The new coronavirus outbreak or COVID-19 outbreak, as it is now officially called, continues to dominate the news again this week as currently there is no end forecast to the outbreak, and infection numbers continue to rise. This will have an impact on semiconductor supplies in the coming months and into Q2 as the necessary restrictions… Read More
imec on the Benefits of ASICs and How to Seize ThemIn an era where product differentiation increasingly depends…Read More
MZ Technologies Launches Advanced Packaging Design Video SeriesIn a significant move aimed at empowering semiconductor…Read More
Superhuman AI for Design Verification, Delivered at ScaleThere is a new breed of EDA emerging.…Read More
The Quantum Threat: Why Industrial Control Systems Must Be Ready and How PQShield Is Leading the DefenseIndustrial control systems (ICS) underpin the world’s most…Read MoreMinimal Corona Impact on Chip Equipment Stocks
Very solid quarter driven by foundry/logic
AMAT reported a very solid quarter, beating the top end of guidance with foundry and logic being the primary drivers of spend. Revenues were $4.16B and EPS of $0.98 non-GAAP versus street of $4.11B and $0.93 EPS.
Guide not too wide… – $300M “Corona Cut”
More importantly,… Read More
The Future Of Embedded Monitoring – February 2020
Shall I compare thee to a…Rolls Royce jet engine?
‘There is a new era dawning whereby deeply embedded sensing within all technology will bring about great benefit for the reliability and performance of semiconductor-based products.’ These were my words during a presentation to an industry audience in China back in September… Read More
Design Technology CoOptimization at SPIE 2020
SLiC Library tool dramatically accelerates DTCO for 3nm and beyond
In advanced technology nodes below 10nm, Design and Process Technology development have become increasingly intertwined. In older nodes the traditional technology roll-out was done mostly in a sequential manner with clear geometry scaling targets set by … Read More
Savings Tip the Balance to EVs
In a rare and perhaps unfortunate moment of candor, Cruise Automation CEO Dan Ammann wrote, in his blog post describing the emergence of Cruise (a subsidiary of General Motors) that conventional internal combustion engine vehicles “break down relatively easily. And if they make it 150,000 miles, well, lucky you.”
Ammann goes… Read More
Thermal Reliability Challenges in Automotive and Data Center Applications – A Xilinx Perspective
I wrote recently on ANSYS and TSMC’s joint work on thermal reliability workflows, as these become much more important in advanced processes and packaging. Xilinx provided their own perspective on thermal reliability analysis for their unquestionably large systems – SoC, memory, SERDES and high-speed I/O – stacked within a … Read More
TinyML Makes Big Impact in Edge AI Applications
Machine Learning (ML) has become extremely important for many computing applications, especially ones that involve interacting with the physical world. Along with this trend has come the development of many specialized ML processors for cloud and mobile applications. These chips work fine in the cloud or even in cars or phones,… Read More
De-Risking High-Speed RF Designs from Electromagnetic Crosstalk Issue
At DesignCon 2020, ANSYS sponsored a series of very high-quality presentations. Some focused on advanced methods and new technology exploration and some provided head-on, practical and actionable capabilities to improve advanced designs. The presentation I will discuss here falls into the latter category. The topic was… Read More
Innovation in Verification – February 2020
This blog is the next in a series in which Paul Cunningham (GM of the Verification Group at Cadence), Jim Hogan and I pick a paper on a novel idea in verification and debate its strengths and opportunities for improvement.
Our goal is to support and appreciate further innovation in this area. Please let us know what you think and please… Read More
Emerging Requirements for Electromagnetic Crosstalk Analysis
This article will describe the motivations for pursuing a new flow in the SoC design methodology. This flow involves the extraction, evaluation, and analysis of a full electromagnetic coupling model for a complex SoC and its package environment. The results of this analysis highlight the impact of electromagnetic coupling… Read More


Quantum Computing Technologies and Challenges