A product launch nowadays demands shorter runway. SoC designers challenges are not so much in facing the unavailability of proven design capture methodologies or IP’s that could satisfy their product requirements, but more so in orchestrating the integration of all those components to deliver the targeted functionalities… Read More
Designing with advanced-nodes FinFETs such as 7nm node involves a more complex process than prior nodes. As secondary physical effects are no longer negligible, the traditional margin-based approach applied at various design abstraction levels is considered ineffective. Coupled with the increase of device counts, failing… Read More
The famous Olympic motto Citius, Altius, Fortius, which is the Latin words for “Faster, Higher, Stronger” to a considerable degree can be adapted to our electronics industry. Traditionally the fundamental metrics we used for measuring the quality of results (QoRs) are performance, power, and area (PPA). Amidst… Read More
Last week TSMC announced the availability of its complete 5nm design infrastructure that enables SoC designers to implement advanced mobile and high-performance computing applications for the emerging 5G and AI driven markets. This fifth generation 3D FinFET design infrastructure includes technology files, PDKs (Process… Read More
The trend of AI augmentation into many facets of silicon based hardware applications is on the rise. During the CASPA press conference in Santa Clara last week, Silvaco CEO David Dutton and SiFive VP, GM Christopher Moezzi were present to share their insights.
Silvaco CEO David Dutton mentioned that we are in new era in which many… Read More
The recent growing complexity in SoC designs attributed to the increased use of embedded IP’s for more design functionalities, has imposed a pressing challenge to the post-silicon bring-up process and impacting the overall product time-to-market.
According to data from Semico Research, more than 60% of design starts contain… Read More
IC physical design (PD) teams face several challenges while dealing with tapeout schedules. With shrinking process nodes and stringent PPA targets, the complexity of physical design flows and EDA design tools has increased multifold. In addition the amount of design data that needs to be managed has also increased exponentially.… Read More
The surge of network traffic at the data centers has driven to an increase in network bandwidth, doubling every 12-15 months according to a study conducted on Google’s data centers. The primary drivers to this uptick include the proliferation of cloud computing, more distributed storage architecture, emerging applications… Read More
Intelligence as in the term artificial intelligence (AI) involves learning or training, depending on which perspective it is viewed from –and it has many nuances. As the basis of most deep learning methods, neural network based learning algorithms have gained usage traction, when it was shown that training with deep neural network… Read More
CMP (Chemical Mechanical Planarization or also known as Chemical Mechanical Polishing) is a wafer fabrication step applied generally after a chemical deposition –intended to smoothen and to flatten (planarize) wafer surfaces with the combination of chemical and mechanical forces. Developed at IBM and since its introduction… Read More