Ansys 2024 R2: Enhancing Simulation Accuracy with Materials Intelligence

Online

Learn how you can improve the accuracy of your simulations with high-quality, consistent materials and data information that are seamlessly available within your simulation tools in this upcoming webinar. TIME: SEPTEMBER 10, 2024 11 AM EDT Venue: Virtual Overview Accurate data on materials is fundamental to precise design and simulation. Yet, finding data that you …

Webinar: Powering sustainable and reliable energy distribution with blue GIS

Online

September 17 and 24, 2024, 15:00 - 16:00 (CEST) | Join the webinar live or watch it later on demand Join our engaging webinar series on blue GIS technology, tailored for professionals eager to understand the intersection of technology and sustainable energy systems. Dive into the fundamentals and advanced features of blue GIS, including its …

User2User Mid-Atlantic 2024

Johns Hopkins University Johns Hopkins University, Baltimore, MD, United States

About User2User User2User is your opportunity to learn, grow and connect with fellow technical experts who design leading-edge products using Siemens EDA tools. User2User is focused on these areas: Printed Circuit Board Design & Design for Manufacturing PCB Simulation ASIC & FPGA: Advanced Functional Verification What to expect?  A dedicated environment for exchanging ideas, information, …

DVCon India 2024

Radisson Blu, Marathahalli, Bangalore 90/4, Outer Ring Rd, Marathahalli Village, Marathahalli, Bengaluru, Karnataka, India

On behalf of the DVCon India 2024 steering committee, it is my pleasure to welcome you all to the 9th edition of the Design and Verification Conference in India planned from 18- 19th September 2024 in Bangalore, India. The theme of this year’s conference is “Architecture to Analytics – A2A“. We want to carry forward …

Webinar: Synopsys and Altera, an Intel Company, Present: A Data-Driven Approach to Multi-Die Design Architecture

Online

Abstract: A successful multi-die design begins at the architecture exploration level. However, the architecture challenges are exacerbated for multi-die designs as performance and power need to be optimized across multiple …