The Double-Edged Sword of AI Processors: Batch Sizes, Token Rates, and the Hardware Hurdles in Large Language Model ProcessingUnlike traditional software programming, AI software modeling represents…Read More
TRNG for Automotive achieves ISO 26262 and ISO/SAE 21434 complianceThe security of a device or system depends…Read More
Bug Hunting in Multi Core Processors. Innovation in VerificationWhat’s new in debugging multi-/many-core systems? Paul Cunningham…Read More
Synopsys Expands Hardware-Assisted Verification Portfolio to Address Growing Chip ComplexityLast week, Synopsys announced an expansion of their…Read More
How Synopsys Enables Gen AI on the EdgeArtificial intelligence and machine learning have undergone incredible…Read More
The big EDA news last week of course was the CNBC interview (HERE) with infamous corporate raider Carl Icahn. Carl is not happy with Mentor Executives, nor is Mentor investor Donald Drapkin who said, and I quote, “It’s just a sleepy company run like a country club”. Carl and Donald’s combined MENT investment is 20%+ … Read More
A growing number of reports highlight a class of design errors that is difficult to check using more traditional methods, and can potentially affect a wide range of IC designs, especially where high reliability is a must.By Matthew Hogan
Today’s IC designs are complex. They contain vast arrays of features and functionality in … Read More
Good news in a way: Merrill Lynch (or Bank of America Merrill Lynch as I suppose we have to get used to calling them) have re-started coverage of EDA with a 20 page report on the industry, much of which is spent on explaining how the industry segments out and who is strong in which segments, stuff that most people reading this site already… Read More
When I worked at Intel as a circuit design engineer I could talk directly with the technology development engineers to understand how to really push my DRAM designs and get the smallest possible memory cell layout that would still yield well, provide fast access time, and long refresh cycles.
(United States Patent 6661699. Inventor:… Read More
"Managing increasing complexity through higher-level of abstraction: What the past has taught us about the future" Dr. Ajoy Bose, Atrenta CEO
Here is the abstract:
Time to market and design complexity challenges are well-known; we have all seen the statistics and predictions. A well-defined strategy to address … Read More
During the most recent conference call (transcript), TSMC not only beat revised estimates and announced record spending levels for 2011, Morris Chang also officially announced that a 450mm fab (Fab 12 Phase VI) is currently in the planning stages with target production @ 20nm in 2015. This is HUGE!
According to Morris Chang:
“For… Read More
Cadence at DesignCon 2011
I met with Rahul Deokar, Product Manager this morning to review 9 slides that tell the story of Giga-gates and GigaHz systems design at Cadence. Their updated P&R system now completes jobs 2X faster for 28nm designs.
Silicon Realization Trends and Challenges:
Silicon Realization – end to end digital… Read More
Process Design Kit (PDK) development is one of the most entertaining things to watch in the semiconductor design world. It is kind of like the Golden Snitch in the game of Quidditch. No matter how rough EDA vendors play the game, no matter what the score is, it’s the vendor that “gets” the Golden PDK Snitch that wins the semiconductor… Read More
“IP Innovation is moving from component level to system level”. This mantra was heard during the conference, from various speakers: during the keynote talk by Ganesh R. from Gartner and presentation “Integration-Optimized IP from Cadence” by Ranga Srinivasan, also during discussion around coffee (or a glass … Read More
The Common Platform Technology Forum last week was not well attended, less than half than the GlobalFoundries Conference. It was deja vu of previous CP forums but there were a couple of surprises to go with the disappointment. The lunch line was long, but fortunately I was escorted to the press lunch featuring VIP’s from Samsung,… Read More
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Unlocking the cloud: A new era for post-tapeout flow for semiconductor manufacturing