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Engineer Failure Analysis

Engineer Failure Analysis
by Admin on 04-23-2020 at 2:43 pm


  • Perform detailed failure analysis  on IC failures (wafer and package level) using various analytical tools  to identify the root cause of failures and generate reports upon completion of jobs.
  • Layout study and tracing
  • Develop new failure analysis techniques / Methodology to support new failure modes / Defect type
  • Responsible for FA equipment upkeep and housekeeping.
  • Document FA operating procedures, training and certification specs.


  • Degree in Electrical/Electronic Engineering/Physics/Material Science/Chemistry.
  • Experience in operating Electrical Fault isolation tools, SEM, FIB and RIE
  • Strong in hands-on capability in performing physical deprocessing and XFIB including use of chemicals.
  • Good understanding of semiconductor process, device physics and  product knowledge.
  • Highly motivated with strong problem solving analytical skillset
  • Multi-tasking player with strong sense of ownership /responsibility
Apply for job

To view the job application please visit gfoundries.taleo.net.

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