Linear pluggable optics target data center energy savingsData center density continues growing, driving interconnect technology…Read More
Bird’s Eye View Magic: Cadence Tensilica Product Group Pulls Back the CurtainEven for experienced technologists some technologies can seem…Read More
Siemens EDA Offers a Comprehensive Guide to PCIe® Transport SecurityIt is well-known that there is more data…Read More
Thanks to SemiWiki readers for the feedback and comments on the previous “Introduction to FinFET Technology” posts – very much appreciated! The next installment on FinFET modeling will be uploaded soon.
In the interim, Dan forwarded the following link to me “ Intel’s FinFETs too complicated and difficult, says … Read More
One of the truisms of today’s disaggregated semiconductor design and manufacturing model is counter-intuitive to the do-it-yourself focus that is at the heart of every engineer. And yet, time and time again, success rewards those who understand that with today’s ever increasing complexity, it is difficult, if… Read More
Remember the processor-memory gap— a situation where the processor is forced to stall while waiting for a memory operation to complete? This was largely a result of the high latency required for off chip memory accesses. Haven’t we solved that problem now with SoCs? SoCs are typically architected with their processors … Read More
Next week it is Semicon West in the Moscone Center from Tuesday to Thursday, July 10-12th. Cadence will be on a panel session during a session entitled The 2.5D and 3D packaging landscape for 2015 and beyond. This starts with 3 short keynotes:
When I first came to the US, one project that we had going on at VLSI Technology was an ASIC design being done by a French company called Telic. The chip would go into something called “Minitel” which the France Telecom (actually still the PTT since post and telecomunications had not yet been separated) planned to supply… Read More
In my circuit design past I did DRAM work at Intel, so I was interested in learning more about Novocell Semiconductor and their design of One Time Programmable (OTP) IP. Walter Novosell is the President/CTO of Novocell and talked with me by phone on Thursday.… Read More
At DAC in June I didn’t get a chance to visit ClioSoft for a product update so instead I read their white paper this week, “The Power of Visual Diff for Schematics & Layouts“. My background is transistor-level IC design so anything with schematics is familiar and interesting.
The Challenge
Hand-crafted … Read More
SEMICON West is coming up this July 10-12 at the Moscone Center in San Francisco. It covers a broad swath of the microelectronics supply chain, but I was particularly interested in the test sessions. Here are two that I recommend.
“The Value of Test for Semiconductor Yield Learning” on Tuesday, July 10, at 1:30p. The… Read More
If we look at SoC design evolution, we have certainly successfully passed several steps: from transistor by transistor IC design using Calma up to design methodology based on the integration of 500K + gates IP like PCIe gen-3 Controller, one out of several dozens of IP integrated in today’ SoC for Set-Top-Box or Wireless Application… Read More
For those of you who didn’t get to DAC you can catch up on low power issues with Apache’s series of low-power webinars taking place late in July. All webinars are at 11am Pacific Time. Full details and registration on the Apache website here.… Read More
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