At a DAC Accellera panel this year there was some discussion on cross-company collaboration in training. The theory is that more collaboration would mean a larger training set and therefore higher accuracy in GenAI (for example in RTL generation). But semiconductor companies are very protective of their data and reports of copyrighted… Read More
Ceva-XC21 Crowned "Best IP/Processor of the Year"In a resounding affirmation of innovation in semiconductor…Read More
AI-Driven DRC Productivity Optimization: Insights from Siemens EDA's 2025 TSMC OIP Presentation In the rapidly evolving semiconductor industry, Design…Read More
How PCIe Multistream Architecture Enables AI Connectivity at 64 GT/s and 128 GT/sAs AI and HPC systems scale to thousands…Read MoreLiberty IP Excellence: Building a Robust Verification Framework for Automotive IPs
As 2025 draws to a close, the semiconductor industry continues to push boundaries, particularly in automotive applications where reliability is non-negotiable. At the TSMC Open Innovation Platform forum this year, a collaborative presentation by NXP Semiconductors and Siemens EDA stood out: “Liberty IP Excellence:… Read More
ASU Silvaco Device TCAD Workshop: From Fundamentals to Applications
The ASU-Silvaco Device Technology Computer-Aided Design Workshop is a pivotal educational and professional development event designed to bridge the gap between theoretical semiconductor physics and practical device engineering. Hosted by Arizona State University in collaboration with Silvaco, a leading provider of … Read More
PDF Solutions Calls for a Revolution in Semiconductor Collaboration at SEMICON West
SEMICON West was held in Phoenix, Arizona on October 7-9. This premier event brings the incredibly diverse global electronics supply chain together to address the semiconductor ecosystem’s greatest opportunities and challenges. The event’s tagline this year is:
Stronger Together — Shaping a Sustainable Future in Talent,… Read More
The AI PC: A New Category Poised to Reignite the PC Market
The PC industry is entering its most significant transformation since the debut of the IBM PC in 1981. That original beige box ushered in a new era of productivity, reshaping how corporations and individuals worked, communicated, and created. More than four decades later, the AI PC is emerging as a new category — one that promises… Read More
The Rise, Fall, and Rebirth of In-Circuit Emulation: Real-World Case Studies (Part 2 of 2)
Recently, I had the opportunity to speak with Synopsys’ distinguished experts in speed adapters and in-circuit emulation (ICE). Many who know my professional background see me as an advocate for virtual, transactor-based emulation, hence I was genuinely surprised to discover the impressive results achieved by today’s speed… Read More
CMOS 2.0 is Advancing Semiconductor Scaling
In the rapidly evolving landscape of semiconductor technology, imec’s recent breakthroughs in wafer-to-wafer hybrid bonding and backside connectivity are paving the way for CMOS 2.0, a paradigm shift in chip design. Introduced in 2024, CMOS 2.0 addresses the limitations of traditional CMOS scaling by partitioning… Read More
Podcast EP311: An Overview of how Keysom Optimizes Embedded Applications with Dr. Luca TESTA
Daniel is joined by Luca TESTA, the COO and co-founder of Keysom. After studying microelectronics in Italy, Luca obtained his PhD in France while working with STMicroelectronics on analog/RF circuit design.
Dan explores the charter and focus of Keysom with Luca. Luca describes how Keysom is providing an automated and reliable… Read More
CEO Interview with Dr. Bernie Malouin Founder of JetCool and VP of Flex Liquid Cooling
Bernie Malouin is a technical professional with demonstrated experience from concept studies through system deployment. He has a strong track record working in dynamic environments, from highly complex, multi-million dollar development programs to deeply technical research projects. He founded JetCool Technologies … Read More
Webinar – The Path to Smaller, Denser, and Faster with CPX, Samtec’s Co-Packaged Copper and Optics
For markets such as data center, high-performance computing, networking and AI accelerators the battle cry is often “copper is dead”. The tremendous demands for performance and power efficiency often lead to this conclusion. As is the case with many technology topics, things are not always the way they seem. It turns out a lot … Read More



The Quantum Threat: Why Industrial Control Systems Must Be Ready and How PQShield Is Leading the Defense