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Soitec’s “Engineering the Future” Event at Semicon West 2025

Soitec’s “Engineering the Future” Event at Semicon West 2025
by Daniel Nenni on 09-23-2025 at 10:00 am

Key Takeaways

  • Soitec is hosting an exclusive event titled 'Engineering the Future: Soitec Substrates Powering Technology Megatrends' on October 8, 2025, aimed at semiconductor professionals, analysts, and investors.
  • The event will feature presentations, expert panels, and networking opportunities, focusing on how Soitec's substrates address critical industry challenges related to 5G/6G, AI, and data center expansion.
  • Key topics include RF technologies for smartphones, optical interconnects in data centers, and edge AI devices, with insights from market specialists and discussions on supply chain resilience.

Image Soitec event Semicon West

As part of the broader Semicon West ecosystem in Phoenix, Arizona, Soitec, a global leader in engineered substrates for semiconductors, hosts an exclusive, invitation-style event titled Engineering the Future: Soitec Substrates Powering Technology Megatrends on Wednesday, October 8, 2025, from 2:30 PM to 6:00 PM MST.

Held at the Residence Inn by Marriott Phoenix Downtown (132 South Central Avenue, Phoenix, AZ 85004), this free, in-person gathering targets a select audience of about 50 semiconductor professionals, analysts, and investors. Spanning 3.5 hours, it blends presentations, expert panels, and networking to spotlight how Soitec’s innovative substrates are addressing critical industry challenges amid megatrends like 5G/6G connectivity, AI proliferation, and data center expansion.

The event underscores Soitec’s pivotal role in substrate engineering, which forms the foundational “canvas” for advanced chips. These materials enable higher performance, lower power consumption, and smaller form factors in next-gen devices. With the semiconductor sector facing supply chain strains, geopolitical tensions, and escalating demands for efficiency, Soitec positions its solutions—such as silicon-on-insulator (SOI) and strained silicon—as enablers for sustainable innovation. Expect deep dives into real-world applications, backed by data on market growth projections (e.g., RF markets exceeding $20B by 2030) and case studies from partners like Qualcomm and IBM.

Detailed Agenda
  • 2:30 PM – 3:00 PM: Welcome & Greetings Kick off with introductory remarks, setting the stage for Soitec’s vision in a rapidly evolving landscape. This casual opener fosters early connections among attendees.
  • 3:00 PM – 3:45 PM: Soitec Executive Insights A high-level presentation and panel featuring members of Soitec’s Executive Committee, led by CEO Paul B. Barnabé. The session introduces key technology megatrends, including the shift toward heterogeneous integration and energy-efficient computing. Barnabé, a veteran in the field, will likely highlight Soitec’s R&D investments (over €300M annually) and recent milestones, such as advancements in 300mm wafer production for AI accelerators.
  • 3:45 PM – 5:00 PM: Industry Deep Dives & Panels The core of the event: Three focused sessions with market specialists, each 30-40 minutes followed by Q&A. Topics align with high-growth areas:
    1. RF Technologies for Smartphones: Exploring substrates for next-gen filters (e.g., BAW/TC-SAW) that boost 5G/6G signal integrity, reduce interference, and support mmWave bands. Panelists may discuss Qualcomm’s integration challenges and the $15B+ RF market.
    2. Optical Interconnects in Data Centers: Addressing photonics-enabled substrates for faster, low-latency links amid AI-driven data explosion. Expect talks on silicon photonics reducing power by 50% versus copper, with insights from hyperscalers like Google.
    3. Technologies for Edge AI Devices: Focusing on substrates optimizing on-device inference for wearables, drones, and IoT—tying into themes like ultra-low power (sub-1V operation) and thermal management. This resonates with the Edge AI surge, projected to hit $100B by 2028. A culminating panel synthesizes cross-topic synergies, debating supply chain resilience and U.S. CHIPS Act implications.
  • 5:00 PM – 6:00 PM: Networking Reception Wind down with appetizers and drinks, providing ample time for one-on-one discussions. This informal segment is ideal for forging partnerships, with Soitec execs circulating to address investor queries.

Organized under Soitec’s banner (a company with 4,000+ employees and €1.2B+ revenue in FY2024), the event emphasizes actionable insights over hype. It’s not just a talk shop—attendees gain foresight into how substrates will underpin $1T+ in semiconductor value by 2030, per McKinsey estimates.

For registration, head to the Eventbrite Registration Page; spots are limited, so early RSVP is advised. Whether you’re tracking fab investments or scouting RF/AI plays, this is a prime opportunity to engage with substrate innovators shaping tomorrow’s tech stack.

About Soitec

Soitec (Euronext – Tech Leaders), a world leader in innovative semiconductor materials, has been developing cutting-edge products delivering both technological performance and energy efficiency for over 30 years. From its global headquarters in France, Soitec is expanding internationally with its unique solutions, and generated sales of 0.9 billion Euros in fiscal year 2024-2025. Soitec occupies a key position in the semiconductor value chain, serving three main strategic markets: Mobile Communications, Automotive and Industrial, and Edge and Cloud AI. The company relies on the talent and diversity of more than 2,200 employees, representing 50 different nationalities, working at its sites in Europe, the United States and Asia. Nearly 4,300 patents have been registered by Soitec.

Also Read:

How FD-SOI Powers the Future of AI in Automobiles

Powering the Future: How Engineered Substrates and Material Innovation Drive the Semiconductor Revolution

Soitec: Materializing Future Innovations in Semiconductors

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