While writing on infotainment and ADAS I sometimes wonder about the devices that make an EV run. These have nothing to do with digital or software wizardry. While logic and software play a role, the real heart of EV power is in power electronics driving motors, regenerative braking and charger options at home and on the road. Technologies… Read More
Analog Bits Leads the Way at TSMC OIP with High-Accuracy Sensors
The 15th TSMC Open Innovation Platform® (OIP) event was held recently. This event is a focal point across the industry for cutting-edge development and industry-level collaboration. Appropriately, advanced packaging, paving the way for multi-die design was a focal point for the event. You can get a good overview of what was … Read More
FD-SOI, the technology shaping the future of automotive radars
By Philippe Flatresse, Bich-Yen Nguyen, Rainer Lutz of SOITEC
I. Introduction
Automotive radar is a key enabler for the development of advanced driver assistance systems (ADAS) and autonomous vehicles. The use of radar allows vehicles to sense their environment and make decisions based on that information, enhancing… Read More
TSMC N3E is ready for designs, thanks to IP from Synopsys
TSMC has been offering foundry services since 1987, and their first 3nm node was called N3 and debuted in 2022; now they have an enhanced 3nm node dubbed N3E that has launched. Every new node then requires IP that is carefully designed, characterized and validated in silicon to ensure that the IP specifications are being met and … Read More
Synopsys – TSMC Collaboration Unleashes Innovation for TSMC OIP Ecosystem
As the focal point of the TSMC OIP ecosystem, TSMC has been driving important initiatives over the last few years to bring multi-die systems to the mainstream. As the world is moving quickly toward Generative AI technology and AI-based systems, multi-die and chiplet-based implementations are becoming essential. TSMC recently… Read More
The True Power of the TSMC Ecosystem!
The 15th TSMC Open Innovation Platform® (OIP) was held last week. In preparation we did a podcast with one of the original members of the TSMC OIP team Dan Kochpatcharin. Dan and I talked about the early days before OIP when we did reference flows together. Around 20 years ago I did a career pivot and focused on Strategic Foundry Relationships.… Read More
TSMC’s First US Fab
TSMC originally brought the pure-play foundry business to the United States in 1996 through a joint venture with customers Altera, Analog Devices, ISSI, and private investors (no government money). Altera is now part of Intel but ADI is still a top TSMC customer and enthusiastic supporter. I have seen the ADI CEO Vincent Roche … Read More
Intel Ushers a New Era of Advanced Packaging with Glass Substrates
Intel recently issued a press announcement that has significant implications for the future of semiconductors. The release announces Intel’s new glass substrate technology. The headline states: Glass substrates help overcome limitations of organic materials by enabling an order of magnitude improvement in design rules… Read More
The TSMC OIP Backstory
This is the 15th anniversary of the TSMC Open Innovation Platform (OIP). The OIP Ecosystem Forum will kick off on September 27th in Santa Clara, California and continue around the world for the next two months in person and on-line in North America, Europe, China, Japan, Taiwan, and Israel. These are THE most attended semiconductor… Read More
Soitec is Engineering the Future of the Semiconductor Industry
The crystalline structure of silicon delivers the incredible capabilities that have fueled the exponential increases defined by Moore’s Law. It turns out that silicon in its purest form will fall short at times – power handling and speed are examples. In these cases, adding additional materials to the silicon can enhance its … Read More


AI RTL Generation versus AI RTL Verification