Emerging Requirements for Electromagnetic Crosstalk Analysis

Emerging Requirements for Electromagnetic Crosstalk Analysis
by Tom Dillinger on 02-10-2020 at 10:00 am

EM coupling wire segments

This article will describe the motivations for pursuing a new flow in the SoC design methodology.  This flow involves the extraction, evaluation, and analysis of a full electromagnetic coupling model for a complex SoC and its package environment.  The results of this analysis highlight the impact of electromagnetic coupling… Read More


ANSYS, TSMC Document Thermal Reliability Guidelines

ANSYS, TSMC Document Thermal Reliability Guidelines
by Bernard Murphy on 01-01-2020 at 6:00 am

Automotive Reliability Guide min

Advanced IC technologies, 5nm and 7nm FinFET design and stacked packaging, are enabling massive levels of integration of super-fast circuits. These in turn enable much of the exciting new technology we hear so much about: mobile gaming and ultra-high definition mobile video through enhanced mobile broadband in 5G, which requires… Read More


Achieving a Predictable SignOff in 7nm

Achieving a Predictable SignOff in 7nm
by Alex Tan on 05-14-2019 at 12:00 pm

Designing with advanced-nodes FinFETs such as 7nm node involves a more complex process than prior nodes. As secondary physical effects are no longer negligible, the traditional margin-based approach applied at various design abstraction levels is considered ineffective. Coupled with the increase of device counts, failing… Read More


Webinar: Addressing Multiphysics Challenges in 7nm FinFET Designs

Webinar: Addressing Multiphysics Challenges in 7nm FinFET Designs
by Daniel Nenni on 03-12-2019 at 7:00 am

EDA is big on growth through acquisition, being acquired many times throughout my career I know this by experience. In fact, we have a wiki that tracks EDA Mergers and Acquisitions and it is the most viewed wiki on SemiWiki.com with 101,918 views thus far.

In March of 2017 ANSYS acquired CLK Design Automation which did timing variation… Read More


Accelerating 5G Innovation and Reliability Through Simulation and Advanced FinFET Design

Accelerating 5G Innovation and Reliability Through Simulation and Advanced FinFET Design
by Camille Kokozaki on 02-14-2019 at 7:00 am

In an ANSYS seminar held at DesignCon 2019, Dr. Larry Williams, ANSYS Director of Technology, outlined how 5G design innovation can be accelerated through simulation. He posited that 5G will become a general-purpose technology that affects an entire economy, drastically alter societies and unleash a cascade of complementary… Read More


Accelerating 5G Design Innovation Through Simulation Workshop

Accelerating 5G Design Innovation Through Simulation Workshop
by Daniel Nenni on 01-22-2019 at 12:00 pm

DesignCon is coming up, kicking off the first of many industry conferences for the year. It’s at the Santa Clara Convention Center which is the best venue in Northern California. Not only is this a semiconductor crowd, it’s also a systems crowd covering chips, boards, and systems. More than 175 companies participate with an expected… Read More


Analytics and Visualization for Big Data Chip Analysis

Analytics and Visualization for Big Data Chip Analysis
by Tom Dillinger on 08-28-2018 at 12:00 pm

Designers require comprehensive logical, physical, and electrical models to interpret the results of full-chip power noise and electromigration analysis flows, and subsequently deduce the appropriate design updates to address any analysis issues. These models include: LEF, DEF, Liberty library models (including detailed… Read More


Retooling Implementation for Hot Applications

Retooling Implementation for Hot Applications
by Bernard Murphy on 05-17-2018 at 7:00 am

It might seem I am straying from my normal beat in talking about implementation; after all, I normally write on systems, applications and front-end design. But while I’m not an expert in implementation, I was curious to understand how the trending applications of today (automotive, AI, 5G, IoT, etc.) create new demands on implementation,… Read More


EDA and Semiconductor — Is There Growth In The Ecosystem?

EDA and Semiconductor — Is There Growth In The Ecosystem?
by Alex Tan on 03-07-2018 at 12:00 pm


The semiconductor industry has gone through several major transitions driven by different dynamics such as shift in business models (fab-centric to fab-less), product segmentation (system design house, IP developers) and end market applications (PC to cloud; and recently, to both automotive and Internet of Things — IOT’s,Read More


Data Security – Why It Might Matter to Design and EDA

Data Security – Why It Might Matter to Design and EDA
by Alex Tan on 02-14-2018 at 12:00 pm


According to the Economist,
The world’s most valuable resource is no longer oil, but data”.
Is this the case?Data is the by-product ofmany aspects of recent technology dynamics and is becoming the currency of today’s digital economy. All categories in Gartner’s Top10 Strategic Technology Trends for 2018 (FigureRead More