I wrote last year about the challenge Arm Client/Mobile faces in growing in a saturated phone market and how they put a big focus on mobile gaming to stimulate growth. The gaming direction continues but this year they have added (of course) an AI focus, not just to mobile but also to other clients, notably PCs. It would be easy to be cynical… Read More
![DAC 2024 Banner](https://semiwiki.com/wp-content/uploads/2024/06/DAC-2024-Banner-1.png)
![DAC 2024 Banner](https://semiwiki.com/wp-content/uploads/2024/06/DAC-2024-Banner-2.png)
![DAC 2024 Banner](https://semiwiki.com/wp-content/uploads/2024/06/DAC-2024-Banner-2.png)
![DAC 2024 Banner](https://semiwiki.com/wp-content/uploads/2024/06/DAC-2024-Banner-2.png)
![DAC 2024 Banner](https://semiwiki.com/wp-content/uploads/2024/06/DAC-2024-Banner.png)
Is it time for PCB auto-routing yet?
PCB designers have been using manual routing for decades now, so when is it time to consider adding interactive routing technologies to become more productive? Manually routing traces to connect components will take time from a skilled team member and involves human judgement that will introduce errors. When a design change … Read More
Silicon Creations is Enabling the Chiplet Revolution
The multi-die chiplet-based revolution is upon us. The ecosystem will need to develop various standards and enabling IP to make the “mix and max” concept a reality. UCIe, or Universal Chip Interconnect express is an open, multi-protocol on-package die-to-die interconnect and protocol standard that promises to pave the way … Read More
Unlocking the Future: Join Us at RISC-V Con 2024 Panel Discussion!
Are you ready to dive into the heart of cutting-edge computing? RISC-V Con 2024 is just around the corner, and we’re thrilled to invite you to a riveting panel discussion that promises to reshape your understanding of advanced computing. On June 11th, from 4:00 to 5:00 PM, at the prestigious DoubleTree Hotel in San Jose, California,… Read More
The Case for U.S. CHIPS Act 2
Despite murky goals and moving targets, the recent CHIPS Act sets the stage for long term government incentives.
Authored by Jo Levy and Kaden Chaung
On April 25, 2024, the U.S. Department of Commerce announced the fourth, and most likely final, grant under the current U.S. CHIPS Act for leading-edge semiconductor manufacturing.… Read More
Follow the Leader – Synopsys Provides Broad Support for Processor Ecosystems
Synopsys has expanded its ARC processor portfolio to include a family of RISC-V processors. This was originally reported on SemiWiki last October. There is also a recent in-depth article on the make-up of the ARC-V family on SemiWiki here. This is important and impactful news; I encourage you to read these articles if you haven’t… Read More
Podcast EP226: Lumotive’s Disruptive Optical Beamforming Technology With Dr. Sam Heidari
Dan is joined by Dr. Sam Heidari. Sam brings three decades of extensive management experience in the semiconductor sector. He currently holds the position of CEO at Lumotive, serves as Chairman at Arctic Semiconductor, and advises multiple technology startups. Previously, he served as CEO and Chairman at Quantenna Communications,… Read More
CEO Interview: Dr. Nikos Zervas of CAST
Dr. Nikos Zervas joined CAST company in 2010, having previously served as VP of Marketing and Engineering and as COO. Prior to working at CAST, Nikos co-founded Alma Technologies and served as its Chairman and CEO for nine years. Under his leadership Alma Technologies bootstrapped to become a reputable IP provider, developing… Read More
How does your EDA supplier ensure software quality?
In the fast-paced world of electronic design automation (EDA) software development, maintaining high code quality while adhering to tight deadlines is a significant challenge. Code coverage, an essential metric in software testing, measures the extent to which a software’s source code is executed in tests. High code… Read More
The Fallacy of Operator Fallback and the Future of Machine Learning Accelerators
As artificial intelligence (AI) and machine learning (ML) models continue to evolve at a breathtaking pace, the demands on hardware for inference and real-time processing grow increasingly complex. Traditional hardware architectures for acceleration are proving inadequate to keep up with these rapid advancements in ML … Read More
TSMC Advanced Packaging Overcomes the Complexities of Multi-Die Design