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Anyone who has read my articles about IEDM in the past know I consider it a premiere conference covering developments of leading-edge semiconductor process technology. The 2024 conference will take place in San Francisco from December 7th through 11th.
Some highlight of this year’s technical program are:
AI – Lots of artificial… Read More
Get the latest on:
- TSMC’s industry-leading HPC, smartphone, IoT, and automotive platform solutions
- TSMC’s advanced technology progress on 5nm, 4nm, 3nm, 2nm processes and beyond
- TSMC’s specialty technology breakthroughs on ultra-low power, RF, embedded memory, power management, sensor technologies, and more
- TSMC
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For the 2024 SEMI International Strategy Symposium I was challenged by members of the organizing committee to look at where logic will be in ten years from a technology, economics, and sustainability perspective. The following is a discussion of my presentation.
To understand logic, I believe it is useful to understand what makes… Read More
The world is abuzz with 3nm and 2nm technology availability. These processes offer the opportunity to pack far more on a single die than ever before. The complex digital systems contemplated will bring new AI algorithms to life and much more. But there is another side of the technology migration story. With all that digital processing… Read More
- Reports suggest Intel will get 6 of 10 ASML High NA tools in 2024
- Would give Intel a huge head start over TSMC & Samsung
- A big gamble but a potentially huge pay off
- Does this mean $4B in High NA tool sales for ASML in 2024?
News suggests Intel will get 6 of first 10 High NA tools made by ASML in 2024
An industry news source, Trendforce, reports… Read More
Anyone who has read my previous IEDM articles will know I view it as one of the best conferences on semiconductor process technology. From the tutorials, short courses and the conference papers there are so many great opportunities to keep up to date on the latest developments. The following are the conference organizers’ announcements… Read More
At SEMICON West I had a chance to catch up with Mike Lercel of ASML. In this article I am going to combine ASML presentation material from the SPIE Advanced Lithography Conference, Mike’s SEMICON presentation, my discussions with Mike at SEMICON and a few items from ASML’s recent earnings call.
DUV
ASML continues to improve DUV systems.… Read More
Intel held a webinar today to discuss their IDM2.0 internal foundry model. On the call were Dave Zinsner Executive Vice President and Chief Financial Officer and Jason Grebe Corporate Vice President and General Manager of the Corporate Planning Group.
On a humorous note, the person moderating the attendee questions sounded … Read More
On May 22nd Applied Materials announced a new development center, Equipment and Process Innovation and Commercialization Center (EPIC).
Applied Materials already operates the Maydan Technology Center (MTC), a billion-dollar development facility with over 120 advanced process tools and 80 metrology and inspection tools… Read More
The SPIE Advanced Lithography Conference was held in February. I recently had the opportunity to interview Steven Scheer, vice president of advanced patterning process and materials at imec and review selected papers that imec presented.
I asked Steve what the overarching message was at SPIE this year, he said readiness for … Read More