IC Mask SemiWiki Webinar Banner

The True Power of the TSMC Ecosystem!

The True Power of the TSMC Ecosystem!
by Daniel Nenni on 10-02-2023 at 6:00 am

logo chart 092623

The 15th TSMC Open Innovation Platform® (OIP) was held last week. In preparation we did a podcast with one of the original members of the TSMC OIP team Dan Kochpatcharin. Dan and I talked about the early days before OIP when we did reference flows together. Around 20 years ago I did a career pivot and focused on Strategic Foundry Relationships.… Read More


Micron Chip & Memory Down Cycle – It Ain’t Over Til it’s Over Maybe Longer and Deeper

Micron Chip & Memory Down Cycle – It Ain’t Over Til it’s Over Maybe Longer and Deeper
by Robert Maire on 10-01-2023 at 6:00 pm

china 800 pound gorilla
  • The memory down cycle is longer/deeper than many thought
  • The recovery will be slower than past cycles- a “U” rather than “V”
  • AI & new apps don’t make up for macro weakness
  •  Negative for overall semis & equip- Could China extend downcycle?
Micron report suggests a longer deeper down cycle
Read More

Podcast EP185: DRAM Scaling, From Atoms to Circuits with Synopsys’ Dr. Victor Moroz

Podcast EP185: DRAM Scaling, From Atoms to Circuits with Synopsys’ Dr. Victor Moroz
by Daniel Nenni on 09-29-2023 at 10:00 am

Dan is joined by Dr. Victor Moroz, a Synopsys Fellow engaged in a variety of projects on leading edge modeling Design-Technology Co-Optimization. He has published more than 100 technical papers and over 300 US and international patents. Victor has been involved in many technical committees and is currently serving as an Editor… Read More


CEO Interview: Stephen Rothrock of ATREG

CEO Interview: Stephen Rothrock of ATREG
by Daniel Nenni on 09-29-2023 at 6:00 am

Stephen Rothrock ATREG

Stephen Rothrock founded ATREG in 2000 to help global advanced technology companies divest and acquire infrastructure-rich manufacturing assets. Over the last 25 years, his firm has completed more than 100 transactions, representing over 40% of all global operational wafer fab sales in the semiconductor industry for operational,… Read More


AI for the design of Custom, Analog Mixed-Signal ICs

AI for the design of Custom, Analog Mixed-Signal ICs
by Daniel Payne on 09-28-2023 at 10:00 am

high sigma verifier min

Custom and  Analog-Mixed Signal (AMS) IC design are used when the highest performance is required, and using digital standard cells just won’t meet the requirements. Manually sizing schematics, doing IC layout, extracting parasitics, then measuring the performance only to go back and continue iterating is a long, tedious… Read More


Keysight EDA 2024 Delivers Shift Left for Chiplet and PDK Workflows

Keysight EDA 2024 Delivers Shift Left for Chiplet and PDK Workflows
by Don Dingee on 09-28-2023 at 8:00 am

Chiplet PHY Designer

Much of the recent Keysight EDA 2024 announcement focuses on high-speed digital (HSD) and RF EDA features for Advanced Design System (ADS) and SystemVue users, including RF System Explorer, DPD Explorer (for digital pre-distortion), and design elements for 5G NTN, DVB-S2X, and satcom phased array applications. Two important… Read More


Assertion Synthesis Through LLM. Innovation in Verification

Assertion Synthesis Through LLM. Innovation in Verification
by Bernard Murphy on 09-28-2023 at 6:00 am

Innovation New

Assertion based verification is a very productive way to catch bugs, however assertions are hard enough to write that assertion-based coverage is not as extensive as it could be. Is there a way to simplify developing assertions to aid in increasing that coverage? Paul Cunningham (Senior VP/GM, Verification at Cadence), Raúl … Read More


Podcast EP184: The History and Industry-Wide Impact of TSMC OIP with Dan Kochpatcharin

Podcast EP184: The History and Industry-Wide Impact of TSMC OIP with Dan Kochpatcharin
by Daniel Nenni on 09-27-2023 at 2:00 pm

Dan is joined by Dan Kochpatcharin, Dan joined TSMC in 2007. Prior to his current role heading up the Design Infrastructure Management Division, Dan led the Japan customer strategy team, the technical marketing and support team for the EMEA region in Amsterdam and was a part of the team leading the formation of the TSMC Open Innovation… Read More


Version Control, Data and Tool Integration, Collaboration

Version Control, Data and Tool Integration, Collaboration
by Daniel Payne on 09-27-2023 at 10:00 am

SoC Complexity min

As a follow up from my #60DAC visit with Simon Rance of Keysight I was invited to their recent webinar, Unveiling the Secrets to Proper Version Control, Seamless Data and Tool Integration, and Effective Collaboration. Karim Khalfan, Director of Solutions Engineering, Data & IP Management was the webinar presenter.

Modern… Read More


WEBINAR: Emulation and Prototyping in the age of AI

WEBINAR: Emulation and Prototyping in the age of AI
by Daniel Nenni on 09-27-2023 at 8:00 am

mimic 128

Artificial Intelligence is now the primary driver of leading edge semiconductor technology and that means performance is at a premium and time to market will be measured in billions of dollars of revenue. Emulation and Prototyping have never been more important and we are seeing some amazing technology breakthroughs including… Read More