A couple of weeks ago, Xilinx and TSMC announced the production release of the Virtex-7 HT family, the industry’s first heterogeneous 3D ICs in production. With this milestone, all Xilinx 28nm 3D IC families are now in volume production. These 28nm devices were developed on TSMC’s Chip-on-Wafer-on-Substrate (CoWoS)… Read More
Foundation IP for Intel 18A: Technical Overview and Why It MattersSynopsys Foundation IP for Intel 18A is a…Read More
WEBINAR: Defacto is Boosting Front-end SoC Design With AI-Powered EDA toolsThe real promise of AI in EDA is…Read More
Webinar: Caspia Shows You How to Fix Security Flaws Before It’s Too LateChip-level vulnerability is becoming an existential threat for…Read More
Why Huawei Says It Will Match TSMC's Most Advanced Chips by 2031Huawei’s assertion that it could match TSMC in…Read MoreTSMC on Semiconductor IP Quality
It is important to note that the System On Chip (SoC) revolution that is currently driving mobile electronics has one very important enabling technology and that is Semiconductor Intellectual Property. Where would we be without the commercial IP market segment? Computers and phones would still be on our desks for one thing, and… Read More
Start With The End In Mind – For Complete & Fast Success!
There is always a rush to converge a semiconductor design toward faster closure, amid increasing divergent trends of multiple IPs and high complexities of various functionalities on a single chip. Every design house struggles hard to evolve its customized design flows with several short paths patched up to fix issues, global… Read More
Dassault Patent on Hierarchy Management
Dassault have recently been granted a patent on their approach to managing design hierarchy. I asked them how long it took from filing the patent until it was granted and they said the whole process had taken 8 years. It is a bit of an indictment of the patent system when it takes 8 years, also known as 4 or 5 process nodes, for a patent to… Read More
Can Intel Compete in the IoT?
Kevin Ashton, a British technology pioneer, is credited for the term “The Internet of Things” to describe an ecosystem where the Internet is connected to the physical world via ubiquitous sensors. Simply stated: rather than humans creating content for the internet IoT devices create the content. To be clear, this… Read More
nVidia: Virtual Platform/Emulation Hybrid
I was the VP marketing at VaST Systems Technology and then at Virtutech. Both companies sold virtual platform technology which consisted of two parts:
- an extremely fast processor emulation technology that actually worked by doing a binary translation of the target binary code (e.g. an ARM) into the native instruction set of the
Synopsys Creates a High-performance ARC Core
ARC is a family of configurable processors. Originally it was a standalone company in the UK (what is it with the UK and processor cores?) spun out from Argonaut Software. The A in ARC stood for Argonaut originally. ARC International was acquired by Virage and then Virage was acquired by Synopsys so now it is part of Synopsys Designware… Read More
GlobalFoundries and ARM
GlobalFoundries had several interesting things at the ARM TechCon last week. Firstly, GlobalFoundries won the best in show award in the chip design category recognizing the best-in-class technologies introduced since the last TechCon.
Earlier in the summer GlobalFoundries and ARM announced the ARM Cortex-A12 processor,… Read More
GSA Award Nominees Announced
Today GSA announced the award nominees for the 2013 awards. They will be presented at the GSA Award Dinner on Thursday December 12th at the Santa Clara Convention Center. The keynote will be given by Steve Forbes.
Recently it was announced that the 2013 Dr. Morris Chang Exemplary Leadership Award winners are CEO and Chairman, Dr.… Read More
Addressing Power at Architectural and RTL Levels
Major power reductions are possible by reducing power at the RTL and system levels, and not just at the gate and physical level. In fact, as is so often the case in design, changes can have much more impact when done at the higher level, even given that at that point in the design there is less accurate feedback about changes. Later the… Read More


The Packaging PDK Is the Missing Layer for Co-Packaged Optics