The 2026 Ceva Edge Symposium will bring together engineers, technology leaders, ecosystem partners, and innovators to explore a major shift in computing: moving artificial intelligence from distant cloud infrastructure into the devices that interact directly with the physical world. Scheduled for November 2 in Hsinchu,… Read More
Tag: 5g
Webinar: From Waveforms to AI: Simulating 6G Before It Exists (America’s Session)
September 24, 2026 | 10:00 AM PDT
6G standardization is accelerating: 3GPP RAN1 is actively evaluating candidate waveforms, new duplexing schemes, and advanced channel coding proposals, with each organization running proprietary simulators under subtly different assumptions. This makes direct comparison of results nearly
Arteris at DAC 2026 Connecting Innovation for Silicon Success
The semiconductor industry has entered a new era as AI workloads, chiplets, heterogeneous computing, software-defined vehicles, and intelligent edge devices are transforming how chips are designed.
Silicon success is no longer determined by transistor counts alone, but by how efficiently data moves across increasingly… Read More
From Satellites to 5G: Ceva’s PentaG-NTN™ Lowers Barriers for Terminal Innovators
Ceva, Inc., a leading provider of silicon and software IP for the Smart Edge, has unveiled PentaG-NTN™, its groundbreaking 5G Advanced modem IP subsystem tailored for satellite user terminals in Low Earth Orbit (LEO) and Medium Earth Orbit (MEO) constellations. Announced at Mobile World Congress 2026 in Barcelona on March 3,… Read More
EDA AI agents will come in three waves and usher us into the next era of electronic design
Author: Niranjan Sitapure, AI Product Manager, Siemens EDA
We are at a pivotal point in Electronic Design Automation (EDA), as the semiconductors and PCB systems that underpin critical technologies, such as AI, 5G, autonomous systems, and edge computing, grow increasingly complex. The traditional EDA workflow, which includes… Read More
Ceva-XC21 and Ceva-XC23 DSPs: Advancing Wireless and Edge AI Processing
Ceva recently unveiled its XC21 and XC23 DSP cores, designed to revolutionize wireless communications and edge AI processing. These new offerings build upon the Ceva-XC20 architecture, delivering unmatched efficiency, scalability, and performance for 5G-Advanced, pre-6G, and smart edge applications. As demand grows … Read More
Powering the Future: How Engineered Substrates and Material Innovation Drive the Semiconductor Revolution
Engineered substrate technology is driving an evolution within the semiconductor industry. As Moore’s Law reaches its limits, the focus is shifting from traditional planar wafer scaling to innovative material engineering and 3D integration. Companies like Soitec, Intel and Samsung are pioneering this transition, unlocking… Read More
Soitec: Materializing Future Innovations in Semiconductors
The semiconductor industry continues to evolve rapidly to meet the escalating demands for speed, power efficiency, and miniaturization. As traditional silicon-based technologies reach their physical and performance limits, engineered substrates and advanced material innovation have emerged as pivotal drivers of the… Read More
CEO Interview: Anders Storm of Sivers Semiconductors
Anders Storm is the CEO of Sivers Semiconductors. Under his almost decade-long leadership, the company has experienced significant growth, solidifying its position as a key player in the global semiconductor industry. With expertise in wifi communications, 5G, and photonics, he drives the company’s corporate strategy, … Read More
A Modeling, Simulation, Exploration and Collaborative Platform to Develop Electronics and SoCs
During the GOMACTech conference held in South Carolina last week I had a Zoom call with Deepak Shankar, Founder and VP Technology at Mirabilis Design Inc. to ask questions and view a live demo of VisualSim – a modeling, simulation, exploration and collaborative platform to develop electronics and SoCs. What makes VisualSim so … Read More
