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Fit-for-purpose IoT ASICs are about more than cost

Fit-for-purpose IoT ASICs are about more than cost
by Don Dingee on 04-06-2016 at 4:00 pm

We’ve been saying for a while that it looks like there is a resurgence in design starts for ASICs targeting the IoT. A recent webinar featuring speakers from ARM and Open Silicon (and moderated by Daniel Nenni) affirms this trend, and provides some insight on how these designs may differ from typical microcontrollers.

One of my first… Read More


Car Companies Confront Data Sharing

Car Companies Confront Data Sharing
by Roger C. Lanctot on 04-06-2016 at 12:00 pm

Senior OnStar executives have long intoned at industry events that the customer owns his or her data. The only problem is that the customer is only allowed glimpses of his or her data. They don’t have control of that data in spite of their so-called ownership of it.

It’s a complex challenge especially given the fact that… Read More


Silicon Valley Myth Keeps Growing

Silicon Valley Myth Keeps Growing
by Daniel Isenberg on 04-06-2016 at 7:00 am

I thought my ears were deceiving me when a commentator (I believe it was David Brooks) gushed with admiration on NPR a few years ago that it was great that Jeff Bezos of Amazon was injecting Silicon Valley thinking into the Washington Post. What?!?!?! Unless my Google got jammed, Amazon is in Seattle. But Silicon Valley got the tagline.… Read More


The Most Important Point You May Have Missed at CDNLive 2016!

The Most Important Point You May Have Missed at CDNLive 2016!
by Daniel Nenni on 04-06-2016 at 4:00 am

This was the best keynote lineup I can remember at a user group meeting. All four speakers are visionaries but from very different perspectives. The video of the event will be up later this month but from my first count the word “System(s)” was mentioned 32 times and the underlying message will transform the semiconductor industry… Read More


Innovation in Transistor Design with Carbon Nanotubes

Innovation in Transistor Design with Carbon Nanotubes
by Students@olemiss.edu on 04-05-2016 at 4:00 pm

The New York Times article “IBM Scientists Find New Way to Shrink Transistors” by John Markoff focuses on the goal of the semiconductor industry to create smaller transistors in order to remain competitive while emphasizing cutting-edge design strategies with the use of carbon nanotubes. By switching from traditional methods… Read More


Analog Design Verification — Traceability is Required

Analog Design Verification — Traceability is Required
by Tom Dillinger on 04-05-2016 at 9:45 am

Digital verification engineers have developed robust, thorough metrics for evaluating design coverage. Numerous tools are available to evaluate testbenches against RTL model descriptions — e.g., confirming that simulation regressions exhaustively exercise signal toggles, RTL statement lines, individual statement… Read More


Optimizing memory scheduling at integration-level

Optimizing memory scheduling at integration-level
by Don Dingee on 04-04-2016 at 4:00 pm

In our previous post on SoC memory resource planning, we shared 4 goals for a solution: optimize utilization and QoS, balance traffic across consumers and channels, eliminate performance loss from ordering dependencies, and analyze and understand tradeoffs. Let’s look at details on how Sonics is achieving this.… Read More


IoT + Big Data + Cloud + AI Integration Insights from Patents

IoT + Big Data + Cloud + AI Integration Insights from Patents
by Alex G. Lee on 04-04-2016 at 12:00 pm

IoT Big Data Aggregation
US20140297826 illustrates a system for big data aggregation in a sensor network. The most important part of the Internet of Things (IoT) big data analytics is collecting data before storing the data. The Hadoop big data platform supports collecting data in Hadoop Distributed File System (HDFS). HDFS … Read More


PCB Design Requires Both Speed and Accuracy of SI/PI Analysis

PCB Design Requires Both Speed and Accuracy of SI/PI Analysis
by Tom Dillinger on 04-04-2016 at 8:00 am

The prevailing industry trends are clear: (1) PCB and die package designs are becoming more complex, across both mobile and high-performance applications; (2) communication interface performance between chips (and their related protocols) is increasingly demanding to verify; (3) signal integrity and power integrity issues… Read More