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Foundry 2.0: Why It Is Different And Why You Should Care

Foundry 2.0: Why It Is Different And Why You Should Care
by Paul McLellan on 08-29-2013 at 5:22 pm

If you have been to an Ajit Manocha keynote recently, he talks a lot about Foundry 2.0. I covered his keynote at Semicon West in July here. Dan Hutcheson of VLSI Research interviewed Ajit about this new business model to identify it, see how it was different and see how GlobalFoundries were executing the model differently from the … Read More


Wall St. Takes the Wheel at Wintel

Wall St. Takes the Wheel at Wintel
by Ed McKernan on 08-26-2013 at 5:45 pm

It now appears that Steve Ballmer was suddenly given his walking papers at the urging of an activist investor (ValueAct) and with the concurrence of Bill Gates. Wall Street’s growing impatience tends to coincide when the Innovators Dilemma scenario has taken hold of a company that has been unable to overcome its challengers. Why… Read More


Ballmer’s Retirement Leaves Nokia High and Dry

Ballmer’s Retirement Leaves Nokia High and Dry
by Paul McLellan on 08-26-2013 at 5:36 pm

It looks to me as if Ballmer’s planned resignation from Microsoft is going to leave Nokia high and dry without an operating system. Because any successor to Ballmer will cancel Windows Phone which has managed to take Microsoft’s penetration in smartphones from 5% before it had a serious partnership with Nokia all … Read More


The TSMC OIP Technical Paper Abstracts are up!

The TSMC OIP Technical Paper Abstracts are up!
by Daniel Nenni on 08-25-2013 at 8:10 pm

The TSMC Open Innovation Platform® (OIP) Ecosystem Forum brings TSMC’s design ecosystem member companies together to share with our customers real-case solutions for customers’ design challenges and success stories of best practice in TSMC’s design ecosystem.

More than 90% of the attendees last year said “this… Read More


Intel Really is Delaying 14nm Move-in. 450mm is Slipping Too. EUV, who knows?

Intel Really is Delaying 14nm Move-in. 450mm is Slipping Too. EUV, who knows?
by Paul McLellan on 08-24-2013 at 3:23 pm

I attended the semi-annual SEMI Silicon Valley Lunch meeting last week. The semiconductor equipment people are the ones that really know what is going on. People can talk about capex numbers on conference calls but it is the equipment vendors who either do or do not get orders for particular types of equipment. In turn, the analysts… Read More


Microsoft Signals the Return of "Expensive Hardware, Cheap Software"

Microsoft Signals the Return of "Expensive Hardware, Cheap Software"
by Ed McKernan on 08-23-2013 at 12:00 pm

The announcement that Steve Ballmer will step down from Microsoft within the next 12 months and just weeks after kicking off a vast re-org focused on mobile devices can only mean that the future is coming much faster than Bill Gates or Steve Ballmer had ever expected and that without a radical adoption of hardware everywhere, it will… Read More


20nm IC production needs more than a ready Foundry

20nm IC production needs more than a ready Foundry
by Pawan Fangaria on 08-23-2013 at 11:00 am

I think by now all of us know, or have heard about 20nm process node, its PPA (Power, Performance, Area) advantages and challenges (complexity of high design size and density, heterogeneity, variability, stress, lithography complexities, LDEs and so on). I’m not going to get into the details of these challenges, but will ponder… Read More


No Mention of 14nm at the 2013 Intel Developer Forum?

No Mention of 14nm at the 2013 Intel Developer Forum?
by Daniel Nenni on 08-19-2013 at 5:00 pm

Yes, I will be going to IDF again this year, even though it is the same day as the Apple new product announcement. As a born again Apple Fan that is really saying something but Intel has done a great job of motivating the fabless semiconductor ecosystem and I thank them for that.

Unfortunately, noticeably missing from the IDF presentation… Read More


Why Adopt Hierarchical Test for SoC Designs

Why Adopt Hierarchical Test for SoC Designs
by Daniel Payne on 08-15-2013 at 4:37 pm

IC designers have been creating with hierarchy for years to better manage large design sizes, however for the test world the concept of hierarchy and emerging standards is a bit newer. TSMC and Synopsys jointly created a webinarthat addresses hierarchical test, so I’ve attended it this week and summarized my findings here.… Read More


450mm Wafers are Coming!

450mm Wafers are Coming!
by Daniel Nenni on 08-14-2013 at 8:05 pm

The presentations from the 450mm sessions at SEMICON West are up now. After talking to equipment manufacturers and the foundries I’m fairly confident 450mm wafers will be under our Christmas trees in 2016, absolutely. TSMC just increased CAPEX again and you can be sure 450mm is part of it. SEMI has a 450mm Central landing page HERERead More