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How to manage decreasing by 70% a $5B IC business in less than 6 years? TI knows the answer…

How to manage decreasing by 70% a $5B IC business in less than 6 years? TI knows the answer…
by Eric Esteve on 01-24-2013 at 9:40 am

The Wireless Business Unit (WBU) from TI was created in the mid 90’s to structure the chip business in wireless handset made with customers like Nokia, Ericsson or Alcatel. I had a deep look at the WBU results: quickly growing from $1B in 2000 to reach about $5B in 2005… to finally decrease by 70%, down to $1.3B in 2012.

Let’s make it clear:… Read More


The Linley Microprocessor Conference: Weather Cloudy

The Linley Microprocessor Conference: Weather Cloudy
by Paul McLellan on 01-23-2013 at 7:51 pm

The Linley Group’s Microprocessor conference in Spring is focused on Datacenters now that cloud computing and massive internal datacenters has made them so important. The conference is on February 5th and 6th. It is free to qualified people such as network equipment vendors, network service providers and so on (which … Read More


You may want to check that known-good RTL

You may want to check that known-good RTL
by Don Dingee on 01-23-2013 at 1:00 pm

In his blog Coding Horror, Jeff Atwood wrote: “Software developers tend to be software addicts who think their job is to write code. But it’s not. Their job is to solve problems.” Whether the tool is HTML, C, or RTL, the reality is we are now borrowing or buying more software IP than ever, and integrating it into more complex designs,… Read More


Using IC Data Management Tools and Migrating Vendors

Using IC Data Management Tools and Migrating Vendors
by Daniel Payne on 01-23-2013 at 10:50 am

Non-volatile memory is used in a wide variety of consumer and industrial applications and comes in an array of architectures like Serial Flash and CBRAM (Conductive Bridging RAM). I caught up with Shane Hollmer by phone this week to gain some insight into a recent acquisition of Atmel’s serial flash components, and how that… Read More


Verdi: No Requiem for Openness

Verdi: No Requiem for Openness
by Paul McLellan on 01-22-2013 at 8:10 pm

I sat down last week for lunch with Michael Sanie. Mike and I go back a long way, working together at VLSI Technology (where his first job out of school was to take over the circuit extractor that I’d originally written) and then in strategic marketing at Cadence. Now Mike has marketing for (almost?) all of Synopsys’s … Read More


How We Got Here…

How We Got Here…
by Paul McLellan on 01-22-2013 at 12:54 pm

Over at the GSA Forum website I have an article on the history of the semiconductor industry. It is actually based on a couple of brief history of semiconductor blogs (here and here) I published here on SemiWiki last year but edited down a lot and tightened up.

Since the start of the year seems to be the time for predictions, here are the… Read More


New PCI Express 3.0 Equalization Requirements

New PCI Express 3.0 Equalization Requirements
by Eric Esteve on 01-22-2013 at 9:18 am

PCI Express 3.0 increased the supported data rate to 8 Gbps, which effectively doubles the data rate supported by PCI Express 2.0. While the data rate was increased, no improvement was made to the channels. As such, an 8 Gbps channel in PCIe 3.0 experiences significantly more loss than one implemented in PCIe 2.0. To compensate for… Read More


First Time, Every Time

First Time, Every Time
by SStalnaker on 01-21-2013 at 7:10 pm

While this iconic advertising phrase was first used to describe the ink reliability of a ballpoint pen, it perfectly summarizes the average consumer’s attitude toward automobile reliability as well. We don’t really care how it’s done, as long as everything in our car works first time, every time. Even when that includes heated… Read More


Double Patterning for IC Design, Extraction and Signoff

Double Patterning for IC Design, Extraction and Signoff
by Daniel Payne on 01-21-2013 at 3:27 pm

TSMC and Synopsys hosted a webinar in December on this topic of double patterning and how it impacts the IC extraction flow. The 20nm process node has IC layout geometries so closely spaced that the traditional optical-based lithography cannot be used, instead lower layers like Poly and Metal 1 require a new approach of using two… Read More


FD-SOI is Worth More Than Two Cores

FD-SOI is Worth More Than Two Cores
by Paul McLellan on 01-20-2013 at 10:00 pm

This is the second blog entry about an ST Ericsson white-paper on multiprocessors in mobile. The first part was here.

The first part of the white-paper basically shows that for mobile the optimal number of cores is two. It is much better to use process technology (and good EDA) to run the processor at higher frequency rather than add… Read More