The Yield Partnership: Intel and PDF Solutions Tackle Advanced NodesOne of the most difficult things to do…Read More
Webinar: Faster Design Spec to Implementation using IP-XACTAs SoC design flows grow increasingly complex, IP-XACT…Read More
Webinar: Caspia Shows You How to Fix Security Flaws Before It’s Too LateI recently posted an overview of an upcoming…Read More
Feed Forward Intelligence: Enabling Testability in the Chiplets EraThe semiconductor industry is entering a new era…Read More
Synopsys Unifies Electrical, Thermal, Mechanical, and Optical Analysis with Multiphysics Fusion Solutions Market Leaders Including Cisco,…Read More
It is always nice to see when an EDA company grows organically, versus inorganically by acquiring friends and foes. It is also nice to see when an EDA company invests in the fabless semiconductor ecosystem because, as we know, we are all in this together.
Tanner EDA celebrated its 25th anniversary this year by adding 149 new customers… Read More
The preceding two Semiwiki articles in this thread provided an overview to the FinFET structure and fabrication. The next three articles will discuss some of the unique modeling requirements and design constraints that FinFET’s introduce, compared to planar FET technology.
Due to the complexity of FinFET modeling – … Read More
You often hear the mantra that Analog Mixed-Signal (AMS) behavioral models are inaccurate. It is repeated so often that it starts to morph into “AMS models are inherently inaccurate”. This is not true.
Source: Wikipedia
… Read More
A catchy phrase used by bloggers and journalists these days is “Internet of Things“, or IoT if you prefer acronyms. All of this is made possible by EDA tools in the hands of SoC designers to create useful products like my Jawbone ICON bluetooth headset. Tonight I discovered that I could customize my bluetooth headset… Read More
Matt Elmore has a two-part blog about the growing complexity of signal integrity analysis, both on the chip itself and the increasingly complex analysis required to make sure that signals (and power) get in and out of the chip from the board cleanly, especially to memory, which requires simultaneous analysis of chip-package-system… Read More
Electronic Design and Solutions Fair (EDSF) was held in Yokohama Japan from Wednesday to Friday last week. It was held at the Pacifico Hotel, somewhere I have stayed several times, not far from the Yokohama branch of Hard Rock Cafe and, what used to be at least, the biggest ferris-wheel in the world.
Atrenta was one of the many companies… Read More
Once upon a time, ASIC designers were integrating memories in their design (using a memory compiler being part of the design tools provided by the ASIC vendor), then they had to make the memory observable, controllable… and start developing the test program for the function, not a very enthusiastic task (“AAAA” and “5555” and other… Read More
The announcement that Paul Otellini will step down in May 2013 is extraordinary in the history of the way Intel makes CEO transitions. They are thoughtful, deliberate and years in the making, unlike today’s announcement. Twenty years ago Otellini and Andy Bryant were in the top echelon of Andy Grove’s executive team and … Read More
Ever since the failed Intel PR stunt where Mark Bohr suggested that the fabless semiconductor ecosystem was collapsing I have been researching and writing about it. The results will be a book co-authored by Paul McLellan. You may have noticed the “Brief History of” blogs on SemiWiki which basically outline the book. If not, start… Read More
Yesterday, I clicked “like” on a LinkedIn post with the title “TI Cuts 1,700 Jobs”. Today, I read the analysis and pulled out Social Distortion’s “Still Alive” for inspiration. I’ve been through this more than once. For them it’s not like-worthy, and I feel their sting.
The part of the post I liked was the comment: “This is good for … Read More
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Intel 18A vs Intel 18A-P: What Is the Difference and Why Does It Matter?