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Circuit Simulation Challenges to Design the Xilinx Versal ACAP

Circuit Simulation Challenges to Design the Xilinx Versal ACAP
by Daniel Payne on 06-24-2021 at 10:00 am

xilinx versal acap min

One of the most unique acronyms that I learned about this past year is ACAP from Xilinx, which stands for Adaptive Compute Acceleration Platform. At the recent Cadence LIVE event, I had the pleasure of watching Pei Yao, a Xilinx senior staff CAD engineer, as she talked about the challenges of getting all the analog and mixed-signals… Read More


Silicon Catalyst and Cornell University Are Expanding Opportunities for Startups Like Geegah

Silicon Catalyst and Cornell University Are Expanding Opportunities for Startups Like Geegah
by Mike Gianfagna on 06-24-2021 at 6:00 am

Silicon Catalyst and Cornell University Are Expanding Opportunities

SemiWiki has covered many aspects of Silicon Catalyst, from their business model to notable industry events and profiles of promising startups. You can get some perspective on the breadth and depth of Silicon Catalyst here. In this post, I’ll explore an aspect of the broader collaboration the organization is engaging in. It is… Read More


 Semiconductor CapEx strong in 2021

 Semiconductor CapEx strong in 2021
by Bill Jewell on 06-23-2021 at 10:00 am

Semiconductor CAPEX spending versus change 2021

Semiconductor manufacturers are expanding capital spending in 2021 and beyond to help alleviate shortages. In addition, many governments around the world are proposing funding to support semiconductor manufacturing in their countries.

The United States Senate this month approved a bill which includes $52 billion to fund… Read More


Low Power Positioning for Logistics – Ultimate Tracking

Low Power Positioning for Logistics – Ultimate Tracking
by Bernard Murphy on 06-23-2021 at 6:00 am

logistics min

When thinking about positioning you probably first think of navigation. The device in your car that helps get from where you are to where you want to be. Or navigating while hiking in the backcountry. But those applications are not the where the big unit growth will come. The biggest demand will be in asset tracking, expected to reach… Read More


Cadence Keynotes at CadenceLIVE Americas 2021

Cadence Keynotes at CadenceLIVE Americas 2021
by Kalar Rajendiran on 06-22-2021 at 10:00 am

LipBu 030 bizcasual

Last week, Cadence hosted its annual CadenceLIVE Americas conference. Four keynotes and eighty-three different talks on various topics were presented. The talks were delivered by Cadence, its customers and partners.

This blog is about the two keynotes delivered by CEO Lip-Bu Tan and President Dr. Anirudh Devgan. The guest … Read More


Life in a Formal Verification Lane

Life in a Formal Verification Lane
by Shinavi Shah on 06-22-2021 at 6:00 am

New image for semiwiki

This summer, I got the opportunity to work as a Formal Verification Intern with Axiomise for six weeks. I’m a keen designer and love working in design and architecture. Although, I’ve not started my professional career yet, I have done most of my projects as a designer in my undergraduate and postgraduate studies.

Having said that,… Read More


EDA Design and Amazon Web Services (AWS)

EDA Design and Amazon Web Services (AWS)
by Daniel Payne on 06-21-2021 at 10:00 am

EC2 min

I first remember blogging about EDA in the cloud starting back in 2011, so what’s changed in the last 10 years you may ask? In 2011, it was basically a handful of EDA point tools running batch mode in the cloud, and you were on your own to integrate those into a coherent flow, so expect help from the CAD and IT departments for sure.… Read More


Die-to-Die Connections Crucial for SOCs built with Chiplets

Die-to-Die Connections Crucial for SOCs built with Chiplets
by Tom Simon on 06-21-2021 at 6:00 am

die to die connections

If you ascribe to the notion that things move in circles, or concentrically, the move to die-to-die connectivity makes complete sense. Just as multi-chip modules (MCM) were the right technology decades ago to improve power, areas, performance and cost, the use of chiplets with die-to-die connections provides many advantages… Read More


Ten Lessons Learned from Andy Grove

Ten Lessons Learned from Andy Grove
by Betsy Corcoran on 06-20-2021 at 6:00 am

Andy Grove SemiWiki

I met Andy Grove on a sunny day in New York City in 1987. He was dashing to press interviews for his just-off-the-presses management book, “One on One with Andy Grove.” I was a freshly badged member of the press working for IEEE Spectrum, a year or so out of college, still toting my college backpack. Little did I know that that would be Read More


Podcast Episode 25: Silicon IP for Early-Stage Semiconductor Companies

Podcast Episode 25: Silicon IP for Early-Stage Semiconductor Companies
by Daniel Nenni on 06-18-2021 at 10:00 am

Moderator:
Daniel Nenni, Semiwiki
Panelists:
Jothy Rosenberg, CEO Dover Microsystems
John Terry, CEO Espre Technologies
Fares Mubarak, CEO Spark Microsystems

General Theme: A discussion around the requirements and challenges of investigation and ultimate selection of IP for early-stage chip companies, discussing both… Read More