Engineer Failure Analysis

Responsibilities:

• Perform detailed failure analysis  on IC failures (wafer and package level) using various analytical tools  to identify the root cause of failures and generate reports upon completion of jobs.
• Layout study and tracing
• Develop new failure analysis techniques / Methodology to support new failure modes / Defect type
• Responsible for FA equipment upkeep and housekeeping.
• Document FA operating procedures, training and certification specs.

Requirements:

• Degree in Electrical/Electronic Engineering/Physics/Material Science/Chemistry.
• Experience in operating Electrical Fault isolation tools, SEM, FIB and RIE
• Strong in hands-on capability in performing physical deprocessing and XFIB including use of chemicals.
• Good understanding of semiconductor process, device physics and  product knowledge.
• Highly motivated with strong problem solving analytical skillset
• Multi-tasking player with strong sense of ownership /responsibility