Tag: 5g

Webinar – From Acoustic Wave Filters to RF Front-End Modules: Patent Trends Shaping 5G/6G Connectivity

Webinar – From Acoustic Wave Filters to RF Front-End Modules: Patent Trends Shaping 5G/6G Connectivity
by Admin on 05-12-2026 at 1:36 am

As 5G and future 6G networks increase RF front-end complexity, acoustic wave filters and RF front-end modules are facing growing demands for higher frequency operation, wider bandwidth, lower losses, better thermal stability and deeper integration. Based on KnowMade’s latest analyses of RF Acoustic Wave Filters and RF … Read More

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From Satellites to 5G: Ceva’s PentaG-NTN™ Lowers Barriers for Terminal Innovators

From Satellites to 5G: Ceva’s PentaG-NTN™ Lowers Barriers for Terminal Innovators
by Daniel Nenni on 03-05-2026 at 8:00 am
Categories: Ceva, IP

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Ceva, Inc., a leading provider of silicon and software IP for the Smart Edge, has unveiled PentaG-NTN™, its groundbreaking 5G Advanced modem IP subsystem tailored for satellite user terminals in Low Earth Orbit (LEO) and Medium Earth Orbit (MEO) constellations. Announced at Mobile World Congress 2026 in Barcelona on March 3,… Read More

Webinar: Intelligent Networks: Power, Reliability & Maintenance in Telecom

Webinar: Intelligent Networks: Power, Reliability & Maintenance in Telecom
by Admin on 02-10-2026 at 10:18 am

About

As global connectivity demands surge, network infrastructure hardware is under unprecedented pressure to deliver higher performance, lower latency, and greater energy efficiency, while remaining cost-effective and reliable. This challenge is compounded with the explosive growth of AI applications, emerging 5G… Read More

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EDA AI agents will come in three waves and usher us into the next era of electronic design

EDA AI agents will come in three waves and usher us into the next era of electronic design
by Admin on 05-15-2025 at 10:00 am
Categories: AI, EDA, Siemens EDA

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Author: Niranjan Sitapure, AI Product Manager, Siemens EDA

We are at a pivotal point in Electronic Design Automation (EDA), as the semiconductors and PCB systems that underpin critical technologies, such as AI, 5G, autonomous systems, and edge computing, grow increasingly complex. The traditional EDA workflow, which includes… Read More

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Ceva-XC21 and Ceva-XC23 DSPs: Advancing Wireless and Edge AI Processing

Ceva-XC21 and Ceva-XC23 DSPs: Advancing Wireless and Edge AI Processing
by Kalar Rajendiran on 03-25-2025 at 6:00 am
Categories: 5G, AI, Ceva, IP

Cellular Evolution

Ceva recently unveiled its XC21 and XC23 DSP cores, designed to revolutionize wireless communications and edge AI processing. These new offerings build upon the Ceva-XC20 architecture, delivering unmatched efficiency, scalability, and performance for 5G-Advanced, pre-6G, and smart edge applications. As demand grows … Read More

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Powering the Future: How Engineered Substrates and Material Innovation Drive the Semiconductor Revolution

Powering the Future: How Engineered Substrates and Material Innovation Drive the Semiconductor Revolution
by Kalar Rajendiran on 03-03-2025 at 6:00 am
Categories: 3D IC, 5G, AI, Automotive, Chiplet, FD-SOI, Foundries, Lithography, Mobile, Soitec

Substrate Vision Summit Engineered Substrate Panel Session

Engineered substrate technology is driving an evolution within the semiconductor industry. As Moore’s Law reaches its limits, the focus is shifting from traditional planar wafer scaling to innovative material engineering and 3D integration. Companies like Soitec, Intel and Samsung are pioneering this transition, unlocking… Read More

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Soitec: Materializing Future Innovations in Semiconductors

Soitec: Materializing Future Innovations in Semiconductors
by Kalar Rajendiran on 02-20-2025 at 6:00 am
Categories: 5G, AI, Automotive, FD-SOI, Foundries, Quantum Computing, Silicon Photonics, Soitec

ESG in the DNA of Soitec

The semiconductor industry continues to evolve rapidly to meet the escalating demands for speed, power efficiency, and miniaturization. As traditional silicon-based technologies reach their physical and performance limits, engineered substrates and advanced material innovation have emerged as pivotal drivers of the… Read More

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CEO Interview: Anders Storm of Sivers Semiconductors

CEO Interview: Anders Storm of Sivers Semiconductors
by Daniel Nenni on 08-16-2024 at 6:00 am
Categories: CEO Interviews

Anders Storm Sivers

Anders Storm is the CEO of Sivers Semiconductors. Under his almost decade-long leadership, the company has experienced significant growth, solidifying its position as a key player in the global semiconductor industry. With expertise in wifi communications, 5G, and photonics, he drives the company’s corporate strategy, … Read More

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A Modeling, Simulation, Exploration and Collaborative Platform to Develop Electronics and SoCs

A Modeling, Simulation, Exploration and Collaborative Platform to Develop Electronics and SoCs
by Daniel Payne on 03-26-2024 at 10:00 am
Categories: IP, Mirabilis Design

Demo Chiplet System with CPU, DSP, GPU, IO, AI

During the GOMACTech conference held in South Carolina last week I had a Zoom call with Deepak Shankar, Founder and VP Technology at Mirabilis Design Inc. to ask questions and view a live demo of VisualSim – a modeling, simulation, exploration and collaborative platform to develop electronics and SoCs. What makes VisualSim so … Read More

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Mastering Mixed-Signal Verification with Siemens Symphony Platform

Mastering Mixed-Signal Verification with Siemens Symphony Platform
by Daniel Payne on 01-17-2024 at 10:00 am
Categories: EDA, Siemens EDA

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Digital design and verification is well understood by EDA vendors and IC designers, however mixed-signal design and verification is more challenging, because the continuous nature of analog signals requires more compute resources and specialized design skills. Siemens EDA has a unique offering in what they call Symphony… Read More