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Seeing 1/f noise more accurately

Seeing 1/f noise more accurately
by Don Dingee on 06-15-2022 at 10:00 am

Decimation chain speeds up measurements for 1/f noise

Electronics noise is often described as “white,” spread evenly across a band, typical on older semiconductor processes where thermal and shot noise dominate. As transistors shrink, “pink” 1/f noise takes over at low frequencies – becoming stronger in advanced processes and quantum computing technology. But it’s not an easy… Read More


Podcast: Will Arm Risk RISC-V?

Podcast: Will Arm Risk RISC-V?
by Daniel Nenni on 06-15-2022 at 6:00 am

What’s at stake? A candid discussion between Junko Yoshida, Editor in Chief of the Ojo-Yoshida Report, and Frank Lin, CEO of Andes.

Will Arm RISC-V? from the Ojo-Yoshida Report

Andes Technology, a Taiwanese CPU core IP company, began phasing out its proprietary processing architecture in favor of RISC-V in 2015, as it preparedRead More


Truechip’s Network-on-Chip (NoC) Silicon IP

Truechip’s Network-on-Chip (NoC) Silicon IP
by Kalar Rajendiran on 06-14-2022 at 10:00 am

Truechip NoC Silicon IP Block Diagram

Driven by the need to rapidly move data across a chip, the NoC IP is already a very common structure for moving data with an SoC. And various implementations of the NoC IP are available in the market depending on the end system requirements. Over the last few years, the RISC-V architecture and the TileLink interface specification … Read More


A Different Perspective: Ansys’ View on the Central Issues Driving EDA Today

A Different Perspective: Ansys’ View on the Central Issues Driving EDA Today
by John Lee on 06-14-2022 at 6:00 am

RedHawk SC uses Ansys SeaScape Big Data Platform Designed for EDA Applications

For the past few decades, System-on-Chip (SoC) has been the gold standard for optimizing the performance and cost of electronic systems. Pulling together practically all of a smartphone’s digital and analog capabilities into a monolithic chip, the mobile application processor serves as a near-perfect example of an SoC. But… Read More


Podcast EP86: Negative Outlook for the Semiconductor Industry with Malcolm Penn

Podcast EP86: Negative Outlook for the Semiconductor Industry with Malcolm Penn
by Daniel Nenni on 06-13-2022 at 10:00 am

Dan is joined by Malcolm Penn, founder and CEO of Future Horizons, a firm that provides industry analysis and consulting services on the global semiconductor industry.

Dan and Malcolm discuss the current and future state of the semiconductor industry. What has driven the cyclic nature of the business and are we doomed to repeat… Read More


Intel 4 Deep Dive

Intel 4 Deep Dive
by Scotten Jones on 06-13-2022 at 6:00 am

Figure 1

As I previously wrote about here, Intel is presenting their Intel 4 process at the VLSI Technology conference. Last Wednesday Bernhard Sell (Ben) from Intel gave the press a briefing on the process and provided us with early access to the paper (embargoed until Sunday 6/12).

“Intel 4 CMOS Technology Featuring Advanced FinFET TransistorsRead More


Podcast EP85: How Expedera is Revolutionizing AI Deployment

Podcast EP85: How Expedera is Revolutionizing AI Deployment
by Daniel Nenni on 06-10-2022 at 10:00 am

Dan is joined by Sharad Chole, chief scientist & co-founder at Expedera. Sharad is an expert in AI frameworks, power-aware neural network optimizations, and programmable dataflow architectures. Previously, he was an architect at Cisco, Memoir Systems, and Microsoft.

Dan and Shared explore Expedera’s unique AI… Read More


WEBINAR: 5G is moving to a new and Open Platform O-RAN or Open Radio Access Network

WEBINAR: 5G is moving to a new and Open Platform O-RAN or Open Radio Access Network
by Daniel Nenni on 06-10-2022 at 6:00 am

The demands of 5G requires new designs to not only save power but also increase performance and by moving to advance power-saving nodes and by using eFPGAs will help to achieve these goals. This paper will introduce 5G and O-RAN, the complexity of these systems, and how flexibility could be beneficial. Then we will dive into how eFPGA… Read More


Standardization of Chiplet Models for Heterogeneous Integration

Standardization of Chiplet Models for Heterogeneous Integration
by Tom Dillinger on 06-09-2022 at 10:00 am

Chiplets

The emergence of 2.5D packaging technology for heterogeneous die integration offers significant benefits to system architects.  Functional units may be implemented using discrete die – aka “chiplets” – which may be fabricated in different process nodes.  The power, performance, and cost for each unit may be optimized separately.… Read More


LIDAR-based SLAM, What’s New in Autonomous Navigation

LIDAR-based SLAM, What’s New in Autonomous Navigation
by Bernard Murphy on 06-09-2022 at 6:00 am

LIDAR SLAM min

SLAM – simultaneous localization and mapping – is already a well-established technology in robotics. This generally starts with visual SLAM, using object recognition to detect landmarks and obstacles. VSLAM alone uses a 2D view of a 3D environment, challenging accuracy; improvements depend on complementary sensing inputs… Read More