Electronic Thermal Management through Icepak

Electronic Thermal Management through Icepak
by Pawan Fangaria on 08-03-2014 at 8:30 pm

Last week my daughter was playing some games on my Google Nexus smartphone for a while when one of my friends called. When I picked up the phone, I couldn’t imagine it was so hot. There is no doubt; every electronic device today emits an order of magnitude higher heat than what it used to at most a decade ago. There is so much emphasis on … Read More


Temperature – The Fourth Aspect to Look at in SoC Design

Temperature – The Fourth Aspect to Look at in SoC Design
by Pawan Fangaria on 07-25-2014 at 2:00 pm

In my career in semiconductor industry, I can recall, in the beginning there was emphasis on design completion with automation as fast as possible. The primary considerations were area and speed of completion of a semiconductor design. Today, with unprecedented increase in multiple functions on the same chip and density of the… Read More


FD-SOI, FinFET, 3D in Monterey

FD-SOI, FinFET, 3D in Monterey
by Paul McLellan on 04-09-2014 at 5:40 pm

Last night the IEEE Silicon Valley Chapter had a panel session that was in some ways a preview of some of what will be discussed at the Electronic Design Process Symposium in Monterey next Thursday and Friday. At EDPS Herb Reiter organized a session on FinFET, 3DIC and FD-SOI (sort of how many buzzwords can you get into one set of titles).… Read More


AMD Goes 3D

AMD Goes 3D
by Paul McLellan on 12-13-2013 at 7:16 pm

I attended the 3D packaging conference in Burlingame this week. The most interesting presentation to me was by Bryan Black of AMD. He argued very convincingly that Moore’s Law is basically over for the PC microprocessor business and the way forward is going to be 3D. AMD are clearly working on all this.
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Increased… Read More


3D: Atlanta and Burlingame

3D: Atlanta and Burlingame
by Paul McLellan on 12-04-2013 at 12:44 pm

Image RemovedTwo conferences on 3D, one just over and one coming up next week. The one that was just over was hosted by Georgia Tech, the 3rd Annual Global Interposer Technology Workshop (GIT). I wasn’t there but my ex-colleague from VLSI Technology Herb Reiter was. Herb has become very much associated with all things 3D since… Read More


3DIC, the World Goes to…Burlingame

3DIC, the World Goes to…Burlingame
by Paul McLellan on 10-23-2013 at 2:09 pm

Image RemovedFor the tenth year, the big 3DIC conference takes place in the Hyatt Regency at Burlingame (just south of San Francisco Airport). Officially it is 3D Architectures for Semiconductor Integration and Packaging or ASIP. This year there have already been some significant 3D announcements: TSMC’s 3D program,… Read More


Hybrid Memory Cube Shipping

Hybrid Memory Cube Shipping
by Paul McLellan on 09-25-2013 at 4:37 pm

Image RemovedToday Micron announced that it is shipping 2GB Hybrid Memory Cube (HMC) samples. The HMC is actually 5 stacked die connected with through-silicon-vias (TSVs). The bottom die is a logic chip and is actually manufactured for Micron in an IBM 32nm process (and doesn’t have any TSVs). The other 4 die are 4Gb DRAM … Read More


TSMC’s 16FinFET and 3D IC Reference Flows

TSMC’s 16FinFET and 3D IC Reference Flows
by Paul McLellan on 09-17-2013 at 2:01 am

Today TSMC announced three reference flows that they have been working on along with various EDA vendors (and ARM and perhaps other IP suppliers). The three new flows are:

  • 16FinFET Digital Reference Flow. Obviously this has full support for non-planar FinFET transistors including extraction, quantized pitch placement, low-vdd
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3D: the Backup Plan

3D: the Backup Plan
by Paul McLellan on 09-05-2013 at 1:20 pm

Image RemovedWith the uncertainties around timing of 450mm wafers, EUV (whether it works at all and when) and new transistor architectures it is unclear whether Moore’s law as we know it is going to continue, and in particular whether the cost per transistor is going to remain economically attractive especially for consumer… Read More


SEMICON Taiwan 3D

SEMICON Taiwan 3D
by Paul McLellan on 08-08-2013 at 3:10 pm

SEMICON Taiwan is September 3rd to 6th in TWTC Nangang Exhibition Hall. Just as with Semicon West in July in San Francisco, there is lots going on. But one special focus is 3D IC. There is a 3DIC and substrate pavilion on the exhibit floor and an Advanced Packaging Symposium. Design tools, manufacturing, packaging and testing solutions… Read More