Yesterday was the 2013 GSA Silicon Summit, which was largely focused on contrasting what advances in delivering systems will depend on marching down the ladder of process nodes, and which will depend on innovations in packaging technology. So essentially contrasting Moore’s Law with what has come to be known as More Than… Read More
A couple of weeks ago was the 3D Architectures for Semiconductor Integration and Packagingconference in Redwood City. Cadence presented the changes that they have been making to their tool flow to enabled 2.5D (interposer-based) and true 3D TSV-based designs. You know what TSV stands for by now right? Through-silicon-via, … Read More
Late in January it is DesignCon at the Santa Clara convention center from January 28th-31st. Details are here.
On Tuesday from 11.05 to 11.45 Apache and Ansys will be presenting on Thermal Co-analysis of 3D IC/packages/system. This is being presented by a whole team of people: Stephen Pan, senior product specialist at ANSYS; Norman… Read More
There is obviously a lot going on in 3D IC these days. And I don’t mean at the micro level of FinFETs which is also a way of going vertical. I mean through-silicon-via (TSV) based approaches for either stacking die or putting them on an interposer. Increasingly the question is no longer if this technology will be viable (there… Read More
ANSYS and Apache are putting on a new series of seminars about designing future electronic systems. These are only getting more complex, of course, cramming more and more functionality into smaller portable devices with good battery life (and not getting too hot), integrating multiple antennas into a single platform, and TSV-based… Read More
At DesignCon earlier this year, Tim Hollis of Micron gave an interesting presentation on 3D memories. For sure the first applications of true 3D chips are going to be stacks of memory die and memory on logic. The gains from high bandwidth access to the memory and the physically closer distance from memory to processor are huge.
Micron… Read More
Matt Elmore of ANSYS/Apache has an interesting blog posting about thermal analysis in 3D integrated circuits. With both technical and economic challenges at process nodes as we push below 28nm, increasingly product groups are looking towards through-silicon-via (TSV) based approaches as a way of keeping Moore’s law… Read More
Next week it is Semicon West in the Moscone Center from Tuesday to Thursday, July 10-12th. Cadence will be on a panel session during a session entitled The 2.5D and 3D packaging landscape for 2015 and beyond. This starts with 3 short keynotes:
- 1.10pm to 1.25pm: Dr John Xie of Altera on Interposer integration through chip on wafer on
At the TSMC Theater Apache (don’t forget, now a subsidary of Ansys) talked about Emerging Challenges for Power, Signal and Reliability Verification on 3D-IC and Silicon Interposer Designs. The more I see about the costs and challenges of 20/22nm and below, the more I think that these 3D and 2.5D approaches are going to be … Read More
At the GSA 3D IC working group meeting, Cadence presented their perspective on 3D ICs. Their view will turn out to be important since the new chair of the 3D IC working group is going to be Ken Potts of Cadence. Once GSA decided the position could not be funded then an independent consultant like Herb Reiter had to bow out and the position… Read More