It was spring 2010 and I was asked to attend an HLS (High Level Synthesis) meeting. To be honest I cringed, after my bad relationship with Accel DSP and broken promises my heart was all walled up and needed counseling. But my management had a way of making me an offer I could not refuse, like keeping my job. So reluctantly I went. Does your… Read More
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Berkeley Design Automation and the Cadence Legal Action!
SemiWiki broke the story yesterday about the Cadence legal action against Berkeley Design Automation and today I spent time with customers of both companies in Silicon Valley getting reactions. That is the advantage of working in Silicon Valley for almost 30 years, if you don’t know the right people, you certainly know the people… Read More
Fabless to OIP
Suk Lee drew the short straw at the TSMC Symposium yesterday, with the 5pm slot. Not only late in the day but between all the attendees and free beer. The morning sessions had been standing room only, with several hundred standees (as they call them on muni around here, but isn’t a standee really someone being stood on?). But … Read More
Mentor U2U, Not Your Father’s User Conference
I talked to Michael Buehler-Garcia about the changes Mentor is making to U2U, their user conference. It is in San Jose on April 25th at the DoubleTree.
Firstly, there are 3 great keynotes, two of whom I’ve seen speak before and can unreservedly recommend. Unfortunately I’m traveling that week and won’t be able… Read More
Cadence Sues Berkeley Design Automation
Cadence has brought a suit against Berkeley Design Automation for, as far as I can see, integrating their AFS circuit simulator with the Virtuoso Analog Design Environment (ADE) without using the (licensed) Oasis product. Since BDA is (actually was) a member of the Cadence Connections program, they have to abide by the contract… Read More
GlobalFoundries in Singapore
I hosted a webinar today for GlobalFoundries. Yes, I know that today was TSMC’s Technology Symposium, we weren’t that smart when we picked the date. It was basically a “fireside chat” with me as the moderator asking the questions and Paul Colestock and Aabid Husain as my guests. We actually did it at Cadence… Read More
Manage your IC’s Stress for right performance
As we have moved towards lower process nodes to improve performance of ICs with higher density and functionality, many manufacturing effects have appeared which can render ICs useless, even though the layout design could be correct as per traditional design rules. What is more worrisome is the variability of these effects which… Read More
How Long Does it Take to Go From a Muddy Field to Full 28nm Capacity?
TSMC has a lot of capacity. Not just that, it has a lot more under construction. It currently has 3 300mm Gigafabs, fabs 12,14 and 15 (there doesn’t seem to be a 13). This morning, Dr Wang, who is TSMC’s VP of 300mm operations told us about the expansion plans. Currently fab 15 phase 3 and 4, and fab 12 phase 3 are to be ramped… Read More
RTL Power Optimization
More so than most aspects of design, power reduction suffers from a paradox that early in the design cycle when the gains are the largest, the accuracy of power estimation is the lowest, and then late in the design cycle, when everything is known pretty much exactly it is too late to make anything other than trivial optimizations. … Read More
SoC Power Integrity Challenges
At DAC in 2012 I visited a few dozen EDA companies and blogged 32 articles, however I didn’t get to see what Apache Design (now a subsidiary of ANSYS) had to say. I did have 20 minutes today to watch their latest video on SoC Power Integrity Challenges and decided to share what I learned. If you want to watch the video at Tech Online,… Read More
Will 50% of New High Performance Computing (HPC) Chip Designs be Multi-Die in 2025?