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Virtual Prototyping With Connection to Assembly

Virtual Prototyping With Connection to Assembly
by Bernard Murphy on 08-31-2017 at 7:00 am

Virtual prototyping has become popular both as a way to accelerate software development and to establish a contract between system/software development teams and hardware development and verification. System companies with their tight vertical integration lean naturally to executable contracts to streamline communication… Read More


12 Myths about Blockchain Technology

12 Myths about Blockchain Technology
by Ahmed Banafa on 08-30-2017 at 12:00 pm

Blockchain, the “distributed ledger” technology, has emerged as an object of intense interest in the tech industry and beyond. Blockchain technology offers a way of recording transactions or any digital interaction in a way that is designed to be secure, transparent, highly resistant to outages, auditable, andRead More


High Bandwidth Memory ASIC SiPs for Advanced Products!

High Bandwidth Memory ASIC SiPs for Advanced Products!
by Daniel Nenni on 08-30-2017 at 7:00 am

When someone says, “2.5D packaging” my first thought is TSMC and my second thought is Herb Reiter. Herb has more than 40 years of semiconductor experience and he has been a tireless promoter of 2.5D packaging for many years. Herb writes for and works with industry organizations on 2.5D work groups and events at conferences… Read More


Why Open and Supported Interfaces Matter

Why Open and Supported Interfaces Matter
by Mitch Heins on 08-29-2017 at 12:00 pm

Back in the early 1980’s during the nascent years of electronic design automation (EDA), I worked at Texas Instruments supporting what would become their merchant ASIC business. Back then, life was a bit different. The challenge we faced was to make our ASIC library available on as many EDA flows as we could to give as many users as… Read More


Analysis and Signoff for Restructuring

Analysis and Signoff for Restructuring
by Bernard Murphy on 08-29-2017 at 7:00 am

For the devices we build today, design and implementation are unavoidably entangled. Design for low-power, test, reuse and optimized layout are no longer possible without taking implementation factors into account in design, and vice-versa. But design teams can’t afford to iterate indefinitely between these phases, so they… Read More


Customizable Analog IP No Longer a Pipe Dream

Customizable Analog IP No Longer a Pipe Dream
by Tom Simon on 08-28-2017 at 12:00 pm

Configurable analog IP has traditionally been a tough nut to crack. Digital IP, of course, now provides for wide configurability for varying applications. In the same way that analog design has remained less deterministic as compared to digital design, analog IP has also tended to be less flexible. However, the tide may be turning… Read More


Bluetooth 5 IP is Ready for SoC Integration

Bluetooth 5 IP is Ready for SoC Integration
by Eric Esteve on 08-28-2017 at 7:00 am

Bluetooth®, WiFi, LTE, and 5G technologies enable wireless connectivity for a range of applications. While each offer unique features and advantages, designers need now to decide which protocol to integrate in a single chip after having test the market by using wireless off-chip solutions. Bluetooth 5 builds upon the success… Read More


Oracle is out of the Chip Business!

Oracle is out of the Chip Business!
by Daniel Nenni on 08-26-2017 at 7:00 am

This is a story I have been tracking for some time now. Oracle is one of the companies I was enamored with early in my career, Sun microsystems as well. They are both legacies here in Silicon Valley, absolutely. I can now confirm that Oracle is getting out of the chip business. Oracle got into the chip business with the $7.4B acquisition… Read More


Semiconductor Reliability and Product Qualification

Semiconductor Reliability and Product Qualification
by Daniel Nenni on 08-25-2017 at 7:00 am

This week, we are continuing our discussion of various topics that Semitracks addresses in their training activities. One area that they focus on quite a bit is Semiconductor Reliability and Product Qualification.

One of the key activities that a Product Engineer will coordinate is the qualification of new products before they… Read More


Samsung, Synopsys and Qualcomm at DAC

Samsung, Synopsys and Qualcomm at DAC
by Daniel Payne on 08-24-2017 at 12:00 pm

I’m a user of many Samsung products as my family has Samsung Galaxy smart phones and my MacBook Pro uses Samsung SSD for storage, so at DAC I attended a breakfast panel with presenters from Samsung, Synopsys and Qualcomm. This was the second day of DAC and they served us breakfast, and with the big names on the panel the room was… Read More