When someone says, “2.5D packaging” my first thought is TSMC and my second thought is Herb Reiter. Herb has more than 40 years of semiconductor experience and he has been a tireless promoter of 2.5D packaging for many years. Herb writes for and works with industry organizations on 2.5D work groups and events at conferences… Read More
Taming Concurrency: A New Era of Debugging Multithreaded CodeAs modern computing systems evolve toward greater parallelism,…Read More
Perforce Webinar: Can You Trust GenAI for Your Next Chip Design?GenAI is certainly changing the world. Every day…Read More
A Principled AI Path to Spec-Driven VerificationI have seen a flood of verification announcements…Read More
448G: Ready or not, here it comes!The march toward higher-speed networking continues to be…Read More
Should the US Government Invest in Intel?“Most companies don’t die because they are wrong;…Read More
Why Open and Supported Interfaces Matter
Back in the early 1980’s during the nascent years of electronic design automation (EDA), I worked at Texas Instruments supporting what would become their merchant ASIC business. Back then, life was a bit different. The challenge we faced was to make our ASIC library available on as many EDA flows as we could to give as many users as… Read More
Analysis and Signoff for Restructuring
For the devices we build today, design and implementation are unavoidably entangled. Design for low-power, test, reuse and optimized layout are no longer possible without taking implementation factors into account in design, and vice-versa. But design teams can’t afford to iterate indefinitely between these phases, so they… Read More
Customizable Analog IP No Longer a Pipe Dream
Configurable analog IP has traditionally been a tough nut to crack. Digital IP, of course, now provides for wide configurability for varying applications. In the same way that analog design has remained less deterministic as compared to digital design, analog IP has also tended to be less flexible. However, the tide may be turning… Read More
Bluetooth 5 IP is Ready for SoC Integration
Bluetooth®, WiFi, LTE, and 5G technologies enable wireless connectivity for a range of applications. While each offer unique features and advantages, designers need now to decide which protocol to integrate in a single chip after having test the market by using wireless off-chip solutions. Bluetooth 5 builds upon the success… Read More
Oracle is out of the Chip Business!
This is a story I have been tracking for some time now. Oracle is one of the companies I was enamored with early in my career, Sun microsystems as well. They are both legacies here in Silicon Valley, absolutely. I can now confirm that Oracle is getting out of the chip business. Oracle got into the chip business with the $7.4B acquisition… Read More
Semiconductor Reliability and Product Qualification
This week, we are continuing our discussion of various topics that Semitracks addresses in their training activities. One area that they focus on quite a bit is Semiconductor Reliability and Product Qualification.
One of the key activities that a Product Engineer will coordinate is the qualification of new products before they… Read More
Samsung, Synopsys and Qualcomm at DAC
I’m a user of many Samsung products as my family has Samsung Galaxy smart phones and my MacBook Pro uses Samsung SSD for storage, so at DAC I attended a breakfast panel with presenters from Samsung, Synopsys and Qualcomm. This was the second day of DAC and they served us breakfast, and with the big names on the panel the room was… Read More
Eclipse 2017: Drive All Night!
The reports are coming in now that Apple is working on self-driving car technology in support of developing shuttle buses – not unlike the dozen or so other companies like Local Motors and Navya working on the same idea. The message is clear that the only way to reduce traffic and congestion is to get human beings to pack themselves… Read More
TSMC OIP Ecosystem Forum 2017 Preview!
The TSMC OIP Ecosystem Forum is upon us again. I have yet to meet a disappointed attendee so it is definitely worth your time: Networking with more than 1,000 semiconductor professionals, the food, mingling with the 50+ EDA, IP, and Services Companies, the food, and of course the content. The 7nm and 7nm EUV updates alone are worth… Read More
Should the US Government Invest in Intel?