Foundries and EDA vendors are cooperating at increasing levels of technical intimacy as we head to the 20nm and lower nodes. Cadence has a strong position in the EDA tools used for IC design and layout of custom and AMS (Analog Mixed-Signal) designs. They have created a series of webinars to highlight the design challenges and new… Read More
Adam Osborne Pays Wintel a Visit
The news this week that PC sales dropped by double digit percentages and to a level not seen since 2006 sent shudders down the halls of OEMs and chip suppliers. Are we entering a final death spiral as opposed to the gradual decline that most expected? Perhaps there is another explanation. From a distance, it appears that the mobile … Read More
TSMC Responds to Samsung!
This was the 19[SUP]th[/SUP] annual TSMC Symposium and by far the best I have attended. Finally tired of the misinformation that plagues our industry, TSMC set the record straight with wafer and silicon correlated data. TSMC shipped more than 88 MILLION logic wafers in 2012, more than any other semiconductor company, that gives… Read More
GlobalFoundries in Singapore
I hosted a webinar today for GlobalFoundries. Yes, I know that today was TSMC’s Technology Symposium, we weren’t that smart when we picked the date. It was basically a “fireside chat” with me as the moderator asking the questions and Paul Colestock and Aabid Husain as my guests. We actually did it at Cadence… Read More
How Long Does it Take to Go From a Muddy Field to Full 28nm Capacity?
TSMC has a lot of capacity. Not just that, it has a lot more under construction. It currently has 3 300mm Gigafabs, fabs 12,14 and 15 (there doesn’t seem to be a 13). This morning, Dr Wang, who is TSMC’s VP of 300mm operations told us about the expansion plans. Currently fab 15 phase 3 and 4, and fab 12 phase 3 are to be ramped… Read More
FinFET Design Challenges Exposed!
The first mention of FinFETs appeared on SemiWiki after the ISSCC conference in 2011. Dr. Jack Sun, TSMC Vice President of R&D and Chief Technology Officer, spoke about the power crisis the semiconductor industry is facing and FinFETs was one of the promising technologies that could help us. Since then, we have posted 100+ … Read More
TSMC to Talk About 10nm at Symposium Next Week
Given the compressed time between 20nm and 16nm, twelve months versus the industry average twenty four months, it is time to start talking about 10nm, absolutely. Next Tuesday is the 19th annual TSMC Technology Symposium keynoted of course by the Chairman, Dr. Morris Chang.
Join the 2013 TSMC Technology Symposium. Get the latest… Read More
TSMC Tapes Out First 64-bit ARM
TSMC announced today that together with ARM they have taped out the first ARM Cortex-A57 64-bit processor on TSMC’s 16nm FinFET technology. The two companies cooperated in the implementation from RTL to tape-out over six months using ARM physical IP, TSMC memory macros, and a commercial 16nm FinFET tool chain enabled by… Read More
GF, Analog and Singapore
The world is analog and despite enormous SoCs in the most leading-edge process node being the most glamorous segment of the semiconductor industry, it turns out that one of the fastest growing segments is actually analog and power chips in older process technologies. Overall, according to Semico, analog and power ICs, including… Read More
Samsung 28nm Still Does Not Yield?
As if Samsung didn’t have enough to worry about with their new neighbor to the North (Korea) declaring war, Samsung 28nm is still NOT yielding. In my previous blog “Can Samsung Deliver as Promised?” I wondered what will power the new Galaxy S4 phones that Samsung has been aggressively marketing. You would think it would be a 28nm version… Read More
Flynn Was Right: How a 2003 Warning Foretold Today’s Architectural Pivot