TSMC Open Innovation Platform® Ecosystem Forum 2024 – China

Hyatt Regency Beijing Wangjing 8 Guangshun South Street, Beijing, China

The TSMC Open Innovation Platform® Ecosystem Forum is a unique event that brings together the semiconductor design community and TSMC customers. The OIP Forum will feature multi-track technical presentation sessions along with an Ecosystem Pavilion. The Forum provides an ideal venue to build relationships with TSMC customers. We have set the dates for our 2024 global …

Supercomputing 2024 (SC24)

Georgia World Congress Center 285 Andrew Young International Blvd NW, Atlanta, GA, United States

Program Each year, SC provides the leading technical program for professionals and students in the HPC community, as measured by impact, at the highest academic and professional standards. The Program …

Automotive Computing Conferences 2024

Munich, Germany

WELCOME TO OUR AUTOMOTIVE COMPUTING CONFERENCES (ACC) in 2024 We are excited to explore the transformation of classic vehicles into modern, software-defined vehicles and IoT devices. As the automotive industry evolves, the vehicles of the future demand top-notch computing performance, powerful control units, and adherence to increasingly stringent standards. We face various challenges such as …

Defect-Based Testing

Munich, Germany

Semiconductor and integrated circuit developments continue to proceed at an incredible pace. For example, today's application-specific ICs and microprocessors can contain upwards of 100 million transistors. Traditional testing relies on …

Webinar: Accelerating Complex RF Filter Design With AI-Powered Optimization

Online

Join us for this webinar to explore how Ansys SynMatrix, powered by AI-driven automation and HFSS integration, is transforming RF filter design by streamlining workflows, optimizing performance, and accelerating time-to-market. TIME: November 19, 2024 8am PST Venue: Virtual Overview RF engineers face increasingly complex design challenges. Higher operating frequencies, stringent performance requirements, and manufacturability hurdles …