The TSMC Open Innovation Platform® (OIP) Ecosystem Forum brings TSMC’s design ecosystem member companies together to share with our customers real-case solutions for customers’ design challenges and success stories of best practice in TSMC’s design ecosystem.
More than 90% of the attendees last year said “this… Read More
Back in May, William Holt, EVP of technology and manufacturing at Intel gave a presentation to analysts entitled Advancing Moore’s Law, Imperatives and Opportunity. A pdf of the presentation is available here. I just saw it for the first time today and I’m not sure how to get my head around it. It starts off with a lot … Read More
As a semiconductor professional and an Apple customer I’m very interested to see what is inside the iPhone5s. Rumors are spreading, photos are leaking, creating a nice build up to the next release of the mobile device that changed the world.
Honestly, last year I was a bit disappointed with the iPhone5. Inside is the A6 SoC which uses… Read More
The power of the fabless semiconductor ecosystem never ceases to amaze me. On one hand you have the Intel backed press crowing about Intel stealing Altera from TSMC. On the other hand you have Xilinx and TSMC crowing about a new ‘one-team’ approach. If you are interested in the real story you’ve come to the right place.
“Altera’s… Read More
This completely misleading title is from a Seeking Alpha (SA) article, a stock investment version of the National Enquirer. As I mentioned inA Call to ARMs, fame and fortune seeking SA Authors make a penny per click so sensationalism sells. The article is not worth your time so I will save you the click and skip to the misguided conclusion:… Read More
As I mentioned in BDA Takes on FinFET Based Memories with AFS Mega:
Is AFS Mega real? Of course it is, I’m an SRAM guy and I worked with BDA on this product so I know. But don’t take my word for it, stay tuned for endorsements from the top SRAM suppliers around the world.
Here is the first customer endorsement from the #1 foundry.… Read More
In advanced process technologies, electrical and timing problems due to variability can become a big issue. Due to various processing effects, a circuit performance (both speed and power) is dependent on specific layout attributes and can vary a lot from instance to instance. The accumulated effects can be severe to the point… Read More
Process variation has been a top trending term since SemiWiki began as a result of the articles, wikis, and white papers posted on the Solido landing page. Last year Solido and TSMC did a webinar together, an article in EETimes, and Solido released a book on the subject. Process variation is a challenge today at 28nm and it gets worse… Read More
This was the 19[SUP]th[/SUP] annual TSMC Symposium and by far the best I have attended. Finally tired of the misinformation that plagues our industry, TSMC set the record straight with wafer and silicon correlated data. TSMC shipped more than 88 MILLION logic wafers in 2012, more than any other semiconductor company, that gives… Read More
TSMC announced today that together with ARM they have taped out the first ARM Cortex-A57 64-bit processor on TSMC’s 16nm FinFET technology. The two companies cooperated in the implementation from RTL to tape-out over six months using ARM physical IP, TSMC memory macros, and a commercial 16nm FinFET tool chain enabled by… Read More