At the SPIE Advanced Lithography Conference Imec presented several papers on EUV and Veeco presented about etching for EUV masks. I had the opportunity to see the presentations and speak with some of the authors. In this article I will summarize the key issues around EUV based on this research.
EUV is ramping up into high volume 7nm… Read More
At the SPIE Advanced Lithography Conference ASML gave an update on both the current 0.33NA system and the 0.55 high-NA system development. I saw the presentations and got to sit down with Mike Lercel (Director of Strategic Marketing).… Read More
Last week I attended the 2019 SPIE Advanced Lithography Conference. I gave two presentations, attended dozens of papers and conducted three interviews. I will be doing some detailed write ups particularly on EUV but I am waiting for the presentations from several of the papers. In the mean time I thought I would put some overall … Read More
I was asked to present at Nikon’s LithoVision event again this year. LithoVision is held the day before the SPIE Advanced Lithography Conference also in San Jose. The following is a write up of my talk.… Read More
At SemiWiki we usually don’t write about the press releases we are sent. However, a recent press release by eSilicon caught my eye and prompted me to call Mike Gianfagna, eSilicon Vice President of Marketing. The press release is not just about one thing, rather it focuses on a number of interesting things that together show their… Read More
The semiconductor foundry business has gone through a dynamic transformation over the last 30 years. In the beginning the foundries were several process nodes behind the IDMs with little hope of catching up. Today the foundries are leading the process development race at 10nm – 7nm, and will continue to do so, absolutely.… Read More
At IEDM this December Imec presented “Interconnect metals beyond copper – reliability challenges and opportunities”. In addition to seeing the paper presented I had a chance to interview one of the authors, Kristof Croes. Replacements for copper are a hot subject and I will summarize the challenges and Imec’s work.… Read More
At IEDM last week Anthony (Tony) Yen, Vice President and Head, Technology Development Centers Worldwide for ASML presented a paper entitled “EUV Lithography at Threshold of High-Volume Manufacturing” authored by Anthony Yen, Hans Meiling, and Jos Benschop. At IEDM I had a chance to sit down with Tony and discuss the paper and … Read More
Semiconductor equipment vendor ranking, which didn’t change much between 2016 and 2017, is undergoing a makeover, as Lam Research, ASML, and Tokyo Electron (TEL) are switching places and top-ranked Applied Materials is getting closer to losing its number one ranking.
Since the 1990s, Applied Materials has been the market leader… Read More
When TSMC’s annual Open Innovation Platform Exposition takes place, you know it will be time to hear about designs starting on the most advanced nodes. This year we were hearing about 7nm and 5nm. These newer nodes present even more challenges than previous nodes due to many factors. Regardless of what kind of design you are undertaking… Read More
