Dan is joined by Charlie Slayman, technical leader at Cisco Systems working on reliability physics and risk assessment of advanced semiconductor technology. He is also the general chair of the International Reliability Physics Symposium, or IRPS which is the focus of the discussion.
Dan explores the rapidly growing application… Read More
One of the recent live events I attended was the 2022 GSA Silicon Leadership Summit on May 12th at the Santa Clara Convention Center (my favorite location). This was the first GSA live event in two years so it was a must attend gathering. This event targets semiconductor ecosystem executives (200+ people attended) so there were many… Read More
IC reliability is an issue that circuit design engineers and reliability engineers are concerned about, because physical effects like high Current Density (CD) in interconnect layers, or high point-to-point (P2P) resistance on device interconnect can impact reliability, timing or Electrostatic Discharge (ESD) robustness.… Read More
Bandwidth, latency, power and reach are always the key points of focus when it comes to connectivity. As the demand for more data and higher bandwidth connectivity continue, power management is gaining a lot of attention. There is renewed interest in pursuing silicon photonics to address many of these challenges. There are many… Read More
It’s a hostile world we live in, and cybersecurity of connected devices is a big concern. Attacks are rising rapidly, and vulnerabilities get exploited immediately. Supply chains are complex. Regulations are proliferating. Secrets don’t stay secrets for long – in fact, the only secret in a system with open-source algorithms… Read More
This is another look at refining the accuracy of fault localization. Once a bug has been detected, such techniques aim to pin down the most likely code locations for a root cause. Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO and now Silvaco CTO) and I continue… Read More
Our smart phones, tablets, laptops and desktops are the most common consumer products with advanced 2.5D and 3D IC packaging techniques. I love seeing the product tear down articles to learn how advanced packaging techniques are being used, so at the User2User conference in Santa Clara I attended a presentation from Tarek Ramadan,… Read More
Sensing – Who needs it?by Dave Bursky on 05-24-2022 at 6:00 amCategories: Analog Bits, Events, IP
In a simple answer – everyone. A keynote presentation “Sensing the Unknowns and Managing Power” by Mahesh Tirupattur, the Executive Vice President at Analog Bits at the recent Siemens User2User conference, discussed the need and application of sensors in computing and power applications. Why sense? As Mahesh explains, sensing… Read More
Next up in this series on modulated signals is an example of multi-dimensional EM design challenges: RF power amplifiers (PAs). Digital pre-distortion (DPD) is a favorite technique for linearizing PA performance. Static effects are easy to model and correct, but PAs are notorious for interrelated dynamic effects spoiling … Read More
The never ending appetite for higher bandwidths, faster data interfaces and lower latencies are bringing about changes in how data is processed at data centers. The expansion of cloud to the network edge has introduced broad use of artificial intelligence (AI) techniques for extracting meaning from data. Cloud supercomputing… Read More
Weebit Nano Moves into the Mainstream with Customer Adoption