Webinar: Multiphysics Simulation of Challenges in 3D IC and Chiplet Designs

Online

Multiple Sessions - All English Language: 14:00 JST (APAC) 10:00 EDT, 16:00 CET (AMER and EUR) Stacking multiple dies with 3D ICs offer enhanced functionality, reduced form factor, and improved interconnect density. However, these advancements come with several challenges, including thermal management issues. Multiphysics suites from Altair assist designers in optimizing thermal management strategies and …

Turbo Expo 2024

ExCeL London Royal Victoria Dock, 1 Western Gateway, London, United Kingdom

Turbomachinery Technical Conference & Exposition Unlocking a Net-Zero Future in Propulsion and Power Make your plans today to join 2,500-plus turbomachinery and propulsion engineering leaders from industry, academia, and government …