well, it can lead to an overdesigned SoC impacting on its power, performance and area. Since a SoC generally contains multiple IPs requiring different data paths to satisfy varying latency and performance cycles, it has … Read More
It was an interesting webinar I attended, presented by STMicroelectronicson how they are benefited in power saving and thermal dissipation by using FDSOI technology and also by using PowerArtist in their design. So, it’s an advantage from both sides – semiconductor technology and semiconductor design tool. It’s worth attending… Read More
CPAK sounds like something politicians create to collect money, but in fact it is a Carbon Performance Analysis Kit. It consists of models, reference platform, initialization software (for bare metal CPAKs) or OS binary (for Linux and Android based CPAKs). They are (or will soon be) available for ARM Cortex A9, ARM Cortex A15 and… Read More
Smart mobile SoCs: Samsungby Don Dingee on 04-19-2012 at 8:27 pmCategories: Arm, IP
There are few companies that impact the overall mobile supply chain more than Samsung. They are one of Apple’s largest suppliers, fabbing the processor and LCDs in the iPhone and iPad. They also design and fab the Exynos SoC at the heart of their own Galaxy line of phones and tablets.… Read More
Last week I had an interesting meeting with GLOBALFOUNDRIES executives Kevin Meyer and Mojy Chian. It certainly seems that GFI has turned a corner! I will be in Dresden next week for DATE 2012 and will also visit the GFI Fab there. 28nm and 20nm are on track so expect an aggressive implementation plan from GFI this year.… Read More
