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Semiconductor Expert Forum

Podcast EP310: On Overview of the Upcoming DVCon Europe Conference and Exhibition with Dr. Mark Burton

Podcast EP310: On Overview of the Upcoming DVCon Europe Conference and Exhibition with Dr. Mark Burton
by Daniel Nenni on 10-10-2025 at 10:00 am
Categories: Accellera, EDA, Events, Semiconductor Services

Daniel is joined by Dr. Mark Burton, the General Chair for this year’s DVCon Europe. DVCon is the premier conference on the application of languages, tools, and methodologies for the design and verification of electronic systems and integrated circuits.

Mark shares his long history of involvement in DVCon with Dan. He … Read More

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Exploring TSMC’s OIP Ecosystem Benefits

Exploring TSMC’s OIP Ecosystem Benefits
by Daniel Nenni on 10-10-2025 at 6:00 am
Categories: 3D IC, AI, Chiplet, EDA, Events, Foundries, IP, TSMC

TSMC Booth

Now that the dust has settled let’s talk more about TSMC’s Open Innovation Platform. Launched in 2008, OIP represents a groundbreaking collaborative model in the semiconductor industry. Unlike IDMs that controlled the entire supply chain, OIP fosters an “open horizontal” ecosystem uniting TSMC… Read More

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Demand Meets Design: RISC-V and the Next Wave of AI Hardware

Demand Meets Design: RISC-V and the Next Wave of AI Hardware
by Kalar Rajendiran on 10-09-2025 at 10:00 am
Categories: AI, Akeana, IP

Optimum Compute Watt Per Layer

Artificial intelligence (AI) is transforming every layer of computing, from hyperscale data centers training trillion-parameter models to battery-powered edge devices performing real-time inference. Hardware requirements are escalating on every front: compute density is increasing, power budgets are tightening, … Read More

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The RISC-V Revolution: Insights from the 2025 Summits and Andes Technology’s Pivotal Role

The RISC-V Revolution: Insights from the 2025 Summits and Andes Technology’s Pivotal Role
by Daniel Nenni on 10-09-2025 at 8:00 am
Categories: Andes Technology, Events, IP, RISC-V

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RISC-V  has emerged as a cornerstone of modern computing, offering an open-source alternative to proprietary designs like ARM and x86. Free from licensing fees and highly extensible, RISC-V powers everything from IoT devices to AI accelerators, with over 13 billion cores shipped globally. Annual RISC-V Summits, organized… Read More

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GlobalFoundries, MIPS, and the Chiplet Race for AI Datacenters

GlobalFoundries, MIPS, and the Chiplet Race for AI Datacenters
by Jonah McLeod on 10-09-2025 at 6:00 am
Categories: Chiplet, Foundries

GF MIPS

GlobalFoundries’ (GF) acquisition of MIPS in 2025 wasn’t a nostalgic move to revive a legacy CPU brand. It was a calculated step into one of the most lucrative frontiers in semiconductors: AI, high-performance computing (HPC), and datacenters. As Nvidia, AMD, Intel, and hyperscalers embrace chiplet architectures, GF is betting… Read More

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Moores Lab(AI): Agentic AI and the New Era of Semiconductor Design

Moores Lab(AI): Agentic AI and the New Era of Semiconductor Design
by Kalar Rajendiran on 10-08-2025 at 10:00 am
Categories: AI, EDA, Moores Lab (AI)

Silicon Engineering at the Speed of AI

For decades, chip design has been a delicate balance of creativity and drudgery. Architects craft detailed specifications, engineers read those documents line by line, and teams write and debug thousands of lines of Verilog and UVM code. Verification alone can consume up to 35 percent of a project’s cost and add many months to … Read More

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Breaking the Thermal Wall: TSMC Demonstrates Direct-to-Silicon Liquid Cooling on CoWoS®

Breaking the Thermal Wall: TSMC Demonstrates Direct-to-Silicon Liquid Cooling on CoWoS®
by Daniel Nenni on 10-08-2025 at 8:00 am
Categories: Foundries, TSMC

ETC 2025 TSMC

In a landmark presentation at the 2025 IEEE Electronic Components and Technology Conference (ECTC), TSMC unveiled a groundbreaking advancement in thermal management: Direct-to-Silicon Liquid Cooling integrated directly onto its CoWoS® platform. This innovation, detailed in the paper “Direct-to-Silicon Liquid… Read More

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From Prompts to Prompt Engineering to Knowing Ourselves

From Prompts to Prompt Engineering to Knowing Ourselves
by Bernard Murphy on 10-08-2025 at 6:00 am
Categories: AI
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From prompts to Promt Engineering

I am on a voyage of discovery through prompting and prompting technologies because these are the critical interfaces between what we want (or roughly imagine we want) from AI, and AI’s ability to deliver. I have seen suggestions that any deficiencies today are a detail that will soon be overcome. I’m not so sure. Yes, prompting technology… Read More

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GaN Device Design and Optimization with TCAD

GaN Device Design and Optimization with TCAD
by Daniel Payne on 10-07-2025 at 10:00 am
Categories: EDA, Silvaco

GaN Power, Frequency min

I’ve read articles about power electronics, RF systems and high-frequency applications using SiC and GaN transistors, especially in EVs and chargers, but hadn’t looked into the details of GaN devices. A recent Silvaco webinar proved to be just the format that I needed to learn more about GaN design and optimization. Udita Mittal,… Read More

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How the Father of FinFETs Helped Save Moore’s Law

How the Father of FinFETs Helped Save Moore’s Law
by Daniel Nenni on 10-07-2025 at 8:00 am
Categories: FinFET

Chenming Hu and Obama

In the early 2000s, Moore’s Law—the observation that the number of transistors on a chip doubles roughly every two years—was facing an existential crisis. As semiconductor nodes shrank below 90nm, planar transistors suffered from debilitating issues: leakage currents soared, power efficiency plummeted, and scaling became… Read More