Revolutionizing Hardware Design Debugging with Time Travel TechnologyIn the semiconductor industry High-Level Synthesis (HLS) and…Read More
Addressing Silent Data Corruption (SDC) with In-System Embedded Deterministic TestingSilent Data Corruption (SDC) represents a critical challenge…Read More
TSMC's 6th ESG AWARD Receives over 5,800 Proposals, Igniting Sustainability PassionTaiwan Semiconductor Manufacturing Company has once again demonstrated…Read More
Tiling Support in SiFive's AI/ML Software Stack for RISC-V Vector-Matrix ExtensionAt the 2025 RISC-V Summit North America, Min…Read More
TSMC based 3D Chips: Socionext Achieves Two Successful Tape-Outs in Just Seven Months!Socionext’s recent run of rapid 3D-IC tape-outs is…Read More
Results were in line after correcting Covid Caused Revenue Rec issue-
ASML reported revenues of Euro3.3B and EPS of Euro1.79 as revenues from two EUV systems was not recognized, due to … Read More
This is going to be a record setting year for DAC content and attendance, absolutely!
My first DAC was in 1984 in Albuquerque New Mexico, right out of College, and I married my beautiful wife two months later. Thirty six DAC’s later I have four grown children, grandchildren, and the number one semiconductor design portal in the world.… Read More
“AI is the new electricity.”, according to Andrew Ng, Professor at Stanford University. The potential applications for machine learning classification are vast. Yet, current ML inference techniques are limited by the high power dissipation associated with traditional architectures. The figure below highlights the … Read More
Most of us will remember the productivity boost that hierarchical analysis provided vs. analyzing a chip flat. This “divide and conquer” approach has worked well for all kinds of designs for many years. But, as technology advances tend to do, the bar is moving again. The new challenges are rooted in the iterative nature of high complexity… Read More
Managing and controlling thermal conditions in-chip is nothing new and embedded temperature monitoring has been going on for many years. What is changing however, is the granularity and accuracy of the sensing now available to SoC design teams. Thermal activity can be quite destructive and if not sufficiently monitored can … Read More
After we detect a bug, can we use AI to locate the fault, or at least get close? Paul Cunningham (GM of Verification at Cadence), Jim Hogan and I continue our series on novel research ideas, through a paper in software verification we find equally relevant to hardware. Feel free to comment.
The Innovation
This month’s pick is… Read More
You may have seen a recent announcement from Mentor, a Siemens business, regarding the use of their Tessent DFT software by Ambarella for automotive applications. The announcement is a good example of how Mentor works with their customers to assure design success. On the surface the announcement comes across as a nice block and… Read More
As chip complexity grows, so does the need for a well-thought-out design data management strategy. This is a hot area, and Cliosoft is in the middle of it. When I was at eSilicon, we used Cliosoft technology to manage the design and layout of high-performance analog designs across widely separated design teams. The tool worked… Read More
The Intel 8086 microprocessor was introduced 42 years ago last month,1 so I made some high-res die photos of the chip to celebrate. The 8086 is one of the most influential chips ever created; it started the x86 architecture that still dominates desktop and server computing today. By looking at the chip’s silicon, we can see… Read More
Ansys addresses complex Multiphysics simulation and analysis tasks, from device to chip to package and system. When I was at eSilicon we did a lot of work on 2.5D packaging and I can tell you tools from Ansys were a critical enabler to get the chip, package and system to all work correctly.
Ansys recently published an Application Brief… Read More
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