It’s January so time to give you another summary of what I’ve found at CES 2021 about new cycling products that have electronic content. During the pandemic in 2020 we’ve seen a surge in sales for bicycles, e-bikes, spin bikes and trainers as people wanted a simple way of getting around town running errands, or… Read More
Chemical Origins of Environmental Modifications to MOR Lithographic ChemistryIn the pursuit of advanced extreme ultraviolet (EUV)…Read More
Post-Silicon Validating an MMU. Innovation in VerificationSome post-silicon bugs are unavoidable, but we’re getting…Read More
Securing UALink in AI clusters with UALinkSec-compliant IPA classic networking problem is securing connections with…Read MorePodcast EP3: Tomorrow’s Semiconductors with Jim Hogan
Dan and Mike are joined by industry luminary Jim Hogan. In a rare interview, Jim talks about his life – how he got into semiconductors, EDA and venture investing. Jim’s time at Cadence as well as his work at ARM are explored. Jim also provides a concise and informative overview of how venture investing works. The podcast… Read More
CEO Interview: Arun Iyengar of Untether AI
I had a chance to catch up with Arun Iyengar, CEO of Untether AI. Untether AI recently unveiled its tsunAImi accelerator cards powered by the company’s runAI devices. Using at-memory computation, Untether AI breaks through the barriers of traditional von Neumann architectures, offering industry-leading compute density … Read More
ISS 2021 – Scotten W. Jones – Logic Leadership in the PPAC era
I was asked to give a talk at the 2021 ISS conference and the following is a write up of the talk.
The title of the talk is “Logic Leadership in the PPAC era”.
The talk is broken up into three main sections:
- Background information explaining PPAC and Standard Cells.
- A node-by-node comparisons of companies running leading edge logic
HFSS – A History of Electromagnetic Simulation Innovation
In the 155 years since James Clerk Maxwell introduced the world to Maxwell’s Equations in the “Dynamic Theory of the Electromagnetic Field” there have been some amazing breakthroughs and avenues of insight. As a young electrical engineering student, we are introduced to the set of equations describing electromagnetic waves,… Read More
Developing Drivers For The Automotive Industry
Autonomous driving, connected vehicles, power electronics, infotainment and shared mobility are some of the developments which have mobilized the revolution within the automotive industry in recent years. Combined, they are not only disrupting the automotive value chain and impacting all stakeholders involved but are … Read More
2020 was a Mess for Intel
Understanding Intel’s future means understanding Intel’s past
Yes, there are two paths you can go by, but in the long run. There’s still time to change the road you’re on.
Intel is at a crossroad. The road they have been on since inception, and the road that has differentiated them from the rest of the pack… Read More
CDC, Low Power Verification. Mentor and Cypress Perspective
Clock domain crossing (CDC) analysis is unavoidable in any modern SoC design and is challenging enough to verify in its own right. CDC plus low power management adds more excitement to your verification task. I wrote on this topic for another solution provider last year. This time I want to intro an interesting twist on the problem,… Read More
ESD Alliance Report for Q3 2020 Presents an Upbeat Snapshot That is Up and to the Right
The Electronic System Design (ESD) Alliance (a SEMI Technology Community) recently released their regular report on EDA revenue for Q3, 2020 . While the report is a normal occurrence, the numbers in this particular report are anything but normal. I have been reviewing these reports for many years, and I honestly can’t remember… Read More
The Latest in Dielectrics for Advanced Process Nodes
Of the three types of materials used in microelectronics – i.e., semiconductors, metals, and dielectrics – the first two often get the most attention. Yet, there is a pressing need for a rich variety of dielectric materials in device fabrication and interconnect isolation to satisfy the performance, power, and reliability … Read More



Silicon Insurance: Why eFPGA is Cheaper Than a Respin — and Why It Matters in the Intel 18A Era