This webinar will cover the motivations and benefits of using in-system deterministic test and how using this new technology can become a central part of any SLM strategy.
The semiconductor industry is rapidly adopting 2.5D and 3D multi-die designs as the significant benefits have become clear for applications like HPC, GPU, mobile, and AI/ML. Multi-die design technology has …
Continue reading "Ansys-Synopsys Technology Update: The Latest Advances in Multi-Die Design"
About Event Join us at the Infineon GaN Roadshow stop in San Jose to experience the future of power! This one-day symposium will dive deep into Infineon's Gallium Nitride power …
Learn About: Emerging advanced node design challenges and corresponding design flows and methodologies for A16, N2 and N3 processes Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS®, and SoIC, 3DFabric Alliance, and 3Dblox™ standard, plus innovative 3Dblox-based design enablement technologies and solutions, targeting HPC, AI/ML, and mobile applications Comprehensive design …
Continue reading "TSMC EU OIP Ecosystem Forum (In-Person Event)"
This is a hands-on workshop where the participants will get an opportunity to work with Ansys Medini and perform safety analysis through the Ansys virtual lab. TIME: November 19, 2024 10AM IST to 5PM IST Venue: Virtual Overview Ansys medini analyze is a model-based, integrated tool supporting safety analysis for safety-critical electrical and electronic (E/E) …
With the EE Cockpit in Allegro X System Capture, electrical engineers can run analyses during the schematic design phase without needing complicated analysis setups or specialized models to get meaningful …
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Join us for the Ansys IDEAS India User Conference 2024 — a place to catch up on industry best practices and the latest Semiconductor design advances. IDEAS will explore future trends with keynotes from industry leaders and offer technical insights from expert chip designers from many of the world’s top semiconductor companies. Overview At this …
Learn, Network, and Accelerate Optical Design Innovation For this year’s event, we are excited to be discussing the latest in optical design and simulation, including topics on image simulation with the entire image chain, freeform optics, display technnology, high-performance computing for photonic devices, and other applications using the Optical Solutions suite of tools. More details …
Join experts from Rambus and PUF-based security solutions provider ICTK to learn how Rambus Root of Trust and Secure Authentication solutions combined with ICTK’s PUF technology can provide a highly robust hardware foundation …
Join us for an insightful webinar series, where we explore the rapidly evolving automotive landscape. We will focus on the rise of autonomous and electric vehicles, highlighting key trends such as ADAS, software-defined vehicles, and zonal architectures. Learn how Cadence’s advanced automotive solutions address the increasing compute demands and in-vehicle networking requirements while prioritizing power …
Webinar Summary In this webinar, we will illustrate how Automated AFM can be applied in the most current hybrid bonding technology nodes and wafer processing steps, and its suitability for labs and fabs working on new bonding device design. The following topics will be discussed: Key Automated AFM features for process control in high volume …
Date: Nov. 21, 2024 Time: SIA Reception at 5:00 pm Dinner, Awards Presentations, & Keynote Remarks at 6:30 pm After-Dinner Reception at 8:30 pm Location: Signia by Hilton San Jose 170 S Market St San Jose, Calif.95113 REGISTER HERE
