With our continuing chiplet coverage I found this of great interest. I have always felt that eFPGAs and chiplets are a natural fit for the next generation of chip design and this is an excellent example. As we design with chiplets one of the challenges is verification/validation in regards to performance and interoperability. … Read More
Chiplet is a hot topic in the semiconductor world these days. So much so that if one hasn’t heard that term, the person must be living on a very isolated islet. Humor aside, products built using chiplets-based methodology have been in existence for at least some years now. Companies such as Intel, AMD, Apple and others have integrated… Read More
The emergence of chiplets as a technology is an inflection point in the semiconductor industry. The potential benefits of adopting a chiplets-based approach to implementing electronic systems are not a debate. Chiplets, which are smaller, pre-manufactured components can be combined to create larger systems, offering benefits… Read More
Traditional methods of chip design and packaging are running out of steam to fulfill growing demands for lower power, faster data rates, and higher integration density. Designers across many industries – like 5G, AI/ML, autonomous vehicles, and high-performance computing – are striving to adopt 3D semiconductor… Read More
The first chiplets focused summit took place last month. So many accomplished speakers gave keynote talks on what direction should and would the Chiplets ecosystem evolution take. Corigine presented the keynote on what direction hardware emulation should and would evolve for speeding up chiplet- based designs. During a pre-conference… Read More
Dan is joined by Nick Ilyadis, Senior Director of Product Planning at Achronix. With over 35 years of data and semiconductor engineering and manufacturing experience and 72 issued patents under his name, Nick is a recognized expert on software and hardware development and quality control.
Dan explores the emerging chiplet market… Read More
The first annual Chiplet Summit was held last week in San Jose and I must say it exceeded my expectations, but I have some advice for the participating speakers and sponsoring companies. A good portion of the content was on WHY chiplets and not HOW. I think we have progressed passed this point and if we keep dwelling on it we will delay… Read More
Dan is joined by Simon Butler, the founder and CEO of Methodics Inc, Methodics was acquired by Perforce in 2020, and he is currently the general manager of the Methodics business unit at Perforce. Methodics created IPLM as a new business segment in the enterprise software space to service the needs of IP and component based design.… Read More
Over the last few years, the design of application-specific ICs as well as high-performance CPUs and other complex ICs has hit a proverbial wall. This wall is built from several issues: first, chip sizes have grown so large that they can fill the entire mask reticle and that could limit future growth. Second, the large chip size impacts… Read More
Chiplets are a popular and trending topic in the semiconductor trade press, and I read about SoC disaggregation at shows like ISSCC, Hot Chips, DAC and others. Once an SoC is disaggregated, the next challenge is deciding on the die-to-die interconnect approach. The Open Compute Project (OCP) started 10 years ago as a way to share… Read More
