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Radisson Blu Bengaluru Outer Ring Road
90/4, Dr Puneeth Rajkumar Rd, Marathahalli Village, Marathahalli, Bengaluru, Karnataka, India
PCI-SIG is coming to Bengaluru, India on November 11-12, 2024. Members of the PCI-SIG community including systems architects, designers, engineers, and engineering managers are invited to attend this fantastic event. Overview The PCI-SIG Developers Conferences are free events for our 900+ member companies that develop and bring to market new products utilizing PCI Express® technology. They are an opportunity to learn directly from …
A must for anyone who is entering the medical market of wearables The world's biggest medical trade fair is the hotspot for wearable technologies in the healthcare segment where decision-makers …
Huntsville Marriott at the Space & Rocket Center
5 Tranquility Base, Huntsville, AL, United States
About PAINE Physical inspection of electronics has grown significantly over the past decade and is becoming a major focus for the chip designers, original equipment manufacturers, and system developers. The complex long life of the electronic devices coupled with their diverse applications is making them increasingly vulnerable to various forms of threats and inspection. Large …
SEMICON Europa 2024 is co-located with electronica and will take place in November 12-15, 2024 in Munich, Germany. This year’s theme Innovation and Collaboration: Powering Sustainable Exponential Growth expresses SEMICON Europa support to the European semiconductor ecosystem, highlighting the important role in driving sustainable exponential growth through innovation and strategic collaborations. Only by fostering collaborative efforts, the …
Your benefits as a visitor electronica covers the entire world of electronics. Here you can find high-performance systems and components from the micro- and nano-worlds of semiconductor and micro systems …
McKimmon Center, NC State University
1101 Gorman St, Raleigh, NC, United States
About PCB Carolina Located in Raleigh (map) near Research Triangle Park makes this a prime area for this highly technical conference on electronics. There will be 16 technical sessions, a keynote address, a vendor exhibition with over 70 companies participating, food throughout the day, and best of all, this event is FREE to all attendees. This is the place to …
With the increasing complexity and importance of memories in modern ICs, there is a clear need for specialized tools and techniques for the design and verification of embedded memory blocks. Traditional methods like SPICE simulation and cell-based formal verification have limitations; SPICE offers circuit-level accuracy but limited coverage, while cell-based methods can't fully represent transistor-level …
With the increasing complexity and importance of memories in modern ICs, there is a clear need for specialized tools and techniques for the design and verification of embedded memory blocks. Traditional methods like SPICE simulation and cell-based formal verification have limitations; SPICE offers circuit-level accuracy but limited coverage, while cell-based methods can't fully represent transistor-level …
Hyatt Regency Beijing Wangjing
8 Guangshun South Street, Beijing, China
The TSMC Open Innovation Platform® Ecosystem Forum is a unique event that brings together the semiconductor design community and TSMC customers. The OIP Forum will feature multi-track technical presentation sessions along …
KnowMade will be attending the SEMICON Europa 2024 Conference in Munich, where Dr. Pauline Calka will present a poster on the Leading Patent Owners & New Entrants in Advanced Packaging. She will be available in the networking area on the day of the Advanced Packaging Conference (Wednesday, November 13) to share the latest insights on …
Chiplets and Heterogenous Integration: The Next Frontier in Performance and Efficiency Innovation and Collaboration: New types of Neural Networks (Large Language Models), such as ChatGPT and other text generator, as well as Artificial Intelligence (AI) applications of different kind, are pushing the demands for High Performance Computing (HPC) to new levels. Chiplets, Heat Dissipation, Miniaturization, …
