400G Ethernet test chip tapes-out at 7nm from eSilicon

400G Ethernet test chip tapes-out at 7nm from eSilicon
by Tom Simon on 05-24-2019 at 10:00 am

Since the beginning of May eSilicon has announced the tape-out of three TSMC 7nm test chips. The first of these, a 7nm 400G Ethernet Gearbox/Retimer design, caught my eye and I followed up with Hugh Durdan, their vice president of strategy and products, to learn more about it. Rather than just respin their 56G SerDes, they decided… Read More


An evolution in FPGAs

An evolution in FPGAs
by Tom Simon on 05-24-2019 at 5:00 am

Why does it seem like current FPGA devices work very much like the original telephone systems with exchanges where workers connected calls using cords and plugs? Achronix thinks it is now time to jettison Switch Blocks and adopt a new approach. Their motivation is to improve the suitability of FPGAs to machine learning applications,… Read More


TSMC and Samsung 5nm Comparison

TSMC and Samsung 5nm Comparison
by Scotten Jones on 05-03-2019 at 7:00 am

Samsung and TSMC have both made recent disclosures about their 5nm process and I though it would be a good time to look at what we know about them and compare the two processes.

A lot of what has been announced about 5nm is in comparison to 7nm so we will first review 7nm.

7nm
Figure 1 compares Samsung’s 7LPP process to TSMC’s 7FF and 7FFP… Read More


SPIE Advanced Lithography Conference – Imec and Veeco on EUV

SPIE Advanced Lithography Conference – Imec and Veeco on EUV
by Scotten Jones on 04-19-2019 at 12:00 pm

At the SPIE Advanced Lithography Conference Imec presented several papers on EUV and Veeco presented about etching for EUV masks. I had the opportunity to see the presentations and speak with some of the authors. In this article I will summarize the key issues around EUV based on this research.

EUV is ramping up into high volume 7nm… Read More


SPIE Advanced Lithography Conference – ASML EUV Update

SPIE Advanced Lithography Conference – ASML EUV Update
by Scotten Jones on 03-23-2019 at 12:00 am

At the SPIE Advanced Lithography Conference ASML gave an update on both the current 0.33NA system and the 0.55 high-NA system development. I saw the presentations and got to sit down with Mike Lercel (Director of Strategic Marketing).… Read More


SPIE Advanced Lithography Conference 2019 Overall Impressions

SPIE Advanced Lithography Conference 2019 Overall Impressions
by Scotten Jones on 03-05-2019 at 6:00 am

Last week I attended the 2019 SPIE Advanced Lithography Conference. I gave two presentations, attended dozens of papers and conducted three interviews. I will be doing some detailed write ups particularly on EUV but I am waiting for the presentations from several of the papers. In the mean time I thought I would put some overall … Read More


LithoVision 2019 – Semiconductor Technology Trends and their impact on Lithography

LithoVision 2019 – Semiconductor Technology Trends and their impact on Lithography
by Scotten Jones on 03-01-2019 at 12:00 pm

I was asked to present at Nikon’s LithoVision event again this year. LithoVision is held the day before the SPIE Advanced Lithography Conference also in San Jose. The following is a write up of my talk.… Read More


eSilicon Expands Expertise in 7nm

eSilicon Expands Expertise in 7nm
by Tom Simon on 02-26-2019 at 12:00 pm

At SemiWiki we usually don’t write about the press releases we are sent. However, a recent press release by eSilicon caught my eye and prompted me to call Mike Gianfagna, eSilicon Vice President of Marketing. The press release is not just about one thing, rather it focuses on a number of interesting things that together show their… Read More


Samsung vs TSMC 7nm Update

Samsung vs TSMC 7nm Update
by Daniel Nenni on 01-02-2019 at 7:00 am

The semiconductor foundry business has gone through a dynamic transformation over the last 30 years. In the beginning the foundries were several process nodes behind the IDMs with little hope of catching up. Today the foundries are leading the process development race at 10nm – 7nm, and will continue to do so, absolutely.… Read More


IEDM 2018 Imec on Interconnect Metals Beyond Copper

IEDM 2018 Imec on Interconnect Metals Beyond Copper
by Scotten Jones on 12-28-2018 at 7:00 am

At IEDM this December Imec presented “Interconnect metals beyond copper – reliability challenges and opportunities”. In addition to seeing the paper presented I had a chance to interview one of the authors, Kristof Croes. Replacements for copper are a hot subject and I will summarize the challenges and Imec’s work.… Read More