SNPS1376262937 hybrid c800x100 px (3)
Semiconductor Expert Forum

Podcast EP227: The Significance of the RISC-V Movement and the Upcoming Andes RISC-V event with Mark Himelstein

Podcast EP227: The Significance of the RISC-V Movement and the Upcoming Andes RISC-V event with Mark Himelstein
by Daniel Nenni on 06-07-2024 at 10:00 am

Dan is joined by Mark Himelstein, President of Heavenstone. Most recently, as Chief Technology Officer at RISC-V International, Mark contributed to shaping RISC-V technology through visionary leadership and industry expertise. He has a track record of executive roles at Graphite Systems, Quantum, and Infoblox.

Dan discusses… Read More

Posted on

Accelerate SoC Design: Addressing Modern Prototyping Challenges with S2C’s Comprehensive Solutions (II)

Accelerate SoC Design: Addressing Modern Prototyping Challenges with S2C’s Comprehensive Solutions (II)
by Daniel Nenni on 06-07-2024 at 8:00 am
Categories: 5G, EDA, Emulation, Prototyping, S2C EDA

Prodigy

In the fast-paced world of Electronic Design Automation (EDA), the complexity of chip designs is continuously rising. With the burgeoning of systems such as 5G communication devices and Advanced Driver-Assistance Systems (ADAS) teeming with thousands of components, the demand for robust and efficient prototyping platforms… Read More

Posted on

CEO Interview: Dieter Therssen of Sigasi

CEO Interview: Dieter Therssen of Sigasi
by Daniel Nenni on 06-07-2024 at 6:00 am
Categories: Automotive, CEO Interviews, EDA

Dieter Therssen

Dieter Therssen obtained his master’s degree in Electronics Engineering from KU Leuven in 1987. He started his career as a hardware design engineer, using IMEC’s visionary tools and design methodologies in the early days of silicon integration.

Since then, Dieter developed his career across many digital technologies,… Read More

Posted on

3DIC Verification Methodologies for Advanced Semiconductor ICs

3DIC Verification Methodologies for Advanced Semiconductor ICs
by Kalar Rajendiran on 06-06-2024 at 10:00 am
Categories: 3D IC, Analytics, Chiplet, EDA, Siemens EDA

3DIC Flow Challenges

At the recent User2user conference, Amit Kumar, Principal Hardware Engineer, Microsoft, shared the company’s experience from building a 3DIC SoC and highlighted Siemens EDA tools that were used. The following is a synthesis of core aspects of that talk.

3DIC Challenges

Despite the numerous advantages of 3DIC technology, its… Read More

Posted on

Mastering Copper TSV Fill Part 3 of 3

Mastering Copper TSV Fill Part 3 of 3
by John Ghekiere on 06-06-2024 at 8:00 am
Categories: 3D IC

Mastering Copper TSV Fill Part 3 of 3

Establishing void-free fill of high aspect ratio TSVs, capped by a thin and uniform bulk layer optimized for removal by CMP, means fully optimizing each of a series of critical phases. As we will see in this 3-part series, the conditions governing outcomes for each phase vary greatly, and the complexity of interacting factors means… Read More

Posted on

Arteris is Solving SoC Integration Challenges

Arteris is Solving SoC Integration Challenges
by Mike Gianfagna on 06-06-2024 at 6:00 am
Categories: Arteris, IP

Arteris is Solving SoC Integration Challenges

The difficulty of SoC integration is clearly getting more demanding. Driven by process node density, multi-chip integration and seemingly never-ending demands for more performance at lower power, the hurdles continue to increase. When you consider these challenges in the context of Arteris, it’s natural to think about hardware… Read More

Posted on

What to Do with All that Data – AI-driven Analysis Can Help

What to Do with All that Data – AI-driven Analysis Can Help
by Rob vanBlommestein on 06-05-2024 at 10:00 am
Categories: Analytics, EDA, Synopsys

1 design da

Today’s advanced node chip designs are faced with many new complexities from design and verification down to manufacturing. The solutions used at every stage of chip development generate petabytes of data. Managing, analyzing, understanding, and acting upon that data is overwhelming and paralyzing. Manual interpretation… Read More

Posted on

What’s all the Noise in the AI Basement?

What’s all the Noise in the AI Basement?
by Claus Aasholm on 06-05-2024 at 8:00 am
Categories: AI, Foundries, Intel, Samsung Foundry, Semiconductor Business Intelligence, Semiconductor Services, TSMC

Nvidia is HUGE 2024

My dog yawns every time I say Semiconductor or Semiconductor Supply Chain. Most clients say, “Yawn…. Don’t pontificate – pick the Nasdaq winners for us!”

Will Nvidia be overtaken by the new AI players?

If you follow along with me, you might gain some insights into what is happening in AI hardware. I will leave others to do the… Read More

Posted on

Arm Client 2024 Growing into AI Phones and AI PCs

Arm Client 2024 Growing into AI Phones and AI PCs
by Bernard Murphy on 06-05-2024 at 6:00 am
Categories: AI, Arm, IP

AI phone

I wrote last year about the challenge Arm Client/Mobile faces in growing in a saturated phone market and how they put a big focus on mobile gaming to stimulate growth. The gaming direction continues but this year they have added (of course) an AI focus, not just to mobile but also to other clients, notably PCs. It would be easy to be cynical… Read More

Posted on

Is it time for PCB auto-routing yet?

Is it time for PCB auto-routing yet?
by Daniel Payne on 06-04-2024 at 10:00 am
Categories: EDA, Siemens EDA

PCB routing min

PCB designers have been using manual routing for decades now, so when is it time to consider adding interactive routing technologies to become more productive? Manually routing traces to connect components will take time from a skilled team member and involves human judgement that will introduce errors. When a design change … Read More