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Want 10nm Wafers? That’ll Cost You

Want 10nm Wafers? That’ll Cost You
by Paul McLellan on 02-10-2013 at 9:01 pm

As you know, I’ve been a bit of a bear about what is happening to wafer costs at 20nm and below. At the Common Platform Technology Forum last week there were a number of people talking about this in presentations and at Harvey Jones’s “fireside chat”.

At the press lunch I asked about this. There are obviously… Read More


Please Help Me Understand IBM – Common Platform Technology Forum 2013

Please Help Me Understand IBM – Common Platform Technology Forum 2013
by Zvi on 02-08-2013 at 11:00 pm

“Innovations for Next Generation Scaling”

The 2013 Forum today (Feb 5, 2013) started with a presentation by Dr. Gary Patton, VP, IBM Semiconductor Research & Development Center. Gary very clearly articulated the two irresolvable challenges the industry now faces:

  • On chip interconnect
  • Lithography

These … Read More


Apple and Samsung Do It Again

Apple and Samsung Do It Again
by Paul McLellan on 02-07-2013 at 11:54 pm

The numbers are starting to come in for how everyone did in Q4. According to Cannacord Genuity, Apple made 69% of the profit and Samsung made 34%. What do you notice about those numbers? They add up to more than 100%. HTC supposedly made 1% of the profit and everyone else either broke even or lost money. Basically Apple and Samsung have… Read More


ARMs in the Clouds

ARMs in the Clouds
by Paul McLellan on 02-07-2013 at 7:10 pm

The most interesting session at the Linley Tech Data Center Conference last week was the last one, on Designing Power Efficient Servers. What this was really about was whether ARM would have any success in the server market and what Intel’s response might be.

Datacenters are now very focused on power efficiency and many track… Read More


Notes from Common Platform: Collaborate or Die

Notes from Common Platform: Collaborate or Die
by Beth Martin on 02-07-2013 at 2:16 pm

FinFETs are hot, carbon nanotubes are cool, and collaboration is the key to continued semiconductor scaling. These were the main messages at the 2013 Common Platform Technology Forum in Santa Clara.

The collaboration message ran through most presenations, like the afternoon talk by Subi Kengeri of GLOBALFOUNDRIES and Joe Sawicki… Read More


No EUV before 7nm?

No EUV before 7nm?
by Paul McLellan on 02-07-2013 at 1:31 pm

I was at the Common Platform Technology Forum this week. One of the most interesting sessions is IBM’s Gary Patton giving an overview of the state of semiconductor fabrication. Then, at lunchtime, he is one of the people that the press can question. In this post, I’m going to focus on Extreme Ultra-Violet (EUV) lithography.… Read More


Using Soft IP and Not Getting Burned

Using Soft IP and Not Getting Burned
by Daniel Payne on 02-07-2013 at 10:11 am

The most exciting EDA + Semi IP company that I ever worked at was Silicon Compilers in the 1980’s because it allowed you to start with a concept then implement to physical layout using a library of parameterized IP, the big problem was verifying that all of the IP combinations were in fact correct. Speed forward to today and our… Read More


Common Platform Technology Forum February 5th 2013 Live or Online!

Common Platform Technology Forum February 5th 2013 Live or Online!
by Daniel Nenni on 02-03-2013 at 8:00 am

Can’t make it to Santa Clara? Join us online!

The detailed 2013 CPTF agenda is now up in preparation for the February 5th event at the Santa Clara Convention Center. This is one of the rare times that you can get a free lunch! Watch this quick video to see what is in store for us this year. Dr. Paul McLellan and I will be there so please… Read More


Advanced Technology-Design-Manufacturing Co-optimization

Advanced Technology-Design-Manufacturing Co-optimization
by Daniel Nenni on 01-31-2013 at 7:00 pm

I spent some quality time with Subi Kengeri, Vice President, Technology Architecture, Office of the CTO, GLOBALFOUNDRIES in Las Vegas during CES. Great guy, he worked at Silicon Access, Virage and TSMC before GF. One thing you should know about embedded memory guys, SRAM is the first thing that goes through a new process so they … Read More


How GLOBALFOUNDRIES is Differentiating in 2013

How GLOBALFOUNDRIES is Differentiating in 2013
by Daniel Nenni on 01-27-2013 at 7:00 pm

GLOBALFOUNDRIES changed the landscape of the foundry business in 2009 with a simple but ambitious plan to become the world’s first truly global foundry. At the Common Platform Technology Forum February 5th in the Santa Clara Convention Center GF Executive Vice President Michael Noonen will give an update on how that is … Read More