Next week it is Semicon West in the Moscone Center from Tuesday to Thursday, July 10-12th. Cadence will be on a panel session during a session entitled The 2.5D and 3D packaging landscape for 2015 and beyond. This starts with 3 short keynotes:
If we look at SoC design evolution, we have certainly successfully passed several steps: from transistor by transistor IC design using Calma up to design methodology based on the integration of 500K + gates IP like PCIe gen-3 Controller, one out of several dozens of IP integrated in today’ SoC for Set-Top-Box or Wireless Application… Read More
Mark Twain remarked that everyone talks about the weather but nobody does anything about it. 3D ICs seems to be a bit like that. Over the last couple of years there have been lots of people talking about 3D but very little that has actually been manufactured. In addition to the weather, everyone talks about Xilinx’s 3D Virtex… Read More
Cadence invited Francois Lemery of ST Microelectronics to speak at a luncheon last Monday at DAC about designing for the 20nm node using module generators. Here are my trip report notes:
Wednesday morning I attended a panel discussion with: ARM, IBM, Cadence, GLOBALFOUNDRIES and Samsung.
The panelists all sang the same song of collaboration between EDA, IP and Foundry to enable 28nm, 20nm and even 14nm.… Read More
Before going to Munich to attend to CDN-Live, I took a look at the agenda to figure out which presentations to attend, and I must say it was not so easy to choose: CDN Live agendais dense, with multiple tracks running in parallel (Custom Design, Digital Implementations, Design IP, Functional Verifications and Verification IP, PCB… Read More
Yesterday’s SEMICO IP Ecosystem Conference was well worth the time. Everybody was there: ARM, Synopsys, Cadence, Mentor Graphics, GlobalFoundries, TSMC, MIPS, Tensilica, AMD, Atrenta, Sonics, and Tabula, everybody except Intel of course. What do Intel and I have in common? We don’t play well with others…
First up was… Read More
What’s new at Cadence? Quite a bit actually. I have always been a Cadence fan, I mean really, they gave birth to modern EDA. Unfortunately, Cadence really lost me during the Avant! legal action, the Mike Fister years, and EDA360. Recently, however, Cadence has made some big changes that will definitely get them back on my good side.… Read More
We are all aware that at 28nm and below several types of complex layout effects manifest themselves into the design and pose a herculean task, with several re-spins to correct them at pre-tapeout. It’s apparent that the layout needs to be correct by construction at the very beginning during the design stage.
Collaboration between EDA, Foundry and Design was the key idea today in a webinar hosted by IBM and Cadence about 20nm custom IC design. The three presenters were:
John Stabenow, Cadence
Jeremiah Cessna, Cadence
Keith Barkley, IBM… Read More
