As a result of extensive focus on the development of workfunction metal (WFM) deposition, lithography, and removal, both FinFET and gate-all-around (GAA) devices will offer a wide range of Vt levels for advanced process nodes below 7nm.
Cell library and IP designers rely on the availability of nFET and pFET… Read More
I have written a lot of articles looking at leading edge processes and comparing the process density. One comment I often get are that the process density numbers I present do not correlate with the actual transistor density on released products. A lot of people want to draw conclusions an Intel’s processes versus TSMC’s processes… Read More
Recently Seeking Alpha published an article “Taiwan Semiconductor Manufacturing Company Losing Its Process Leadership To Intel” and Dan Nenni (SemiWiki founder) asked me to take a look at the article and do my own analysis. This is a subject I have followed and published on for many years.
Before I dig into specific process density… Read More
I couldn’t attend the SPIE Advanced Lithography Conference this year for personal reasons, but last week Mike Lercel of ASML was nice enough to walk me through the major ASML presentations from the conference.
In late 2018, Samsung and TSMC introduced 7nm foundry logic processes with 5 to 7 EUV layers, throughout … Read More
Each year on the Sunday before the SPIE Advanced Lithography Conference, Nikon holds their LithoVision event. This year I had the privilege of being invited to speak for the third consecutive year, unfortunately, the event had to be canceled due to concerns over the COVID-19 virus but by the time the event was canceled I had already… Read More
IBM and Leti each presented several papers at IEDM including a joint nanosheet paper. I had the opportunity to sit down with Huiming Bu, director of advanced logic & memory tech and Veeraraghavan Basker, senior engineer from IBM and then in a separate interview Francois Andrieu, head of advanced CMOS laboratory and Shay Reboh,… Read More
On Tuesday night of IEDM, Applied Materials held a panel discussion “The Future of Logic: EUV is Here, Now What?”. The panelists were: Regina Freed, managing director at Applied Materials as the moderator, Geoffrey Yeap, senior director of advanced technology at TSMC, Bala Haran, director of silicon process research at IBM, … Read More
IEDM is in my opinion the premiere conference for information on state-of-the-art semiconductor processes. In “My Top Three Reasons to Attend IEDM 2019” article I singled out the TSMC 5nm paper as a key reason to attend.
IEDM is one of the best organized conferences I attend and as soon as you pick up your badge you are handed a memory… Read More
TSMC puts up solid QTR, Capex increase for 5NM and capacity increase, 5G/mobile remains driver- HPC good 7NM, 27% of revs- Very nice margins!
In line quarter-Good guide
TSMC reported revenues of $9.4B and EPS of $0.62 , more or less in line with expectations, perhaps a touch below ” whisper” expectations which had been… Read More
In early May of this year, eSilicon announced the tape-out of a test chip which included the latest additions to its neuASIC™ IP platform. At the upcoming Hot Chips Symposium to be held at Stanford on August 19 and 20, 2019, eSilicon will be demonstrating the software component of this AI-enabling IP platform. At the event, eSilicon… Read More