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Rick Carlson, Verific Design Automation’s Vice President of Sales, is an EDA trends spotter. I was reminded of his prescience when he recently called to catch up and talk about Verific’s role as provider of front-end platforms powering an emerging EDA market.
Verific, he said, is joining forces with a group of well-funded startups… Read More
In this episode of the Semiconductor Insiders video series, Dan is joined by Chouki Aktouf, CEO and Founder of Defacto Technologies. Dan explores the challenges of building complex SoCs with Chouki, who describes challenges around managing complexity at the front end of the process while staying within PPA requirements and … Read More
Dan is joined by Graeme Hickey, vice president of engineering at PQShield. Graeme has over 25 years of experience in the semiconductor industry creating cryptographic IP and security subsystems for secure products. Formerly of NXP Semiconductor, he was senior manager of the company’s Secure Hardware Subsystems group responsible… Read More
The semiconductor world is gathering at DAC 62, and ChipAgents AI is coming ready to show why agentic AI is the missing piece in modern RTL design and verification. Whether you’re drowning in terabytes of waveform data, grinding toward 100% functional coverage, or hunting for ways to accelerate time-to-market, our sessions and… Read More
Discover how proteanTecs is transforming health and performance monitoring across the semiconductor lifecycle to meet the growing demands of AI and Next-Gen SoCs.
Stop by DAC booth #1616 to experience our latest technologies in action, including interactive live demos and explore our full suite of solutions — designed to boost… Read More
Last year Arm announced their support for standards-based virtual prototyping in automotive, along with a portfolio of new AE (automotive enhanced) cores. They also suggested that in 2025 they would be following Arm directions in other LOBs by offering integrated compute subsystems (CSS). Now they have delivered: their Zena… Read More
In High-NA EUV lithography systems, the numerical aperture (NA) is expanded from 0.33 to 0.55. This change has been marketed as allowing multi-patterning on the 0.33 NA EUV systems to be avoided. Only very recently have specific examples of this been provided [1]. In fact, it can be shown that double patterning has been implemented… Read More
Anirudh (Cadence President and CEO) had two fireside chats during CadenceLIVE 2025, the first with Jensen Huang (Founder and CEO of NVIDIA) to kick off the show, and later in the day with Lip-Bu Tan (CEO of Intel). Of course Jensen and Lip-Bu also turn up for other big vendor shows but I was reminded that there is something special about… Read More
Semiconductor fabs aim to have high yields and provide processes that attract design firms and win new design starts, but how does a fab deliver their process nodes in a timely manner without having to run lots of expensive silicon through the line? This is where simulation and TCAD tools come into play, and to learn more about this… Read More
Resistive RAM (ReRAM or RRAM) is the strongest candidate for next-generation non-volatile memory (NVM), combining fast switching speeds with low power consumption. New techniques for managing a memory phenomenon called ‘relaxation’ are making ReRAM more predictable — and easier to specify for real-world applications.… Read More
Flynn Was Right: How a 2003 Warning Foretold Today’s Architectural Pivot