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Let’s face it, designs are getting harder, much harder. Gone are the days when the electrical and mechanical design of a system occurred separately. Maybe ten years ago this practice was acceptable. Once the electrical design was completed (either the chip or the board) the parameters associated with the design were then given… Read More
If we look at the semiconductor industry expansion during the last 25 years, adoption of design IP in every application appears to be one of the major factors of success, with silicon technology incredible development by a x100 factor, from 250nm in 2018 to 3nm (if not 2nm) in 2023. We foresee the move to chiplet-based architecture… Read More
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In my previous article, we touched on ways to pull in the schedule. This time I’d like to analyze how peak usage affects project timeline and cost. The above graph is based on real pattern taken from one development week in Annapurna Labs 5nm Graviton.
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Dan is joined by Scott Best, technical director at Rambus. His research areas are memory architectures, 3D packaging, and security processors. Scott joined Rambus in 1998 and has served in many and varied technical roles. He has become one of the most prolific inventors in the company’s history. Over the course of his career at … Read More
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