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Full Visibility in ASIC Prototypes at DAC

Full Visibility in ASIC Prototypes at DAC
by Daniel Payne on 06-24-2013 at 3:46 pm

ASIC prototyping from multiple vendors using FPGA boards was popular at DAC again this year in Austin, Texas. I stopped by the Tektronix booth for a few minutes to meet with Dave Orecchio to get an update.


Dave Orecchio (right), TektronixRead More


Fujitsu, Mediatek, Richtek and Synopsys om Custom IC Design

Fujitsu, Mediatek, Richtek and Synopsys om Custom IC Design
by Daniel Payne on 06-24-2013 at 3:01 pm

Synopsys has been acquiring EDA and IP companies at a fast clip over the past few years and it’s often made me wonder how they are going to craft a coherent tool flow for custom IC design. At DACthis year I learned that for schematic capture the winning tool is Custom Designer SE– a relatively new tool, while the IC layout… Read More


Is Your Synchronizer Doing its Job (Part 2)?

Is Your Synchronizer Doing its Job (Part 2)?
by Jerry Cox on 06-23-2013 at 8:10 pm

In Part 1 of this topic I discussed what it takes to estimate the mean time between failures (MTBF) of a single stage synchronizer. Because supply voltages are decreasing and transistor thresholds have been pushed up to minimize leakage, the shortened MTBF of many synchronizer circuits at nanoscale process nodes is presenting… Read More


TSMC and Xilinx on the FinFAST Track!

TSMC and Xilinx on the FinFAST Track!
by Daniel Nenni on 06-23-2013 at 2:00 am

The power of the fabless semiconductor ecosystem never ceases to amaze me. On one hand you have the Intel backed press crowing about Intel stealing Altera from TSMC. On the other hand you have Xilinx and TSMC crowing about a new ‘one-team’ approach. If you are interested in the real story you’ve come to the right place.

“Altera’sRead More


Pat Pistilli: the first cell library, the first computer-printed label and more

Pat Pistilli: the first cell library, the first computer-printed label and more
by Paul McLellan on 06-22-2013 at 1:45 pm

At the DAC 50th anniversary banquet, Pat Pistilli won the award for most tenacious attendee, having been to all 50 DACs. Well, and for creating DAC and sustaining it. He was general chair for the first DAC (not yet called DAC) and, of course, would eventually form MP Associates with his wife Marie, which still runs DAC today. In 2010… Read More


Can we really find a way to speed-up Processor & DSP core designs?

Can we really find a way to speed-up Processor & DSP core designs?
by Eric Esteve on 06-21-2013 at 9:05 am

Once upon a time, ASIC designers involved in Processor design, like I was, for the first time in 1987 for Thomson CSF and again in 1994 for Texas Instruments, at that time supporting height (8) ASIC designed by another French company, the Advanced Computer Research Institute (ACRI), had to re-invent the wheel almost every day. When… Read More


Agilent ADS Users, Find Out About Design Data Management

Agilent ADS Users, Find Out About Design Data Management
by Paul McLellan on 06-20-2013 at 1:47 pm

In May, ClioSoft and Agilent announced that Agilent’s Advanced Design System (ADS) was now integrated with ClioSoft’s SOS Design Data Management. I interviewed Greg Peterschmidt of Agilent at that time. The information page for the combined product, known as SOS viaADS is here.

 

Next week ClioSoft is presenting… Read More


DAC by the Numbers

DAC by the Numbers
by Paul McLellan on 06-20-2013 at 12:03 pm

The attendance numbers for DAC are out. Unless you have been living under a stone you know that DAC was in Austin Texas a couple of weeks ago. Attendance was:

  • full conference passes: 1589
  • exhibits-only passes: 2364
  • booth staff: 1998

The registration is slightly lower than last year when DAC was in San Francisco (as it will be again … Read More


SEMICON West: My Top Picks

SEMICON West: My Top Picks
by Paul McLellan on 06-20-2013 at 11:21 am

I will be at Semicon West from 9th to 11th July in Moscone, San Francisco. Of course there are lots of interesting sessions but here are two that I think are especially important to get a good impression of the way things are going in the future from experts. The two most interesting questions about the future are what comes after 14nm,… Read More


What does 3D IC, FinFETs, and EUV have in common?

What does 3D IC, FinFETs, and EUV have in common?
by Daniel Nenni on 06-19-2013 at 6:00 pm


They are three of the top trending terms on SemiWiki and three of the hot topics at this year’s Semicon West:

In its 43rd year, SEMICON West is the flagship annual event for the global microelectronics industry. It is the premier event for the display of new products and technologies for microelectronics design and manufacturing,Read More