DANVILLE CA, USA - [March 2, 2026] – Recent independent teardown and technical analyses have confirmed that the 5G mmWave antenna module powering Apple’s latest iPhone 17, iPhone 17 Pro, and iPhone 17 Pro Max relies on Fully Depleted Silicon-On-Insulator (FD-SOI) substrate technology.
Industry intelligence firms Yole Group and TechInsights recently conducted in-depth teardowns of the Qualcomm QTM565, the mmWave integrated module. According to TechInsights' study, Qualcomm HG11-34443-2 (QTM565) FR2 Tx/Rx Front End Die RFIC Process Analysis by Sharath Poikayil Satheesh and corroborated by Yole Group's component analysis, the Qualcomm QTM565 module utilizes GlobalFoundries’ 22FDX RF process, which is fundamentally built upon Soitec’s advanced FD-SOI substrates. The same die has been embedded in AiP mmW solution in the iPhone 17 which is highlighting the use of FD-SOI substrate in mmW RFIC for flagship phones.
Daniel Nenni, Founder of SemiWiki.com, said: “The findings highlight a major industry shift toward highly integrated 5G mmWave Systems-on-Chip (SoCs), where phased array element spacing and area constraints are highly critical”.
TechInsights’ executive summary points out that FD-SOI devices are uniquely engineered to operate effectively into the mmWave band, making monolithic and highly integrated phased-array transmit and receive SoCs feasible for top-tier consumer electronics.
The FD-SOI Advantage in the iPhone 17
By serving as the foundational substrate for the Qualcomm QTM565, FD-SOI technology enables fully integrated 5G mmWave SoCs. For manufacturers like Apple and Qualcomm, this technology unlocks several critical advantages:
Miniaturization and Footprint Optimization: FD-SOI offers significant logic scaling advantages over competing technologies. It allows designers to integrate baseband, control logic, and the RF front-end onto a single die, reducing the Bill of Materials (BOM), minimizing board area, and drastically cutting interconnect loss.
Best-in-Class Power Efficiency: Operating at low voltages, the platform extends battery life in mobile devices. The inherent low-noise analog devices and excellent device matching deliver peak performance without sacrificing power consumption.
Unmatched RF Performance: As proven by the silicon mmWave demonstrators mentioned in the TechInsights report, FD-SOI provides the precise engineering required for the high-frequency demands of sub-6 GHz and mmWave 5G networks.
The integration of FD-SOI technology into the flagship iPhone 17 series underscores the substrate's vital role in the future of mobile connectivity, driving the miniaturization required in modern mobile devices while ensuring extended battery life and unparalleled power efficiency.
Sources
Yole group report: https://www.reverse-costing.com/teardowns/components/unidentified_339m00418/
TechInsight report:
https://link.techinsights.com/ll6m
Qualcomm 5G mmWave antenna module QTM565 product brief:
https://www.qualcomm.com/modems/rf/products/qtm565
Soitec FD-SOI technology:
https://www.soitec.com/home/products/product-platforms/fd-soi
About SemiWiki
SemiWiki.com is the leading open forum and premier online community for semiconductor professionals. Founded in 2011, SemiWiki provides an independent platform for industry experts, engineers, and executives to share knowledge, discuss trends, and collaborate on the future of microelectronics. With a focus on Electronic Design Automation (EDA), semiconductor IP, foundries, and advanced packaging, SemiWiki delivers in-depth analysis, news, and commentary that helps shape the global semiconductor ecosystem. For more information, visit www.semiwiki.com.
Media Contact:
Grace Bonacum
gbonacum@greenoughagency.com
+1 617-275-6500
Industry intelligence firms Yole Group and TechInsights recently conducted in-depth teardowns of the Qualcomm QTM565, the mmWave integrated module. According to TechInsights' study, Qualcomm HG11-34443-2 (QTM565) FR2 Tx/Rx Front End Die RFIC Process Analysis by Sharath Poikayil Satheesh and corroborated by Yole Group's component analysis, the Qualcomm QTM565 module utilizes GlobalFoundries’ 22FDX RF process, which is fundamentally built upon Soitec’s advanced FD-SOI substrates. The same die has been embedded in AiP mmW solution in the iPhone 17 which is highlighting the use of FD-SOI substrate in mmW RFIC for flagship phones.
Daniel Nenni, Founder of SemiWiki.com, said: “The findings highlight a major industry shift toward highly integrated 5G mmWave Systems-on-Chip (SoCs), where phased array element spacing and area constraints are highly critical”.
TechInsights’ executive summary points out that FD-SOI devices are uniquely engineered to operate effectively into the mmWave band, making monolithic and highly integrated phased-array transmit and receive SoCs feasible for top-tier consumer electronics.
The FD-SOI Advantage in the iPhone 17
By serving as the foundational substrate for the Qualcomm QTM565, FD-SOI technology enables fully integrated 5G mmWave SoCs. For manufacturers like Apple and Qualcomm, this technology unlocks several critical advantages:
Miniaturization and Footprint Optimization: FD-SOI offers significant logic scaling advantages over competing technologies. It allows designers to integrate baseband, control logic, and the RF front-end onto a single die, reducing the Bill of Materials (BOM), minimizing board area, and drastically cutting interconnect loss.
Best-in-Class Power Efficiency: Operating at low voltages, the platform extends battery life in mobile devices. The inherent low-noise analog devices and excellent device matching deliver peak performance without sacrificing power consumption.
Unmatched RF Performance: As proven by the silicon mmWave demonstrators mentioned in the TechInsights report, FD-SOI provides the precise engineering required for the high-frequency demands of sub-6 GHz and mmWave 5G networks.
The integration of FD-SOI technology into the flagship iPhone 17 series underscores the substrate's vital role in the future of mobile connectivity, driving the miniaturization required in modern mobile devices while ensuring extended battery life and unparalleled power efficiency.
Sources
Yole group report: https://www.reverse-costing.com/teardowns/components/unidentified_339m00418/
TechInsight report:
https://link.techinsights.com/ll6m
Qualcomm 5G mmWave antenna module QTM565 product brief:
https://www.qualcomm.com/modems/rf/products/qtm565
Soitec FD-SOI technology:
https://www.soitec.com/home/products/product-platforms/fd-soi
About SemiWiki
SemiWiki.com is the leading open forum and premier online community for semiconductor professionals. Founded in 2011, SemiWiki provides an independent platform for industry experts, engineers, and executives to share knowledge, discuss trends, and collaborate on the future of microelectronics. With a focus on Electronic Design Automation (EDA), semiconductor IP, foundries, and advanced packaging, SemiWiki delivers in-depth analysis, news, and commentary that helps shape the global semiconductor ecosystem. For more information, visit www.semiwiki.com.
Media Contact:
Grace Bonacum
gbonacum@greenoughagency.com
+1 617-275-6500