SILVACO 051525 Webinar 800x100 v2

Chip On Wafer On Substrate (CoWoS)

Chip On Wafer On Substrate (CoWoS)
by Daniel Payne on 11-03-2012 at 5:19 pm

tsmc cowos test vehicle1

Our EDA industry loves three letter acronyms so credit the same industry for creating a five letter acronym CoWoS. Two weeks ago TSMC announced tape-out of their first CoWoS test chip integrating with JEDEC Wide I/O mobile DRAM interface, making me interested enough to read more about it. At the recent TSMC Open Innovation Platform… Read More


Electromigration (EM) with an Electrically-Aware IC Design Flow

Electromigration (EM) with an Electrically-Aware IC Design Flow
by Daniel Payne on 11-03-2012 at 4:05 pm

fig2a

Electromigration (EM) is a reliability concern for IC designers because a failure in the field could spell disaster as in lost human life or even bankruptcy for a consumer electronics company. In the old days of IC design we would follow a sequential and iterative design process of:… Read More


ARM TechCon 2012 Trip Report

ARM TechCon 2012 Trip Report
by Daniel Nenni on 11-02-2012 at 12:00 pm

I must say the ARM conference gets better every year, as do the attendance numbers. More than 4,000 people showed up including 5 SemiWiki bloggers, two of which I had not yet had the pleasure of meeting.

First I have to mention my favorite vendor booth. I don’t remember what company it was but the girls in fishnet stockings giving out… Read More


Internet of Things

Internet of Things
by Paul McLellan on 11-01-2012 at 8:10 pm

Another announcement from the Warren East’s ARM keynote this morning was the creation of a SIG within Weightless, which is an organization responsible for delivering royalty-free open standards to enable the Internet of Things (IoT). The SIG is focused on accelerating the adoption of Weightless as a wireless wide area… Read More


Jasper Apps White Paper

Jasper Apps White Paper
by Paul McLellan on 11-01-2012 at 7:30 pm

Just in time for the Jasper User Group meeting, Jasper have a new white paper explaining the concept of JasperGold Apps.

First the User Group Meeting. It is in Cupertino at the Cypress Hotel November 12-13th. For more details and to register, go here. The meeting is free for qualified attendees (aka users). One thing I noticed at the… Read More


SpyGlass IP Kit 2.0

SpyGlass IP Kit 2.0
by Paul McLellan on 11-01-2012 at 6:00 pm

On Halloween, Atrenta and TSMC announced the availability of SpyGlass IP Kit 2.0. IP Kit is a fundamental element of TSMC’s soft IP9000 Quality Assessment program that assesses the robustness and completeness of soft (synthesizable) IP.

IP Kit 2.0 will be fully supported on TSMC-Online and available to all TSMC’s soft IP alliance… Read More


ARM and a LEG

ARM and a LEG
by Paul McLellan on 11-01-2012 at 5:09 pm

I went to Warren East’s keynote speech at ARM Techcon today. There had been some hints earlier in the week that some significant announcements would be made and, while they were not earth-shattering, I think that they will be significant in the long term.

One interesting thing that Warren pointed out is that the ARM partner… Read More


Power, Predictions and Pills: Jonathan Koomey, ARM TechCon

Power, Predictions and Pills: Jonathan Koomey, ARM TechCon
by Holly Stump on 10-31-2012 at 5:00 pm


ARM TechCon Software and Systems Keynote: Why Ultra-Low Power Computing Will Change Everything Simon Segars, speaking of the importance of continuing low power initiatives, introduced Dr. Jonathan Koomey, Consulting Professor at Stanford. (First impression, our kind of guy: He wears engineer shoes, not sales shoes!)

Koomey… Read More


Beneath the Surface lies the first real test

Beneath the Surface lies the first real test
by Don Dingee on 10-31-2012 at 9:00 am

At CES 2011, Steven Sinofsky of Microsoft stepped on the stage and went off the map of proven Windows territory. Announcing the next version of Windows would support the ARM Architecture, including SoCs from Qualcomm, NVIDIA, and TI, set a new course for Microsoft.

But Windows, being the battleship-sized behemoth that it is, would… Read More


IBM Tapes Out 14nm ARM Processor on Cadence Flow

IBM Tapes Out 14nm ARM Processor on Cadence Flow
by Paul McLellan on 10-30-2012 at 7:33 pm

An announcement at the ARM conference was of a joint project to tape out an ARM Cortex-M0 in IBM’s 14nm FinFET process. In fact they taped out 3 different versions of the chip using different routing architectures to see the impact on yield.

This was the first 14nm ARM tapeout, it seems. I’m sure Intel has built plenty … Read More